• Title/Summary/Keyword: patterning process

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The Fashion Professionals Required by the Ladies Apparel Manufacturers in Daegu (대구지역 숙녀복업계 기업주가 요구하는 패션전문인)

  • 김효은
    • Journal of the Korea Fashion and Costume Design Association
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    • v.4 no.1
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    • pp.111-130
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    • 2002
  • This study performed a structural questionnaire survey and non-structural interview of the ladies apparel manufacturers in Daegu on the qualification for the employees, skills required for job performance, job training, automatic manufacturing systems, and the use of computer. The results are as follows. 1. Almost all of the apparel manufacturing systems were Pair System, except one Line System in one company. In terms of outsourcing, most of the manufacturers answered “yes,” and in 1998 the outsourcing process was sewing, but in the year 2002, outsourcing has been increased :12 manufacturers(57.1%) outsourcing most of the processes except patterning, 3(14.3%) outsourcing the finish of sewing. 2. The workforce of 1998 and that of 2002 shows a significant difference(P<. 01) between office work and management. The number of office workers has decreased from 15 down to 5.3 people. On the other hand, that of the management has slightly increased from 5.3 to 9.2 people. The number of the manual workers has decreased from 32.2 to 28.7 people. And the number of tailoring and patterning workers has slightly decreased, but the number has increased in sewing from 3.7 to 7.0 people. 3. The wage of an employee shows a significant difference between a sewing assistant(P<. 01) and a production manager(P<. 05), and the wage of a sewing assistant, in particular, has slightly raised from ₩905,000 to ₩1,054,000. 4. The qualifications required of employees are “cooperative human relations”(30.8%), “diligence,” and “ability for job analysis”(26.9%), and “positive thinking” (15.4%) in 1998, and “ability for job analysis”(38.5%), “cooperative human relations”(34.6%), and “positive thinking” (15.4%) in 2002. The areas for job openings are significantly different(P<. 01) depending on the year. Job openings in the design section has increased from 1(3.8%) to 16 manufacturers (61.5%), and decreased in tailoring section from 22(84.6%) to 2 manufacturers(7.7%). Job openings in the sewing section have increased form 2(7.7%) to 6 manufacturers (23.1%). In terms of sex of the employees, there is a significant difference(P<. 001). 19 companies(73.1%) wanted “male” in 1998, but 8 companies(30.8%) answered that they want “female” and 17 companies(65.4%) answered that “it does not matter.” About the educational background, there was a significant difference between the years. The number of the companies that want junior college graduates with an associate degree has increased(15 companies(57.7%). There was a significant difference(P<. 05) in major of the employee. The number of the companies that want fashion majors has increased from 5(19.2%) to 20(76.9%). 5. In terms of job skills required, there was no significant difference. In 1998, “production skills” (46.2%) and “ability for job analysis” (26.9%) were required, and in 2002, “ability for job analysis” (42.3%) and “emotional skills” (26.9%). 6. In regard to training for job skills, “fashion professional training” has slightly decreased from 65.4% in 1998 to 46.2% in 2002, however, “training for job analysis” has slightly increased from 30.8% in 1998 to 46.2% in 2002, which indicates the fact that “fashion professional training” and “ability for job analysis” have been emphasized. 7. The number of the manufacturers purchased apparel CAD has increased from 1(3.8%) to 3(11.5%), and the number of the manufacturers that have no plan for purchase has increased from 16(61.5%) in 1998 to 15(57.7%), still taking up a big proportion. 8. About the use of computers in manufacturing, there is a significant difference(P<. 05). The number of the manufacturers using computer has increased from 5(19.2%) to 15(57.7%) and that of the manufacturers which do not use computers has decreased from 17(57.7%) to 8(30.8%). 9. In the interviews with the owners of the manufacturers, they pointed that schools should give more weight on practical training courses, the invitation of experts in the specific field, complex production systems, training courses for sewing, field trip courses, and furthering specialty education, personality and vocational education.

