• The Korean Journal of Ceramics
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• 제1권2호
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• pp.91-95
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• 1995

Polycrystalline bismuth- and aluminum- substituted dysporsium and yttrium iron garnet (Bi2R3-xAlyFe5-yO12, R=Dy or Y, $0\leqx\leq3, \; 0\leqy\leq3$) films have been prepared by pyrolysis. The crystallization temperatures, the solubility limit of bismuth ions into the garnet phase, and magnetic and magneto-optic properties of the films have been investigated as a function of bismuth and aluminum concentration. It was found that the crystallization temperatures as a function of bismuth and aluminum concentration. It was found that the crystallization temperatures of these films rapidly decreased as bismuth concentration. It was found that the crystallization temperatures of these films rapidly decreased as bismuth concentration (x) increased up to x=1.5 and then remained temperatures of these films rapidly decreased as bismuth concentration (x) increased up to x=1.5 and then remained unchanged at x>1.5, whereas, showed no changes as aluminum concentration (y) increased up to y=1.0 and then gradually increased at y>1.0. The solubility limit of bismuth ions was x=1.8 when y=0 but increased to x=2.3 when y=1.0. It was demonstrated that the magnetic and magneto-optic properties of the dysprosium iron garnet films could be tailored by bismuth and aluminum substitution suitable for magneto-optic recording as follows. The saturation magnetization and coercivity data obtained for the films indicated that the film composition at which the magnetic compensation temperature became room temperature was y=1.2 when x=1.0. Near this composition the coercivity and the squareness of the magnetic hysteresis loop of the films were several kOe and unit, respectively. The Curie temperatures of the films increased with the increase of x but decreaed with the increase of y, and was 150-$250^{\circ}C$ when x=1.0 and y=0.6-1.4. The Faraday rotation at 633 nm of the films increased as x increased but decreased as y increased, and was 1 deg/$\mu\textrm{m}$ when x=1.0 and y=1.0. Based on the data obtained, the appropriate film composition for magneto-optic recording was estimated as near x=1.0 and y=1.0 or $BiDy_2AlFe_4O_{12}$.

• Korean Chemical Engineering Research
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• 제44권5호
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• pp.513-519
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• 2006

본 연구에서는 유리(glass)와 석영(quartz)을 재질로 사용하여 MEMS(micro-electro mechanical systems) 공정을 통해 전기영동(electrophoresis)을 위한 microchip을 제작하였다. UV 광이 실리콘(silicon)을 투과하지 못하는 점에 착안하여, 다결정 실리콘(polycrystalline Si, poly-Si) 층을 채널 이외의 부분에 증착시킨 광 차단판(optical slit)에 의해 채널에만 집중된 UV 광의 신호/잡음비(signal-to-noise ratio: S/N ratio)를 크게 향상시켰다. Glass chip에서는 증착된 poly-Si 층이 식각 마스크(etch mask)의 역할을 하는 동시에 접합표면을 적절히 형성하여 양극 접합(anodic bonding)을 가능케 하 였다. Quartz 웨이퍼에 비해 불순물을 많이 포함하는 glass 웨이퍼에서는 표면이 거친 채널 내부를 형성하게 되어 시료용액의 미세한 흐름에 영향을 미치게 된다. 이에 따라, HF와 $NH_4F$ 용액에 의한 혼합 식각액(etchant)을 도입하여 표면 거칠기를 감소시켰다. 두 종류의 재질로 제작된 채널의 형태와 크기를 관찰하였고, microchip electrophoresis에 적용한 결과, quartz과 glass chip의 전기삼투 흐름속도(electroosmotic flow velocity)가 0.5와 0.36 mm/s로 측정되었다. Poly-Si 층에 의한 광 차단판의 존재에 의해, peak의 S/N ratio는 quartz chip이 약 2배 수준, glass chip이 약 3배 수준으로 향상되었고, UV 최대흡광 감도는 각각 약 1.6배 및 1.7배 정도 증가하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.

• 대한전자공학회논문지SD
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• 제45권7호
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• pp.32-36
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• 2008

본 연구에서는 펄스 레이저 법으로 200 mTorr 의 산소 분압에서 기판 온도를 $200^{\circ}C$ 에서 $600^{\circ}C$ 까지 변화시켜 가며, quartz 기판 위에 $In_2O_3-ZnO$ 박막을 제작하여 광학적 및 전기적 특성을 조사하였다. XRD 측정을 통해 $In_2O_3-ZnO$ 박막이 다결정 상태인 것을 알 수 있었으며, 기판 온도가 $500^{\circ}C$로 증가함에 따라 $35.5^{\circ}$ 부근의 $In_2O_3$ (400) 피크는 감소한 반면 $30.6^{\circ}$ 부근의 $In_2O_3$ (222) 피크는 증가했다. 박막의 표면을 AFM 으로 조사한 결과, round type 의 결정립들이 관찰되었으며 표면 거칠기 값은 $500^{\circ}C$에서 제작한 박막에서 가장 낮은 값 (6.15 nm) 을 나타내었다. 모든 $In_2O_3-ZnO$ 박막이 가시광 영역에서 평균 82% 이상의 투과율을 보였다. 또, $500^{\circ}C$에서 제작한 $In_2O_3-ZnO$ 박막에서 가장 높은 캐리어 농도 ($2.46{\times}10^{20}cm^{-3}$) 값과 가장 낮은 비저항 ($1.36{\times}10^{-3}{\Omega}cm$) 값을 나타내었다.

