• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.313-316
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• 2004

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics(ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.188-191
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry. In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

• 한국정밀공학회지
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• 제21권7호
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권4호
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• pp.153-158
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• 2003

This thesis deal with ferroelectric and ferromagnetic materials. PZT/Ferrite ceramics were made by the making process using PZT powder and garnet ferrite powder. PZT and ferrite are mixed as much 90%-10%, 50%-50%, and so on. After making samples, we are polishing samples until thickness is 0.1~0.2mm. We measured all kinds of samples in room temperature and applied magnetic field from -4500 to 4500 Oersted and conducted test of magnetical and electrical measurement using VSM and lpC resolution electrometer calibrated with RT66A pulsed tester. From this measurement, we can calculate tunability of these samples using C value obtained from P-E loop. As a result, it was able to measure magnetic characteristic when two matter had each other component ratio, and it was compound. However, it confirmed the possibility that was able to have ferroelectric characteristic with you in PZT 90% and ferrite 10%. Therefore, If this thing comes for PZT 50% and ferrite 50% have ferroelectric characteristic as him in a compound sample ore, can use this in an oscillator, supersonic waves detector in addition to a piezoelectric element. It may contribute to multipurpose of an element and demands such as a miniaturization of equipment, efficiency, reduce of a price which can use a characteristic of two components.

• Restorative Dentistry and Endodontics
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• 제16권2호
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• pp.18-32
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• 1991

The purpose of this study was to observe characteristic properties of amalgam through the polarization curves and SEM images from 4 type amalgams (Amalcap, Shofu spherical. Dispersalloy and Tytin) with 3 different surface finish procedures (polishing, burnishing and carving) by using the potentiostats (EG & GPARC) and SEM (Jeol JSM-35). After each amalgam alloy and Hg was triturated as the direction of the manufacturer by means of mechanical amalgamator (Samki), the triturated mass was inserted into the cylndrical metal mold which was 12 mm in diameter and 10 mm in height and was pressed with $100kg/cm^2$. 4 specimens of each type amalgam were burnished with egg burnisher and another 4 specimens of each type amalgam were carved with Hollenback carver. Above 8 specimens and remaining untreated 4 specimens were stored at room temperature for about 7 days. Untreated 4 specimens of each type amalgam were polished with abrasive papers (Deer) from #400 to #1200 and finally on the polishing cloth with $0.5{\mu}m$ and $0.06{\mu}m$ $Al_2O_3 $ powder suspended water. Anodic polarization measurements was employed to compare the corrosion behaviours of the amalgams in 0.9% saline solution at $37^{\circ}C$. The open circuit potential was determined after 30 minutes immersion of specimen in electrolyte. The scan rate was 1 mV/sec and the surface area of amalgam exposed to the solution was $0.64cm^2$ for each specimen. All the potentials reported are with respect to a saturated calomel electrode (SCE). SEM images of each specimen were taken after + 800 mV (SCE) polarization. The results were as follows: 1. The corrosion potential of high copper amalgam was more anodic than that of low copper amalgam. 2. The polished amalgam were more resistant to corrosion than any other burnished and carved amalgam. 3. In the case of polishing, current density of high copper amalgam was lower than that of low copper amalgam.

• 분석과학
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• 제19권5호
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• pp.394-399
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• 2006

본 연구에서는 반도체 웨이퍼 연마 공정에 사용한 산화제와 첨가제의 연마 속도에 미치는 영향과 전기 화학적 특성에 대해 조사하였다. 산화제로는 과산화수소, 질산화 철과 요오드산 칼륨을 사용하였으며, 이들은 연마액의 pH와 종류에 따라 텅스텐 막질에서 상이한 산화반응을 나타내었다. 이러한 차이점은 연마성능에 영향을 끼치며, 과산화수소는 식각반응이 질산화 철과 요오드산 칼륨에서는 부동태 반응이 우세하였다. 그리고 염기성 화합물인 TMAH와 KOH를 연마액에 첨가하였을 때 텅스텐에 대한 전위 에너지 변화 증가 및 연마 제거속도 증가를 확인할 수 있었으며, 제타 전위 값의 절대 값 증가를 통해 분산성 향상에도 도움이 되는 것을 알 수 있었다. 마지막으로 음이온 계면 활성제중 평균 분자량이 25만인 폴리아크릴산을 100 ppm 첨가시 연마 입자의 뭉침 현상이 줄어들면서 분산성 향상에 효과적인 것을 알 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 비파괴검사학회지
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• 제25권2호
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• pp.127-132
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• 2005

광학기기용 렌즈는 결함이 없는 높은 형상정밀도가 요구되어지는 제품으로써 본 논문에서는 공명초음파 분광법을 이용하여 결함을 검출하는 시험을 하였다. RUS는 시험편을 가진 시켜 양품시험편과 결함을 갖는 시험편 사이의 공진주파수 차를 검사하는 측정시스템이다 RUS를 이용한 비파괴 평가를 위하여 우리는 구면렌즈와 비구면 렌즈의 공진주파수를 측정하였다. 그 결과, 우리는 측정된 공진주파수에 의해 구면렌즈의 연마 가공정도를 알 수 있었으며, 결함을 갖는 비구면 렌즈의 특성평가를 할 수 있었다.

• 한국식품저장유통학회:학술대회논문집
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• 한국식품저장유통학회 2003년도 제23차 추계총회 및 국제학술심포지움
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• pp.46-50
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• 2003

In order to develop a new variety of rice that adapts to the climate of Aomori prefecture and possesses characteristics suitable for production of high quality Japanese sake, artificial cross experiments were executed between Yamadanishiki, which is widely used nationwide as an authentic variety of rice for sake production, and Hanafubuki, which was peviously developed by Aomori prefecture. An excellent hybrid, named Hanaomoi, was selected and fixed by a series of selection experiments and systematic cultivation. Unpolished Hanaomoi rice contained less amount of protein than Yamadanishiki and Hanafubuki. Unpolished rice of Hanaomoi was harder than Yamadanishiri and Hanafubuki, therefore polishing treatment was done in high yield and one could obtain a high degree of polish on the rice(namely 40% polishing). These features are advantageous to production of high quality of sake.Test brewing using 40% polished Hanaomoi gave rise to a characteristic sake that contained a slightly higher amount of alcohol and flavor components than Yamadanishiki and Hanafubuki. Sensory tests concluded that sake from Hanaomoi was as superior as the one from authentic Yamadanishiki. Hanaomoi is a promising variety of rice suitable for production of a high quality sake exclusive to Aomori prefecture.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.49-49
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• 2007

최근 반도체 소자의 고집적화와 나노 (nano) 크기의 회로 선폭으로 인해 기존에 사용되었던 텅스텐이나 알루미늄 금속배선보다, 낮은 전기저항과 높은 electro-migration resistance가 필요한 Cu 금속배선이 주목받게 되었다. 하지만, Cu CMP 공정 시 높은 압력으로 인하여 low-k 유전체막의 손상과 디싱과 에로젼 현상으로 인한 문제점이 발생하게 되었다. 본 논문에서는, $KNO_3$ 전해액의 농도가 Cu 표면에 미치는 영향을 알아보기 위해 Tafel Curve와 CV (cyclic voltammograms)법을 사용하여 전기화학적 특징을 알아보았고 scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray Diffraction (XRD) 분석을 통해 금속표면을 비교 분석하였다.