• 제목/요약/키워드: patterning process

검색결과 443건 처리시간 0.031초

Width Control in the Photo patterning of PDP Barrier Ribs

  • Kim, Dong-Ju;Kim, Soon-Hak;Hur, Young-June;Kim, Duck-Gon;Lee, Sam-Jong;Jung, Sang-Kwon;Kim, Myeug-Chan;Park, Lee-Soon
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.910-912
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    • 2006
  • Barrier ribs in plasma display panels (PDPs) function to maintain the discharge space between the glass plates as well as to prevent optical cross-talking. The barrier ribs currently employed are typically $300{\mu}m$ pitch, $110{\sim}120{\mu}m$ in height, with upper and lower widths of $50{\mu}m$ and $80{\mu}m$, respectively. It has been reported that barrier ribs can be fabricated by screen-printing, sand blasting, etching and photolithographic processes. In this study, photosensitive barrier rib pastes were formulated and systematically evaluated in terms of photolithographic process variables such as printing, drying, UV exposure, development and sintering. It was found that the use of UV absorbent, polymerization inhibitor and surfactant were very effective in controlling the width uniformity of barrier ribs in the photolithographic method of barrier rib patterning.

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Soft Lithographic Patterning Method for Flexible Graphene-based Chemical Sensors with Heaters

  • Kang, Min-a;Jung, Min Wook;Myung, Sung;Song, Wooseok;Lee, Sun Suk;Lim, Jongsun;Park, Chong-Yun;An, Ki-Seok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.176.2-176.2
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    • 2014
  • In this work, we demonstrated that the fabrication of flexible graphene-based chemical sensor with heaters by soft lithographic patterning method [1]. First, monolayer and multilayer graphene were prepared by thermal chemical vapor deposition transferred onto SiO2 / Si substrate in order to fabrication of patterned-sensor and -heater. Second, patterned-monolayer and multilayer graphene were detached through soft lithography process, which was transferred on top and bottom sides of PET film. Third, Au / Ti (Thickness : 100/30 nm) electrodes were deposited end of the patterned-graphene line by sputtering system. Finally, we measured sensor properties through injection of NO2 and CO2 gas on different temperature with voltage change of graphene heater.

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미세 선폭 프린팅을 위한 롤투롤 장비 개발 (Development of Roll-to-Roll Printing System for Fine Line-width Printing)

  • 김충환;류병순;임규진;이명훈;이택민;윤소남;최병오
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.583-584
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    • 2006
  • Printing technology has begun to get into the spotlight in many ways due to the low cost effectiveness to existent semi-conductor process. It also has very useful application areas, not only paper printing but also patterning for LCD color tilter, Photovoltaic patterning, RFID antenna, OLED, and so on. In this study, an apparatus of gravure offset printing was developed for fine line width printing. The pattern was composed of $20{\mu}m$ size of continuous lines of which pitch size was $40{\mu}m$. The printed pattern shows that it is possible to make around $20{\mu}m$ line-width printing pattern. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. For testing of multi-layer printing, the system was designed to be capable of printing two different materials from each printing unit using gravure-offset printing method and have a function of alignment of two printed materials.

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LTCC 기판 시스템의 고주파 특성 비교 (A Comparison of High Frequency Properties of LTCC Substrate Systems)

  • 이영신;김경철;박성대;박종철
    • 마이크로전자및패키징학회지
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    • 제9권3호
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    • pp.7-12
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    • 2002
  • LTCC(Low temperature Cofiring Ceramics)기판의 고주파특성 평가에 있어서, 기판은 전극 패터닝 공정 방식이 결합된 하나의 시스템으로 평가되어야 한다. LTCC의 경우 시스템마다 상이한 소결 수축 과정, 전극과 기판의 접합 특성(matching) 차이, 사용 도체간 전기 전도도의 차이 등으로 인해 유전 특성 및 신호손실이 차이를 나타내었다. 본 논문에서는 FR-4, Duroid, Teflon등 기존의 상용 PCB(Printed Circuit Board) 와의 상대적인 비교를 통해 현재 사용되고 있는 LTCC 기판의 주파수 응용도를 확인하였으며, 20 ㎓까지 측정을 수행하였다. 측정방식으로는 Ring 공진기와 Series-Gap 공진기를 활용한 마이크로 스트립 공진기 방법을 채택하였으며, 실험 결과 기판손실 측정은 Ring 공진기 방식이 유효하였으며 유전률 측정은 Series-Gap 공진기 방식이 유효함을 확인하였다. 또한 주파수 증가에 따라 LTCC 기판의 전극 패터닝 방식이 시스템의 손실에 미치는 영향에 대해 분석하였다.