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A study on Yang Shi Tai Chi Chuan in Bartenieff Fundamentals Perspectives (바티니에프 기본원리를 통해 본 양식 태극권에 관한 연구)

  • Wang, Zhiquan
    • Trans-
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    • v.8
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    • pp.95-127
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    • 2020
  • This research is based on using Bartenieff Fundamentals to analyze the fundamentals of Tai Chi Chuan's movements in order to develop the methods of relaxation from Tai Chi Chuan's principle movement movements It also shows that the two techniques have commonalities in many ways. First of all, taking a philosophical approach on the body movements of Tai Chi Chuan and Bartenieff, for both methods the ultimate goal is the integration of mind and body. In other words, there is a thread of connection between the East's body and mind monism and the west's Body Awareness. Secondly, looking at it from a Breath Support standpoint as used in the Bartenieff method, the two methods both use the breathing to naturally move the body and relax the body. In Tai Chi Chuan the Breath is the basis of life and the strength of the Body. So the breathing of Tai Chi chuan is what makes body and mind communicate, harmonize and integrate. In other words, Breathing in Tai Chi is realized through mental fusion and affects the movements. This is the same as the Breath Support of Bartenieff. It is said that in every aspect the Breath Support of Bartenieff influences the movement and changes both the inner and outer form of the body. Thirdly, looking at the Core Support used in the Bartenieff method, both methods emphasize core. At the same time of moving and being conscious of one's core, the usage of muscles can be deeper rather than superficial and this enables strong and flexible movement. In Tai Chi Chuan abdominal muscles used when one coughs are consciously engaged through abdominal breathing and so strength is collected in the core. When one exercises like that the core becomes more stable and breathing becomes more smooth. Fourthly, analyzing the Rotary Factor used in the Bartenieff Fundamentals, they both use rotary movement to reach the goal of physical relaxation. The rotation factor of Bartenieff allows movement to be easier and more free because of the characteristic of joint exercise where the center axis moved in three dimensions, this is the same in Tai Chi chuan. According to Tai Chi chuan's circle and Spiral Movements, it can achieve the relaxation through switching into a seamless flow and access space as much as possible. Finally, when looking at Developmental Patterning through Bonnie Bainbridge Cohen's Body-Mind Centering Work theory, presented from Bartenieff developmental model are similar with the developmental process of Tai Chi chuan Breath, Core-Distal Connectivity/Navel Radiation, Head-Tail Connectivity/Spinal Movement, Upper-Lower Connectivity/Homologous, Body-Half Connectivity/Homo-Lateral Connectivity, Cross-Lateral Connectivity/Contra-Lateral Connectivity. They are all similar. In other words, in Tai Chi Chuan energy is gathered in the core through breathing, upper and lower body are connected through the spine, not only homo-laterally but also cross-laterally. Through this study the expression of the dance movements can be more natural. Additionally based on the Body Awareness balance usage of the central axis, joints and body can develop the relax technique.

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Electro-optic characteristics of novel biased vertical alignment device using the polymerized reactive mesogen (광경화성 단분자를 이용한 새로운 수직배향 액정 디바이스의 전기 광학적 특성연구)

  • Kim, Dae-Hyun;Kim, Sung-Min;Cho, In-Young;Kim, Woo-Il;Kwon, Dong-Won;Son, Jong-Ho;Ryu, Jae-Jin;Kim, Kyeong-Hyeon;Lee, Seung-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.269-270
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    • 2009
  • The biased vertical alignment (BVA) liquid crystal (LC) mode shows a has a distinct advantage of lower manufacture cost due to the elimination of a lithographic process step to form either ITO-patterning or protrusions on the color-filter substrates. However, those devices have complex voltage conditions which is the respective induce voltage on common electrode, pixel electrode and bias electrode when positive and negative frame. In order to overcome the complex voltage condition, the pretilt angles is controlled by photo polymerization of the UV-curable reactive mesogen (RM). According to our studies, voltages to the cell are critical to achieve an optimized surface-modified quality BVA (Q-BVA) mode which provides the well defined reorientation of the LCs with respect to an electric field.