• 한국자기학회지
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• 제15권3호
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• pp.167-171
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• 2005

다결정질 $La_{1/3}Sr_{2/3}FeO_{2.96}$의 전하불균형(charge disproportionation, CD) 전이현상과 그 전이온도를 전후로 한 자기적 상호작용의 변화양상을 X-선 회절, $M\ddot{o}ssbauer$ 분광계, 그리고 SQUID 자기력계를 이용하여 연구하였다. X선 분석결과, 시료의 결정구조는 공간군 R/3c인 rhombohedral 구조이며, 격자상수는 $a_{R}=5.4874\;\AA,\;a_R=60.07^{\circ}$이었다. $M\ddot{o}ssbauer$ 스펙트럼은 4.2 K에서부터 실온까지의 범위에서 취하였다 분석결과 저온에서는 각각 $Fe^{3+}$와 $Fe^{5+}$에 기인하는 두개의 6-선 스펙트럼이 중첩되어 나타났으며 Fe 이온의 원자가가 두개의 상이한 전하 상태로 분리된 반강자성 혼합원자가 상태임을 알 수 있었다. 반면 고온에서는 $Fe^{3.6+}$에 기인하는 단일 흡수선이 관측되어 상자성의 평균원자가 상태임을 알 수 있었다. 175K부터 200K의 온도 범위에서는 이 두 상태가 혼재되어 나타났으며 이 온도 범위에서 CD전이가 발생함을 알 수 있었다. CD전이의 근원은 열적으로 발생한 전하의 도약현상으로 설명할 수 있었다. 측정된 자기이력곡선의 분석 결과, 자성원자 사이에는 강한 반강자성 상호작용이 존재하며, 온도가 CD 전이온도를 넘어 상승하면서 $Fe^{3+}-Fe^{5+}$간의 상호작용이 한층 더 강한 상호작용으로 대치됨을 알 수 있었다.

• 한국자기학회지
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• 제12권2호
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• pp.41-45
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• 2002

졸-겔법으로 제조된 La/sub 0.7/Pb/sub 0.3/MnO₃(LPM)박막의 기판 효과에 따른 저 자장 영역에서의 터널형 자기저항 효과에 대하여 연구하였다. 다결정 LPMO 박막은 SiO₂/Si(100) 기판과 그 위에 확산 방지막(diffusion barrier)으로 안정화 지르코니아(yttria-stabilized zirconia, YSZ) 중간층을 도입한 기판에 증착하였으며, 반면에 c-축 방향 성장을 갖는 박막의 경우 LaA1O₃(001) (LAO) 단결정 기판을 사용하였다. LPMO/LAO 박막에서의 rocking curve 측정 결과 full width half maximum (FWHM) 값은 0.32°값을 가짐을 알 수 있었다. 상온(300 K)에서 측정한 자기저항비(MR ratio) 값은 500 Oe리 외부자장을 인가시 LPMO/SiO₂/Si 박막의 경우 0.52%, LPMO/YSZ/SiO₂/Si 박막인 경우는 0.68% 그리고, LPMO/LAO의 경우에는 0.4%에도 미치지 못하는 값을 가졌다. 이때 MR최대값을 나타내는 peaks는 자기이력 곡선의 보자력 부근에서 나타남으로 그 두 결과가 잘 일치함을 보여 주고 있다. 이러한 저 자장 영역에서의 자기저항 값의 타이는 박막 시료의 기판 효과에 의한 grain boundary특성의 차이로부터 기인된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.211-211
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• 1999

Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.122-122
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• 1999

