• Tribology and Lubricants
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• 제33권6호
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• 상하수도학회지
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• 제21권6호
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• pp.727-735
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• 2007

The use of water by cities is increasing owing to industrialization, the concentration of population, and the enhancement of the standard of living. Accordingly, the amount of waste water is also increasing, and the degree of pollution of the water system is rising. In order to solve this problem, it is necessary to remove organisms and suspended particles as well as the products of eutrophication such as nitrates and phosphates. This study developed a high-end treatment engineering solution with maximum efficiency and lower costs by researching and developing a advanced treatment engineering solution with the use of Biosorption. As a result, the study conducted a test with a $50m^3/day$ Pilot Scale Plant by developing treatment engineering so that only the secondary treatment satisfies the standard of water quality and which provided optimal treatment efficiency along with convenient maintenance and management. The removal of organisms, which has to be pursued first for realizing nitrification during the test period, was made in such a way that there would be no oxidation by microorganisms in the reactor while preparing oxygen as an inhibitor for the growth of microorganism in the course of moving toward the primary settling pond. The study introduced microorganisms in the endogeneous respiration stage to perform adhesion, absorption, and filtering by bringing them into contact with the inflowing water with the use of a sludge returning from the secondary settling pond. Also a test was conducted to determine how effective the microorganisms are as an inner source of carbon. The HRT(Hydraulic Retention Time) in the nitrification tank (aerobic tank) could be reduced to two hours or below, and the stable treatment efficiency of the process using the organisms absorbed in the NAR reactor as a source of carbon could be proven. Also, given that the anaerobic condition of the pre-treatment tank becomes basic in the area of phosphate discharge, it was found that there was excellent efficiency for the removal of phosphate when the pre-treatment tank induced the discharge of phosphate and the polishing reactor induced the uptake of phosphate. The removal efficiency was shown to be about 94.4% for $BOD_5$. 90.7% for $COD_{Cr}$ 84.3% for $COD_{Mn}$, 96.0% for SS, 77.3% for TN, and 96.0% for TP.