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Infrared absorbance of the Au-black deposited under nitrogen gas-filled low vacuum condition (질소가스 분위기의 저진공으로 증착된 Au-black의 적외선 흡수도)

  • O, Gwang-Sik;Kim, Dong-Jin;Kim, Jin-Seop;Lee, Jeong-Hui;Lee, Yong-Hyeon;Lee, Jae-Sin;Han, Seok-Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.2
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    • pp.13-21
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    • 2000
  • Au-black for the application of the long wavelength infrared absorber has been prepared by evaporating Au under nitrogen gas-filled low vacuum condition. Characteristics of the deposited Au-black were carefully investigated through structural analysis, infrared absorbance measurement, and patterning of the layer, all of which are dependent on the deposition condition. High density of micro-cavity that trapped infrared were obtained, and infrared absorbance in the wavelength range from 3 $\mu\textrm{g}$ to 14 $\mu\textrm{g}$ was found to be about 90% when the Au-black layer was produced under the deposition condition of mass Per area of about 600 $\mu\textrm{g}$/cm$^{2}$ and chamber pressure of above 1 Torr. Photoresist lift-off process could be performed to pattern the Au-black, of which mass per area was below 900 $\mu\textrm{g}$/cm/ sup 2/. In view of absorbance, heat capacity, and pattern formation, the deposition condition of chamber pressure of about 1 Tow and mass per area of about 600$\mu\textrm{g}$/cm$^{2}$ was most adequate for preparing the Au-black as an infrared absorber.

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Exposure to Volatile Organic Compounds and Possibility of Exposure to By-product Volatile Organic Compounds in Photolithography Processes in Semiconductor Manufacturing Factories

  • Park, Seung-Hyun;Shin, Jung-Ah;Park, Hyun-Hee;Yi, Gwang-Yong;Chung, Kwang-Jae;Park, Hae-Dong;Kim, Kab-Bae;Lee, In-Seop
    • Safety and Health at Work
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    • v.2 no.3
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    • pp.210-217
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    • 2011
  • Objectives: The purpose of this study was to measure the concentration of volatile organic compound (VOC)s originated from the chemicals used and/or derived from the original parental chemicals in the photolithography processes of semiconductor manufacturing factories. Methods: A total of four photolithography processes in 4 Fabs at three different semiconductor manufacturing factories in Korea were selected for this study. This study investigated the types of chemicals used and generated during the photolithography process of each Fab, and the concentration levels of VOCs for each Fab. Results: A variety of organic compounds such as ketone, alcohol, and acetate compounds as well as aromatic compounds were used as solvents and developing agents in the processes. Also, the generation of by-products, such as toluene and phenol, was identified through a thermal decomposition experiment performed on a photoresist. The VOC concentration levels in the processes were lower than 5% of the threshold limit value (TLV)s. However, the air contaminated with chemical substances generated during the processes was re-circulated through the ventilation system, thereby affecting the airborne VOC concentrations in the photolithography processes. Conclusion: Tens of organic compounds were being used in the photolithography processes, though the types of chemical used varied with the factory. Also, by-products, such as aromatic compounds, could be generated during photoresist patterning by exposure to light. Although the airborne VOC concentrations resulting from the processes were lower than 5% of the TLVs, employees still could be exposed directly or indirectly to various types of VOCs.

Formulation and ink-jet 3D printability of photo curable nano silica ink (광경화 나노 실리카 잉크의 합성 및 잉크젯 프린팅 적층 특성평가)

  • Lee, Jae-Young;Lee, Ji-Hyeon;Park, Jae-Hyeon;Nahm, Sahn;Hwang, Kwang-Taek;Kim, Jin-Ho;Han, Kyu-Sung
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.6
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    • pp.345-351
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    • 2019
  • Recently, ink-jet printing technology has been applied for various industries such as semiconductor, display, ceramic tile decoration. Ink-jet printing has advantages of high resolution patterning, fast printing speed, high ink efficiency and many attempts have been made to apply functional materials with excellent physical and chemical properties for the ink-jet printing process. Due to these advantages, research scope of ink-jet printing is expanding from conventional two-dimensional printing to three-dimensional printing. In order to expand the application of ink-jet printing, it is necessary to optimize the rheological properties of the ink and the interaction with the substrate. In this study, photo curable ceramic complex ink containing nano silica particles were synthesized and its printability was characterized. Contact angle of the photo curable silica ink were modified by control of the ink composition and the surface property of the substrate. Effects of contact angle on printing resolution and three-dimensional printability were investigated in detail.

