• KSBB Journal
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• v.15 no.5
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• pp.537-540
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• 2000

In developing a HPLC purification process, it was hoped that a single chromatographic system would be sufficient to abtain pure paclitaxel in high yield. However, no such system was found, due in part to the complex taxoid profile of crude paclitaxel and to the rigorous nature of the product specification. A two step HPLC purification was adopted using reverse-phase separation on C(sub)18 as a first step, and normal-phase separation on silica as the final polishing step. Impurity profiles were established and maintained for paclitaxel, which identified and quantified each impurity observed in purified paclitaxel from these two steps, all impurities at or above 0.1% were identified. Results provide information for improving the quality control of paclitaxel production.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.166-169
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• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.33 no.3
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• pp.287-291
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• 1988

These studies were carried out to find out the polishing properties and cooking quality of the cut-polished barley. Naked barley, Youngsanbori which was produced in Chonnam province, Korea in 1981, was applied for this experiment. Polished barley was produced by the conventional method and cut-barley was manufactured by the method established by Wheat and Barley Research Institute. The yield of cut-polished barley was 68.2% and that of conventionally polished barley was 70.1 %. The ratio of length to width was 2.88 in cut-polished barley and that of conventionally polished barley was 1.36. And weight of 1,000 kernel was 9.5g in cut-polished barley and 18.5g in conventionally polished barley. Energy consumption was found to be 91.1kW/1,000kg in conventionally polished barley and 105kW/1,000kg in cut-polished barley. Whiteness, water uptake ratio and expanded volume of cooked barley were 45.5, 225.7 and 283% in conventionally polished barley and 49.5, 312.7 and 318% in cut-polished barley, respectively.