• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 춘계학술강연 및 발표대회강연 및 발표논문 초록집
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• pp.68-68
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• 2006

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2000년도 춘계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.25-25
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• 2000

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1106-1106
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• 2006

• 한국건설순환자원학회지
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• 제8권3호
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• pp.25-29
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• 2013

• Advances in materials Research
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• 제2권1호
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• pp.37-49
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• 2013

The transition metal salt doped solid polymer electrolyte [TSPE] were prepared with HPMC as a host polymer. The virgin and doped films were prepared by solution-casting method and investigated using wide angle X-ray scattering method. Micro structural parameters like lattice strain (g%), stacking/twin faults, the average number of unit cells counted in a direction perpendicular to the Bragg's plane (hkl) spacing of (hkl) planes dhkl, crystallite size Ds, distortion width, standard deviation were determined by whole pattern powder fitting (WPPF) method, which is an extension of single order method. It is found that the crystallite size decreases with the increase in the content of $FeCl_3$. This decrease is due to increase in localized breaking of polymer network which also accounts for the amorphous nature of the material. The filler inorganic salt $FeCl_3$ acts as plasticizer. FTIR study also confirms and justifies the interaction between the polymer and in-organic salt in the matrix. Physical properties like mechanical stability and Ac conductivity in these films are in conformity with the X-ray results.

• 한국재료학회지
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• 제30권2호
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• 한국분말재료학회지
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• 제25권6호
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• pp.501-506
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• 2018

With the recent remarkable improvements in the average speeds of contemporary trains, a necessity has arisen for the development of new friction modifiers to improve adhesion characteristics at the wheel-rail interface. The friction modifier must be designed to reduce slippage or sliding of the trains' wheels on the rails under conditions of rapid acceleration or braking without excessive rolling contact wear. In this study, a novel composite material consisting of metal, ceramic, and polymer is proposed as a friction modifier to improve adhesion between wheels and rails. A blend of Al-6Cu-0.5Mg metallic powder, $Al_2O_3$ ceramic powder, and Bakelite-based polymer in various weight-fractions is hot-pressed at $150^{\circ}C$ to form a bulk composite material. Variation in the adhesion coefficient is evaluated using a high-speed wheel-rail friction tester, with and without application of the composite friction modifier, under both dry and wet conditions. The effect of varying the weighting fractions of metal and ceramic friction powders is detailed in the paper.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 추계 학술발표회 제17권2호
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• pp.803-806
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• 2005

The effect of coating method and binder content on the tensile adhesion strength, water absorption and cl- penetration depth of polymer-modified pastes using redispersible polymer powders and ceramic powder are examined. As a result, the tensile adhesion strength of the polymer-modified pastes tend to increase with increasing binder content and: number of coating. The water absorption and cl- penetration depth of the polymer-modified pastes tend to decrease with increasing binder content and number of coating.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2001년도 학술논문발표회
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• pp.88-92
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• 2001

This paper discusses the strength properties of the polymer-modified mortars using redispersible polymer powders, which is widely used for the manufacture of prepackaged-type polymer-modified mortar products at present. The polymer-modified mortars using redispersible polymer powders are prepared with various polymer-cement ratios, and tested for air content, flexural and compressive strengths, and tensile strength. The strength properties are almost the same as those of polymer dispersion-modified mortars, depending on the polymer-cement ratios, and are improved over unmodified mortar. In particular, between tensile strength and glass transition point of polymer powder have a high correlation. It is concluded from the test results that polymer-modified mortars using redispersible polymer powders can be used in the same manner as ordinary polymer dispersion-modified mortars.

• 한국세라믹학회지
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• 제40권12호
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• pp.1183-1188
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• 2003

LCP(Liquid Crystal Polymer)와 BT(BaTiO$_3$) 복합체를 LCP varnish와 BT 슬러리를 혼합하여 제조하고, BT 슬러리 내에서 BT 입자의 분산 특성과 LCP-BT 복합체의 조성 및 BT 분말 크기가 유전 특성에 미치는 영향에 대하여 연구하였다. 분말 크기가 다른 BT 분말에 대하여 분산제 GLYMO(3-glycidyloxypropyltrimethoxysilane) 첨가량에 따른 용매 ODBZ(o-dichlorobenzene) 내에서의 분산 특성을 측정한 결과, BT분말 크기가 증가할수록 비표면적의 감소로 인하여 소요되는 최적 분산제의 양이 감소하였다. 분산된 BT슬러리를 LCP와 혼합하고 테잎 케스팅법을 이용하여 LCP-BT복합체를 제조하였다. BT 입자의 크기가 100nm에서 500nm로 증가함에 따라 복합체의 유전 상수는 34.3에서 44.1로, 유전 손실은 0.05 에서 0.063으로 증가하였다.