• Title/Summary/Keyword: peel strength test

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Measurement of Adhesion Strength for Ceramic Sheet (세라믹 박판의 접착 강도 측정)

  • Huh, Y.H.;Kim, D.I.;Kim, D.J.;Lee, K.;Kim, D.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1798-1802
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    • 2007
  • Adhesion strength of single layer ceramic capacitor sheet was measured using a peel testing system developed in this study. The peel test specimens with various dimensions were prepared from the ceramic sheet cast on the PET film. In peel test, the sheet specimen was adhered on the glass jig floating on the liquid media, which was designed to minimize the friction, and the specimen was then pulled up by micro-actuator. During the separation of the sheet from the PET film, peel force was measured. To normalize the testing condition, 3 different widths of the specimen were selected: 5, 10 and 20 mm. was used Furthermore, testing speed effect was investigated in this study. From the resullts using various testing conditions, the standard method for the peel strength testing may be suggested. Based on the testing condition, effect of peel angle on the strength was experimentally examined. It was found that the adhesive strength for the ceramic sheet is nearly identical, irrespective of the specimen width ranged from 5 to 20 mm, while the adhesive strength was increased with increasing testing speed. Furthermore, the strength was shown to be dependent on the peel angle.

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Strength Evaluation of Adhesive Bonded Joint for Light Weight Structure by T-Peel Joint Test (T형 이음 접합에 의한 경량구조물용 접착이음강도의 평가)

  • 이강용;공병석;우형표
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.4
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    • pp.56-65
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    • 1998
  • The bonding strength evaluation of the light weight materials for an electrical vehicle has been performed through the T-peel joint test in which the design paramete- rs such as joint style, adherend type, adherend thickness, adhesive thickness, and adhesive type are considered. It is experimentally observed that the peel strength of joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the peel strength of joint increases a little. Aluminum-FRP adherend combination shows such higher peel strength than that of Aluminum-Aluminum adherend combination. For the adhesive bonded joint, the results of FEM analysis agree with those of experiment. The adhesive bonded joint reinfored with a rivet gives higher peel strength than that of the joint without rivet.

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Peel Adhesion Strength and Plastic Deformation of Cu-Cr Alloy Thin Films (Cu-Cr 합금박막의 필 접착력과 소성변형)

  • 이태곤;임준홍;김영호
    • Journal of the Korean institute of surface engineering
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    • v.28 no.4
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    • pp.219-224
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    • 1995
  • The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

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A Study on the Curing Method to Improve Bonding Strength of Aluminum/CFRP Composites (알루미늄/CFRP 복합재의 접착강도 향상을 위한 경화방법에 관한 연구)

  • 이경엽;양준호;최낙삼
    • Transactions of the Korean Society of Automotive Engineers
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    • v.10 no.3
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    • pp.130-135
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    • 2002
  • This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

Key Parameter of Peel-off Test for Reliability Assessment of Toner Film (토너 박막의 신뢰성 평가를 위한 Peel-off Test의 주요인자)

  • Kim, Kwang-Il;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.11
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    • pp.1567-1573
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    • 2010
  • In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

A Study on the Improvement of Adhesion according to the Process Variables of Ion Beam in the Cu/Polyimide Thin Film (이온빔의 공정변수에 따른 Cu/Polyimide 박막의 접착력향상에 관한 연구)

  • Shin Youn-Hak;Kim Myung-Han;Choi Jae-Ha
    • Korean Journal of Materials Research
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    • v.15 no.7
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    • pp.458-464
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

The Effect of Resin Mixture Ratio on Characteristics of Tensile and T-peel Strength in Al/AFRP Laminates (Al/APRP 적층재의 수지혼합비가 인장 및 티-필(T-peel) 강도 특성에 미치는 영향)

