• Journal of the Korea Concrete Institute
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• v.13 no.4
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• pp.346-353
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• 2001

This research investigates the mixture proportioning of waste newsprint paper fiber for thin-cement product. Waste newsprint paper fibers obtained through shredded mechanically by a dry process. Waste newsprint paper fiber reinforced cement composites was manufacted by slurry-dewatering method. The waste newsprint paper fiber reinforcement conditions (fiber mass fraction, level of substitution of virgin fibers, level of fiber beating) and processing variables (pressed, unpressed) are optimized through experimental studies and statistical analyses based on factorial design of experiments and analyses of variance. The optimized recycled waste newsprint paper fiber reinforced cement composites were technically evaluated. The results are shown to possess acceptable properties and strong potentials of the recycling of waste newsprint paper of the reinforcement of thin-cement products.

• Elastomers and Composites
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• v.46 no.1
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• pp.70-77
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• 2011

A new piece of test equipment, the slurry wear tester (SWT), was proposed in this study to evaluate the wear behavior of rubber vulcanizate in environmental contact with slurry. Natural rubber (NR) and chloroprene rubber (CR) were chosen as the basic matrices to test the slurry wear. The fluids used to fill the chamber of the SWT were 35% HCl and NaCl solution. The Akron abrasion test was used for comparison with SWT. According to the results of the Akron abrasion test, CR vulcanizate abraded more rapidly than NR vulcanizate under same test condition. It was found that the hysteresis of rubber was key factor contribute to the wear behavior. However, the slurry wear rate of the NR and CR vulcanizates did not change significantly, even with changes in the concentration of acid and the immersion time in both HCl and NaCl solutions; the fluid decreased the friction between the abrasive paper and the specimen. It also reduced the heat generated from repeated deformation and wear debris at the surface of the SWT's abrasion arm. Thus, these phenomena affected the wear behavior of rubber vulcanizate and caused different results in the conventional Akron abrasion test. This outcome could have resulted in an incorrect analysis if the slurry wear behavior of the rubber vulcanizate was estimated by the conventional abrasion tests, which are operated under dry conditions.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.43 no.5
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• pp.43-48
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• 2011

Filler loading at thick stock was carried out in order to verify if the dual addition of filler can be used as a means to reduce the detrimental effects of filler on the strength properties of paper. PCC was added to 3.5% pulp slurry blended with HwBKP, BCTMP and SwBKP. Cationic starch was used as a fixing agent. The mixture of PCC and pulp was stirred for 5, 10 and 20min. at 1,000 rpm. The remaining PCC was washed out before handsheet making. PCC particles were flocculated and fixed on the pulp fiber and/or space between fibers. It is expected that the flocculation and inclusion of PCC can be helpful to improve the strength properties of paper due to the reduction of detrimental effect in fiber bonding. The distinct tendency in PCC flocculation and fixing on pulp fiber was not observed by the change of cationic starch dosage and treatment time.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.3
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• pp.12-23
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• 2007

Frequently spraying of natural starch slurry onto the formed wet web has been adopted to improve properties of paperboards. This conventional starch spraying technique, however, becomes less effective in strength improvement. In this study the effects of various factors including wet web dryness, quantity of starch slurry sprayed, and drying temperature on paperboard properties were investigated. Migration of starch granules into the webs appeared to cause a reduction in plybond strength when the web dryness was lower than this level. Wet webs should contain enough water to swell the starch granules, and at the same time they should be heated to a temperature high enough for complete cooking of the sprayed starches to occur. This suggested that preheating of the wet web can be employed to improve the plybond strength.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.11
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• pp.62-67
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• 1999

The RP&M(Rapid Prototyping and Manufacturing) is the most appropriate technology for the small-lot production system, in which the production cycle is getting shorter owing to various needs from consumers. Recently RP products which are made of plastics, wax, and paper are used to verify the design of samples. But these products cannot be applied to the real mold because the strength enough to be a mold cannot be given by soft materials such as plastics. So RP products are copied to AFR(Al powder Filled Resin) molds or metal molds, which is called the RP&M. In this paper, RP&M is applied to a casting process. A porous casting mold, which is made from ceramic powder and binder, is used for rapid tooling of aluminum shoes molds.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.361-367
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• 2001

