• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.1197-1198
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• 2012

• Bulletin of the Korean Chemical Society
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• v.33 no.12
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• pp.3937-3938
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• 2012

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.116-119
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• 2004

In this paper, we have improved a novel (ECB) mode using tilt angle in the unique condition by hot-plate equipment. The new control of tilt angle for nematic liquid crystal (NLC) with negative and positive dielectric anisotropy on the rubbed homeotropic polyimide (PI) using baking method by Hot-plate equipment was investigated. LC tilt angle decreased with increasing baking temperature and time. Especially, the low LC tilt angle of positive type NLC $({\Delta}n>0)$ on the rubbed homeotropic PI surface by increasing temperature and time was measured. The EO characteristics of the novel ECB mode using control of tilt angle on the homeotropic surface than that of conventional OCB cell can be improved. We suggest that the developed the Novel ECB cell using control of tilt angle on the homeotropic surface is a promising technique for the achievement of a fast response time and a high contrast ratio.

• Textile Coloration and Finishing
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• v.35 no.2
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• pp.121-127
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• 2023

In this study, a comprehensive investigation was conducted on the morphological and property changes of laser-induced nanocarbon (LINC) as a function of laser process parameters. LINC was formed on the surfaces of polyimide films with different backbone structures under various process conditions, including laser power, scan speed, and resolution. Three different forms of LINC electrodes (i.e., continuous 3D porous graphene, wooly nanocarbon fibers, line cut) were formed depending on the laser power and scan speed. Furthermore, heteroatom doping induced from the chemical structure of the polyimide during laser patterning was found to be effective in modifying the electrical properties of LINC electrodes. The LINC surfaces exhibited different microstructures depending on the laser beam resolution under constant laser power and scan speed, allowing for controllable surface wettability. The correlation between the chemical structure of the polymer substrate, laser process parameters, and carbonized surface properties in this study is expected to be utilized as fundamental understanding for the manufacturing of next-generation carbon-based electronic devices.

• Carbon letters
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• v.13 no.2
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• pp.121-125
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• 2012

In the present work, exfoliated graphite nanoplatelets (EGN) of 1 ${\mu}m$ in average particle size, which were prepared by heating at $900^{\circ}C$ and then subjected to ultrasonic, ball-milling, and vibratory ball-milling techniques, were uniformly incorporated into phenylethynyl-terminated polyimide (PETI-5) resin. The fracture surface morphology and the electrical resistivity of the EGN/PETI-5 composites were investigated. The results showed that the fracture surfaces and the electrical resistivity strongly depended on the EGN content. The fracture surfaces became more ductile and roughened with increasing EGN and the electrical resistivity was gradually decreased with increased EGN loading, indicating the percolation threshold at 5 wt% EGN.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.350-353
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• 2001

Aligning capabilities for nematic liquid crystal (NLC) using a in-situ photodimerization method on various photo-crosslinkable polyimide (PI) based polymer and blending photopolymer surfaces were stuided. High pretilt angle of the NLC can be measured by obliquely polarized UV exposure on a photo-crosslinkable polyirnide based polymer surface containing biphenyl (BP), decyl (de), and cholesteryl (chol) group, respectively, However, the low pretilt angle of the NLC was measured by obliquely polarized UV exposure on the blending photopolymer (PI and cinnamate materials) surfaces. Consequently, the pretilt angle of the NLC generated on the photo-crosslinkable polyimide based polymer surfaces using the in-situ photodimerization method was higher than that of the blending photopolymers.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1546-1548
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• 1997

We investigated microhardness, friction, wear and wettability of polyimide for finding out the influence of ion implantation on surface properties. For increasing doses microhardness increased. A reduction of the friction coefficient was most cases correlated with a reduction of wear. The contact angles of water for $B^+$, $N^+$ implanted polyimide decreased from $76^{\circ}$ to zero, as the fluences increased energy of 50, 200 keV.

• Journal of Surface Science and Engineering
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• v.29 no.3
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• Journal of Surface Science and Engineering
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• v.38 no.2
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• pp.49-54
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• 2005

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.