  • Song, Sam-Hong;Kim, Cheol-Woong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.11
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    • pp.2374-2382
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    • 2002
  • Aluminum alloy/aramid fiber reinforced plastic(Al/AFRP) laminates consists of high strength metal(A15052) and laminated aramid fiber with structural adhesive bond. The mixture ratio effect of epoxy resin curing agent accelerator on the tensile strength and T-peel strength characteristic in Al AFRP laminates were investigated in this study. The epoxy. diglycidylether of bisphenol A(DCEBA), It'as cured by methylene dianiline(MDA) with or without an accelerator(K-54). Eight different kinds of resin mixture ratios were selected for the test , five kinds of Al/AFRP laminates were named as Al/AFRP(1) and three others of Al/AFRP laminates were named as Al/AFRP(2). The comparison of tensile strength and T-peel strength with variation of resin mixture ratio were studied. Respectively. Al/AFRP(1) and Al/AFRP(2) indicated approximately 6.0 times and 7.0 times more improved maximum tensile strength in comparison with those of monolithic A15052. Al/AFRP(2) indicated approximately 1.5 times more impoved maximum T-peel strengths in comparison with those of Al/AFRP(1). As results. Al/AFRP(2) turned out to have more effective characteristics on the tensile strength and T-peel strength than those of Al/AFRP(1).

A Study on the Improvement of Adhesion according to the Surface Modification of Cu/Polyimide Films by ion Beam Irradiation (이온빔에 의한 Cu/Polyimide 표면개질에 따른 접착력향상에 관한 연구)

  • Shin Youn-Hak;Chu Jun-Sick;Lee Seoung-Woo;Jung Chan-Hoi;Kim Myung-Han
    • Korean Journal of Materials Research
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    • v.15 no.1
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    • pp.42-46
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement (벗김강도 측정법에 의한 파워 모듈의 솔더접합 특성 평가)

  • Kim, Nam-Kyun;Lee, Hee-Heung;Bahng, Wook;Seo, Kil-Soo;Kim, Eun-Dong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.12
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    • pp.1142-1149
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    • 2003
  • The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

A STUDY ON THE ADHESIVENESS OF SILICONE AND POLYURETHANE SHEET IN MAXILLOFACIAL PROSTHESES (악안면 보철용 폴리우레탄과 실리콘의 접착도에 관한 실험적 연구)

  • Cho, Sang-Jun;Lim, Ju-Hwan;Cho, In-Ho
    • The Journal of Korean Academy of Prosthodontics
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    • v.34 no.4
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    • pp.833-849
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    • 1996
  • The material of choice for functional and esthetic reconstruction of maxillofacial defects is silicone. Silicone has appropriate physical properties for maxillofacial prosthesis but it has weak edge strength. Therefore, a proper combination of silicone and polyurethane sheet is recommended to improve this weakness. Various primers are also used to enhance the adhesive strength between silicone and polyurethane sheet. The purpose of this study was to determine the adhesive strength of silicone and polyurethane sheet. Silicone elastomer mixture was made by admixing MDX4-4210 elastomer (40%) and Silastic Medical Adhesive Type A(60%). This silicone elastomer mixture was attached to polyurethane sheet, using one of three different primers(1205, S-2260, or A-304), treated for 1, 2, 4, 6, and 8 hours. These were then polymerized in room temperature, dry-heat oven or microwave oven. Six specimens per each group, a total of 270 specimens were prepared for final test. The differences of T-peel bonding strengths were then determined by a test. The differences of T-peel bonding strengths were then determined by a test method that was recommended by American Society for Testing and Materials C794-80. The results were statistically analyzed using the ANOVA and Mutiple Range Tests(Tukey' HSD). The reults were as follow. 1. Type of primer, primer reaction time, and methods of polymerization showed significant correlation on the T-peel bonding strengths in adhesiveness between silicone and polyurethane sheet. 2. A-304 primer showed statistically higher in T-peel bonding strength than otehr type of primers except for the polymerization in microwave oven with reaction times of 2, 6 hours(p<0.05). 3. No significant differences in T-peel bonding strength were observed among the polymerization methods. 4. The effect of reaction time by the primer type and polymerization method showed statistically significant differences in bonding strength among different reaction times. And in most cases, reaction time of 1 or 2 hours showed higher T-peel bonding strength.

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