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생체 삽입형 유연한 마이크로 전극의 제작 및 평가 (Fabrication and Evaluation of the Flexible and Implantable Micro Electrode)

  • 백주열;권구한;이상운;이기암;이상훈
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제55권2호
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    • pp.93-99
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    • 2006
  • In this paper, we fabricated and evaluated polydimethylsiloxane(PDMS)-based flexible and implantable micro electrodes. The electrode patterning was carried out with the photolithography and chemical etching process after e-beam evaporation of 100 ATi and 1000 A Au. The PDMS substrate was treated by oxygen plasma using reactive ion etching(RIE) system to improve the adhesiveness of PDMS and metal layers. The minimum line width of fabricated micro electrode was 20 $\mu$m. After finished patterning, we did packaging with PDMS and then brought up the electrode's part about 40 $\mu$m with gold electroplating. The Hank's balanced salt solution(HBSS) test was carried out for 6 month for endurance of fabricated micro electrode. We carried out in-vivo test for the evaluation of biocompatibility by implanting electrodes under the ICR mouse skin for 42 days.

A Study on the Uniformity Improvement of Residual Layer of a Large Area Nanoimprint Lithography

  • Kim, Kug-Weon;Noorani, Rafigul I.;Kim, Nam-Woong
    • 반도체디스플레이기술학회지
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    • 제9권4호
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    • pp.19-23
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    • 2010
  • Nanoimprint lithography (NIL) is one of the most versatile and promising technology for micro/nano-patterning due to its simplicity, high throughput and low cost. Recently, one of the major trends of NIL is large-area patterning. Especially, the research of the application of NIL to TFT-LCD field has been increasing. Technical difficulties to keep the uniformity of the residual layer, however, become severer as the imprinting area increases. In this paper we performed a numerical study for a large area NIL (the $2^nd$ generation TFT-LCD glass substrate ($370{\times}470$ mm)) by using finite element method. First, a simple model considering the surrounding wall was established in order to simulate effectively and reduce the computing time. Then, the volume of fluid (VOF) and grid deformation method were utilized to calculate the free surfaces of the resist flow based on an Eulerian grid system. From the simulation, the velocity fields and the imprinting pressure during the filling process in the NIL were analyzed, and the effect of the surrounding wall and the uniformity of residual layer were investigated.

UV를 사용한 SAMs 패터닝과 PEDOT의 선택적 증착에 관한 연구 (Patterning of poly(3,4-ethylenedioxythiophene)(PEDOT) Thin Films by Using Self-assembled Monolayers(SAMs) Patterns Formed by Ultra-violet(UV) Lithography)

  • 권태욱;이정길;이재갑
    • 한국재료학회지
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    • 제16권10호
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    • pp.619-623
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    • 2006
  • Selective vapor deposition of conductive poly(3,4-ethylenedioxythiophene) (PEDOT), thin films has been carried out on self assembled monolayers patterned oxide substrate. Since the 3,4-ethylenedioxythiophene(EDOT) monomer can be polymerized only in the presence of oxidant such as $FeCl_3$, the PEDOT thin film is selectively deposited on patterned $FeCl_3$, which only adsorbs on the partly removed SAMs region due to the inability of $FeCl_3$ to adsorb on SAMs. Therefore, the partly removed SAMs can act as an adsorption layer for the $FeCl_3$ and also as a glue layer for the deposition of PEDOT, resulting in the significantly increased adhesion of PEDOT to $SiO_2$ substrate. The use of UV lithography and Cr patterned quartz mask provided the formation of SAMs patterns on oxide substrates, which allowed for the selective deposition of conductive PEDOT thin films.$^{oo}The$ new process was successfully developed for the selective deposition of PEDOT thin films on SAMs patterned oxide substrate, providing a new way for the patterning of vapor phase deposition of PEDOT thin films with accurate alignment and addressing the inherent adhesion issues between PEDOT and dielectrics.

Application of the Plasma Etching technique to Fabricating a Concave-type Pt Electrode Capacitor

  • Kim, Hyoun Woo;Hwang, Woon Suk
    • Corrosion Science and Technology
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    • 제2권5호
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    • pp.243-246
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    • 2003
  • We have used a plasma etching method in order to develop a concave-type Pt electrode capacitor to overcome the limitation of conventional stack-type capacitor in a small critical-dimension (CD) pattern. We have deposited Pt layer on the concave-type structure made by patterning of $SiO_2$ and subsequently we separated the adjacent nodes by etch-back process with photoresist (PR) as a protecting layer.