• 한국의류산업학회지
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• 제10권3호
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• pp.385-388
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• 2008

Four kinds of PET fabrics were coated with Copper and Nickel by electroless chemical plating, and the electromagnetic wave shielding effectiveness for those samples have been examined. The shielding effectiveness showed between 90 dB and 70 dB, and it related to the fabric structure, such as cover factor and cloth density. The dense fabric structure showed the better shielding effect.

• 한국표면공학회지
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• 제41권1호
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• 한국표면공학회지
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• 제15권1호
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• pp.24-38
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• 1982

The Objective of this study is to analyze structural and operational aspects of the govern-ment, its associations, industries and academic associations related to metal-plating industry, and thereby recommend ways of promotion of subsector, which is yet to be developed. Stages for the implementation are proposed as follows. 1) Stage One: Preparation for formation of proper atmosphere. ⅰ) Clearance of unlicenced metal-plating factories. ⅱ) Strengthening of functions of the association. ⅲ) Provision of incentives through the tax system. 2) Stage-Two : Modernization and maturity ⅰ) Introduction of system for indicating quality of products. ⅱ) Implementation of joint and cooperative-based programs ⅲ) Technical advancement of the closed system and anti-pollution treatment. 3) Stage Three : Settlement ⅰ) Systematic use of statistics and information. ⅱ) Standardization of quality of the products.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.445-449
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of $MoS_2$ particles of the composite coating was investigated. To improve the lubrication of mold, $Cr-P-C/MoS_2$ composite plating was studied by varying the $MoS_2$ content. The current efficiency of the composite plating incorporated $MoS_2$ particles was increased at $MoS_2$ contents of 0.5 and 1.0 g/l due to the incorporation of fine particles. On the other hand, when the content of $MoS_2$ is 1.0 g/l or more, the current efficiency is lowered due to an increase in impact on the cathode surface. In order to evaluate the mechanical properties of Scratch test were conducted. Scratch test confirmed the lubricity and abrasion resistance characteristics revealed that the composite plating with added $MoS_2$ had relatively low surface roughness and uniform surface modification to improve its properties.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.1-2
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• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• 청정기술
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• 제9권2호
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• pp.63-69
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• 2003

도금산업은 제조 공정상 다량의 환경오염물질을 배출하는데 일반적으로 산 알칼리 폐수 뿐만아니라 크롬화합물, 시안화합물, 중금속류, 부식성물질, 독성물질 등이 발생하여 환경오염을 초래한다. 본 연구에서는 도금 산업에서 가장 환경오염부하가 크고 많이 적용하는 아연도금공정의 공정진단 및 분석을 통해 아연도금공정의 청정생산 실행효과가 큰 우선순위별 단위공정에 최적기술을 적용하여 현 도금공장의 열악한 근무환경과 환경오염을 개선하고자 하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.

• Membrane and Water Treatment
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• 제11권3호
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• pp.179-187
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• 2020

Electrodialysis has been applied for treatment of industrial wastewater including metal electroplating. The wastewater from metal plating industries contains high concentrations of inorganics such as copper, nickel, and sodium. The ions in the feed were separated due to the electrical forces in the electrodialysis. The concentrate compartment is exposed to the elevated concentrations of the ions and yielded inorganic precipitations on the cation exchange membranes. The presence of organic matter in the metal plating wastewater affects complex interfacial reactions, which determines characteristics of inorganic scale fouling. The wastewater from a metal plating industry in practice was collected and the inorganic and organic compositions of the wastewater were analyzed. The performance of electrodialysis of the raw wastewater was evaluated and the effects of adjusting pH of the raw water were also measured. The integrated processes with neutralization and electrodialysis showed great removal of heavy metals sufficient to discharge to aquatic ecosystem. The organic matter in the raw water was also reduced by the neutralization, which might enhance removal performance and alleviate organic fouling in the integrated system.

• 한국표면공학회지
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• 제15권2호
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• pp.82-97
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• 1982