Graphite with its advantages of high thermal conductivity, low thermal expansion coefficient, and low elasticity, has been widely used as a structural material for high temperature. However, graphite can easily react with oxygen at even low temperature as 40$0^{\circ}C$, resulting in CO2 formation. In order to apply the graphite to high temperature structural material, therefore, it is necessary to improve its oxidation resistive property. Silicon Carbide (SiC) is a semiconductor material for high-temperature, radiation-resistant, and high power/high frequency electronic devices due to its excellent properties. Conventional chemical vapor deposited SiC films has also been widely used as a coating materials for structural applications because of its outstanding properties such as high thermal conductivity, high microhardness, good chemical resistant for oxidation. Therefore, SiC with similar thermal expansion coefficient as graphite is recently considered to be a g행 candidate material for protective coating operating at high temperature, corrosive, and high-wear environments. Due to large lattice mismatch (~50%), however, it was very difficult to grow thick SiC layer on graphite surface. In theis study, we have deposited thick SiC thin films on graphite substrates at temperature range of 700-85$0^{\circ}C$ using single molecular precursors by both thermal MOCVD and PEMOCVD methods for oxidation protection wear and tribological coating . Two organosilicon compounds such as diethylmethylsilane (EDMS), (Et)2SiH(CH3), and hexamethyldisilane (HMDS),(CH3)Si-Si(CH3)3, were utilized as single source precursors, and hydrogen and Ar were used as a bubbler and carrier gas. Polycrystalline cubic SiC protective layers in [110] direction were successfully grown on graphite substrates at temperature as low as 80$0^{\circ}C$ from HMDS by PEMOCVD. In the case of thermal MOCVD, on the other hand, only amorphous SiC layers were obtained with either HMDS or DMS at 85$0^{\circ}C$. We compared the difference of crystal quality and physical properties of the PEMOCVD was highly effective process in improving the characteristics of the a SiC protective layers grown by thermal MOCVD and PEMOCVD method and confirmed that PEMOCVD was highly effective process in improving the characteristics of the SiC layer properties compared to those grown by thermal MOCVD. The as-grown samples were characterized in situ with OES and RGA and ex situ with XRD, XPS, and SEM. The mechanical and oxidation-resistant properties have been checked. The optimum SiC film was obtained at 85$0^{\circ}C$ and RF power of 200W. The maximum deposition rate and microhardness are 2$mu extrm{m}$/h and 4,336kg/mm2 Hv, respectively. The hardness was strongly influenced with the stoichiometry of SiC protective layers.

• 한국진공학회지
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• 제6권3호
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• pp.235-241
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• 1997

실리콘 기판위에 초고진공 Ionized Cluster Beam(UHV-ICB)증착법으로 적층 성장시 킨 $Y_2O_3$ 박막의 결정성 및 구조를 Backscattering Spectroscopy(BS)/channeling을 이용하여 분석하였다. 현재까지 타증착법에 의해 성장된 $Y_2O_3$박막의 channeling 최소수율은 0.8~0.95 로 거의 비정질이거나 다결정이었다. 이에 반해 UHV-ICB법으로 Si(100), Si(111) 기판 위에 적층 성장시킨 $Y_2O_3$ 박막의 channeling 최소수율은 각각 0.28, 0.25로 UHV-ICB법으로 성장 시킨 $Y_2O_3$박막이 타증착법으로 성장시킨 박막보다 상대적으로 우수한 결정성을 지니고 있 었다. 또한 실리콘 기판의 방향에 관계없이 $Y_2O_3$박막의 표면 영역이 계면 영역보다 결정성 이 좋았다. Si(111) 위에 적층 성장한 Y2O3박막은 실리콘 결정과 $0.1^{\circ}$어긋나서 (111)면으로 성장하였고, Si(100) 위에 적층 성장한 $Y_2O_3$박막은 실리콘 결정과 평행하게 double domain 구조를 지닌 (110)면으로 성장하였다. 산소공명 BS/channeling 결과 Si(111) 위에 적층 성장 한 $Y_2O_3$박막의 산소는 결정성을 갖고 있으나 Si(100) 위에 적층 성장한 $Y_2O_3$박막의 산소는 random하게 분포하고 있음을 확인하였다.

• 한국결정성장학회지
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• 제26권4호
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• pp.159-163
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• 2016

본 연구에서는 간단 고상합성법(solid state reaction method)을 이용하여 $Yb^{3+}$, $Er^{3+}$ 이온이 동시도핑된 $NaGd(MoO4)_2$ ($NaGd(MoO_4)_2:Yb^{3+}/Er^{3+}$)를 성공적으로 합성하였으며, 결정구조 및 광학적 특성을 면밀히 분석하였다. 980nm의 근적외선 레이저를 합성된 NaGd(MoO4)2 파우더에 조사하였을 때 $NaGd(MoO_4)_2:Yb^{3+}/Er^{3+}$ 분말은 540 및 550 nm 부근에서 강한 녹색 발광과 함께 650 및 670 nm 부근에서의 매우약한 적색 발광을 하였으며 이러한 업컨버젼 발광 현상은 $Er^{3+}$ 이온 내의 infra 4f transition에 의한 현상임을 확인할 수 있었다. 또한, $Yb^{3+}$ 및 $Er^{3+}$ 이온의 최적 도핑 농도는 각각 (10.0/10.0 mol%)로 확인되었으며, 그에 따른 upconversion 발광 메커니즘에 대하여 상세히 논의하였다.