Electrical and Fluidic Characterization of Microelectrofluidic Bench Fabricated Using UV-curable Polymer (UV경화성 폴리머를 이용한 미소유체 통합접속 벤치 개발 및 전기/유체적 특성평가)

  • Youn, Se-Chan;Jin, Young-Hyun;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.5
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    • pp.475-479
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    • 2012
  • We present a novel polymer fabrication process involving direct UV patterning of a hyperbranched polymer, AEO3000. Compared to PDMS, which is the most widely used polymer in bioMEMS devices, the present polymer has advantages with regard to electrode integration and fast fabrication. We designed a four-chip microelectrofluidic bench having three electrical pads and two fluidic I/O ports. We integrated a microfluidic mixer and a cell separator on the bench to characterize the interconnection performance and sample manipulation. Electrical and fluidic characterization of the microfluidic bench was performed. The measured electrical contact resistance was $0.75{\pm}0.44{\Omega}$, which is small enough for electrical applications, and the pressure drop was 8.3 kPa, which was 39.3% of the value in the tubing method. By performing yeast mixing and a separation test in the integrated module on the bench, we successfully showed that the interconnected chips could be used for bio-sample manipulation.

자기조립 특성을 이용한 공정 및 응용소자 개발

  • Lee, Jae-Gap
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.52-52
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    • 2012
  • 최근 선진국을 중심으로 제조기술의 산업혁명이라고 불릴 정도로 큰 파급효과가 기대되는 자기조립기반의 산업공정기술을 확보하기 위한 많은 노력과 연구들이 활발하게 진행되고 있다. 자기조립(Self-Assembly) 현상은 자연에서 일어나는 자발적인 힘으로 원자 또는 분자 단위까지 구조물을 제어하고 bottom-up 방식(상향식: 원자/분자 스케일의 나노구조를 배열/조립하여 원하는 형태의 패턴을 만들어 내는 방식)으로 원하는 구조물을 설계/제작할 수 있는 능력을 가지고 있다. 기초적인 과학으로부터 출발한 자기조립기술은 최근 자기조립 응용개발에서 많은 성과를 이루어내면서 산업화 가능성을 크게 하고, 과학계와 산업계의 많은 관심을 불러일으키고 있다. 반도체 산업기술을 예측하는 ITRS 로드맵(2005년)에 의하면 directed self-assembly 방법이 새로운 미래 패터닝 기술로 개발되어 2016년경에 사용되고, 자기조립소재로 제작된 다양한 응용소자들은 새로운 미래소자로 개발될 것으로 예상하고 있다. 이에 맞추어 국내 기업들도 diblock copolymer를 이용한 나노패터닝 기술 확보를 위한 연구를 진행하고 있다. 또한 IBM은 자기조립기술을 반도체공정에 실험적으로 적용하여 자기조립기술이 생산 공정에 부분적으로 적용될 가능성이 크다는 것을 보여주었다. 산업계와 함께 학계의 연구센터에서는 산업화를 위한 자기조립 집적화 공정(Integrated process) 개발을 이루기 위하여 체계적으로 연구를 실시하고 있다. 미국의 Northeastern 대학의 CHN(Center for high-rate Nanomanufacturing) 연구센터는 자기조립 집적화에 용이한 새로운 개념의 소자를 제안하고 이를 집적화하기 위한 다양한 공정을 개발하고 있으며, Wisconsin 대학의 NSEC(Nanosacle Science and Engineering Center) 연구센터는 diblock copolymer를 이용한 나노패터닝 기술 개발에서 획기적인 결과를 도출하여 산업계에 적용될 가능성을 높이고 있다. 이와 같은 결과들로부터 앞으로의 자기조립기술에 대한 연구는 3차원 구조물을 제작할 수 있는 집적화 공정에 집중될 것이고, 이를 위하여 새로운 개념의 단순한 구조의 응용소자개발도 함께 추진될 것으로 판단된다. 또한 실용 가능성이 큰 집적화 공정으로 개발하기 위하여 기존의 top-down 방식을 접목한 bottom-up 방식의 자기조립 집적화 공정이 개발될 것으로 예상하고 있다. 이와 함께 자기조립공정은 반복되는 구조를 쉽게 제작할 수 있는 장점을 가지고 있어 다양한 응용소자 [태양전지(solar cell), 연료전지(fuel cell), 유연성 있는 전자기기(flexible electronics), 화면표시 장치(display device)] 제작에 쉽게 이용되어 새로운 산업을 창출할 수 있는 가능성을 보이고 있다. 본 자기조립 연구 센터에서는 이와 같은 자기조립 특성을 제조공정에 적용하여 혁신적인 제조공정기술을 확보하고자 연구를 진행하고 있다. 그러므로 본 발표에서 이와 같은 연구 흐름과 함께 본 센터에서 진행하고 있는 자기조립 제조방법을 소개하고자 한다. 이와 함께 자기조립방법을 이용하여 제작된 다양한 응용소자 개발 결과를 발표하고, 이를 top-down 방식과 접목하여 집적화공정으로 개발하는 전략을 함께 소개하고자 한다.