Recently, Chemical Mechanical Polishing(CMP) has become a leading planarization technique as a method for silicon wafer planarization that can meet the more stringent lithographic requirement of planarity for the future submicron device manufacturing. The SOI(Silicon On Insulator) wafer has received considerable attention as bulk-alternative wafer to improve the performance of semiconductor devices. In this paper, the objective of study is to investigate Material Removal Rate(MRR) and surface micro-roughness effects of slurry and pad in the CMP process. When particle size of slurry is increased, Material Removal rate increase. Surface micro-roughness is greater influenced by pad than by particle size of slurry. As a result of AM measurement, surface micro-roughness was improved from 27 $\AA$ Rms to 0.64 $\AA$Rms.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2001.11a
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• pp.69-76
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• 2001

The coal gasification process of a slurry feed type, entrained-flow coal gasifier was numerically predicted in this paper. By divding the complicated coal gasification process into several simplified stages suh as slurry evaporation, coal devolitilisation and two-phase reactions coupled with turbulent flow and two-phase heat transfer, a comprehensive numerical model was constructed to simulate the coal gasification process. The k-$\varepsilon$turbulence model was used for the gas phase flow while the Random-trajectory model was applied to describe the behavior of the coal slurry particles. The unreacted-core shrinking model and modified Eddy Break-Up(EBU) model were used to simulate the heterogeneous and homogeneous reactions, respectively. The simulation results obtained the detailed informations about the flow field, temperature inside the gasifier. Meanwhile, the simulation results were compared with the experimental data as function of $O_2$/coal ratio. It illustrated that the calculated carbon conversions agreed with the measured ones and that the measurd quality of the atngas was better than the calculated one when the $O_2$/coal ratio increases. The result was related with the total heat loss through the gasifier and uncertain kinetics for the heterogeneous reactions.

• Transactions of the Korean Society of Automotive Engineers
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• v.18 no.6
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• pp.84-90
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• 2010

This paper presents the shape optimization process for the automotive wheel bearing seal lip using the finite element method and the response surface method. First, to predict performance of the bearing seal lip, we used the non-linear finite element analysis. And then, we compared the analysis results with the test results to verify the finite element model. The objective function in optimizing process was obtained from results of the mud slurry test, which is one of many tests for evaluating performance of wheel bearing. After the mud slurry test for the four models which have the similar cross-sectional shape, we measured the wear area of the seal lip and the moisture content in grease. The objective function has been chosen by comparing the results of mud slurry test and characteristics of seal lip, such as contact force, contact area, contact pressure, and interference. Finally, within limited design parameters, we suggested the optimized shape of seal lip, which is expected to improve the wear and the sealing effect of it.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.9
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• pp.787-792
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• 2005

Chemical mechanical polishing(CMP) has become the process of choice for modem semiconductor devices to achieve both local and global planarization. CMP is a complex process which depends on numerous variables such as macro, micro and nano-geometry of pad, relative velocity between pad and wafer stiffness and dampening characteristics of pad, slurry, pH, chemical components of slurry, abrasive concentration, abrasive size, abrasive shape, etc. Especially, an oxidizer of chemical components is very important remove a target material in metal CMP process. This paper introduces the effect of oxidizer such as $H_2O_2,\;Fe(NO_3)_3\;and\;KIO_3$ in slurry for tungsten which is used in via or/and plug. Finally the duplex reacting mechanism of $oxidizer(H_2O_2)$ through adding the $catalyst(Fe(NO_3)_3)$ could acquire the sufficient removal rate in tungsten CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.370-373
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical Planarization(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper depostion is a mature process from a historical point of view, but a very young process from a CMP persperspective. While copper electrodepostion has been used and stuidied for dacades, its application to Cu damascene wafer processing is only now ganing complete accptance in the semiconductor industry. The polishing mechanism of Cu CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper pasivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.