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Stability Enhancement of IZOthin Film Transistor Using SU-8 Passivation Layer (SU-8 패시베이션을 이용한 솔루션 IZO-TFT의안정성 향상에 대한 연구)

  • Kim, Sang-Jo;Yi, Moonsuk
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.7
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    • pp.33-39
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    • 2015
  • In this work, SU-8 passivated IZO thin-film transistors(TFTs) made by solution-processes was investigated for enhancing stability of indium zinc oxide(IZO) TFT. A very viscous negative photoresist SU-8, which has high mechanical and chemical stability, was deposited by spin coating and patterned on top of TFT by photo lithography. To investigate the enhanced electrical performances by using SU-8 passivation layer, the TFT devices were analyzed by X-ray phtoelectron spectroscopy(XPS) and Fourier transform infrared spectroscopy(FTIR). The TFTs with SU-8 passivation layer show good electrical characterestics, such as ${\mu}_{FE}=6.43cm^2/V{\cdot}s$, $V_{th}=7.1V$, $I_{on/off}=10^6$, SS=0.88V/dec, and especially 3.6V of ${\Delta}V_{th}$ under positive bias stress (PBS) for 3600s. On the other hand, without SU-8 passivation, ${\Delta}V_{th}$ was 7.7V. XPS and FTIR analyses results showed that SU-8 passivation layer prevents the oxygen desorption/adsorption processes significantly, and this feature makes the effectiveness of SU-8 passivation layer for PBS.

Development of Capacitive Type Humidity Sensor using Polyimide as Sensing Layer (폴리이미드를 감지층으로 이용한 정전용량형 습도센서 개발)

  • Hong, Soung-Wook;Kim, Young-Min;Yoon, Young-Chul
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.12 no.4
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    • pp.366-372
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    • 2019
  • In this paper, we fabricated a capacitive humidity sensor with an IDT(Interdigitated) electrode using commercial polyimide containing fluorine, and its properties were measured and analyzed. First, in order to analyze the composition of commercial polyimide, EDS analysis was performed after patterning process on a silicon wafer. The area of the humidity sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were $3{\mu}m$ each. The number of electrodes was 166 and the length of the electrode was 1.294mm for the sensitivity of the sensor. The fabricated sensor showed that the sensitivity was 24 fF/%RH, linearity <${\pm}2.5%RH$ and hysteresis <${\pm}4%RH$. As a result of measuring the capacitance value according to the frequency change, the capacitance vlaue decreased with increasing frequency. Capacitance deviations with 10kHz and 100kHz were measured as 0.3pF on average.