• 오토저널
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• 제4권3호
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• pp.40-47
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• 1982

Heat transfer on packed bed is considered to be important for the effective designs of chemical reaction equipment, air conditioning system, and storage type heat exchanger, etc. Currently studies are being carried out quite actively in this field in order to increase the heat transfer efficiency. The effect of heat transfer is closely relater to materials, shapes, porosities and packing states of packed bed as well as mutual dimensional relations between particles and the container. Investigation shows that heat transfer results appear to be influenced by such parameters as fluid velocity through packed bed, mass flow, and thermal properties. It is noted that viscosity is also considered to be an important factor in this problem. In this study, effective thermal conductivities on packed bed, effects of thermal conductivity (Ke) and friction factor (Fk) according to change of porosity(.epsilon.) and Reynolds number(Reh(, and pressure loss of the fluid, are experimentally investigated. Results show that the effective thermal conductivity increases and the friction factor decreased, as against the increase of Reynolds number. But as the increase of porosity increase them both.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 하계학술대회 논문집
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• pp.857-860
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• 1991

This paper describes a High-Speed 8-bit Current-Mode BiCMOS A/D Converter. The characteristics of this A/D Converter are as fellows. First, as ADC is operating in current-mode we can obtain the properties of increase of converting speed, low noise, and wideband. Second, the properties of high switching speed in bipolar transistor and of high packing density, low power consumption in MOS trnsistor are combined. Finally we reduce chip area by designing it with subranging mode and improve the converting speed by performing subtraction directly, which doesn't need D/A convertings, using current switching element. This converter is composed of two 4-bit ADC, current soure array which provides signal and reference current, current comparator and encoding network.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2001년도 유체기계 연구개발 발표회 논문집
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• pp.315-321
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• 2001

The shaft system of turbine is composed of rotating shaft, blades, bearings which support the shaft, packing seal which prevent the leakage of steam, and couplings which connect the shaft. Shaft system component failure, incorrect assemblage or deflection by unexpected forces causes vibration problem. And every turbine has its own characteristics in dynamic response. In this paper we propose the three-bearing supported type rotor which is real equipment and being operated this time as commercial operation. From 1996 it has a high vibration problem and there are many kinds of trial to solve this problem. In resent outage we performed a special diagnosis and carried out appropriate work. We would like to introduce and explain about this case history.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.811-814
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• 1997

The injection molding process has been developed as a very important technology for the automotive and electric industries in recent years. But, in the injection molding products with rib-web structures, partial deformation by thermal volumetric shrinkage called Sink Mark, is occurred. In this study, to make explicitly characteristics of sink mechanism, an experimental approach was taken by using multi T-shaped mold cavity and FEM simulation. As a result, pressure on the packing process and the rib thickness are the most effective on sink mark depth. On the other hand, melt temperature has no effect on sink mark depth fot the same rib thickness.

• 설비공학논문집
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• 제14권5호
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• pp.391-397
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• 2002

Pressure drop were experimentally investigated for ice slurry flowing in the acrylic pipes with inner diameter of 24 mm. Ice slurry was made from 6.5% ethylene glycol-water solution, and the pipes is consisted of horizontal, vertical (upward and downward) and $90^{\circ}$ elbow pipe. The ice Packing factor (IPF) and the flow rate of the experiments were varied from 0 to 30% and from 5 to 70kg/min respectively The measured pressure drop in various pipe positions were compared with those for the solution flow (IPF=0). The pressure drop was larder than that for solution flows as the IPF increased when the flow rate was low or very high. Sharp increases in pressure drop were observed for the cases when IPF is more than 70% in horizontal and vertical pipes, whereas the pressure drop increased with the IPF simultaneously in an elbow pipe.

• 전자공학회논문지C
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• 제35C권7호
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• pp.20-29
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• 1998

As the packing density of ICs in recent submicron IC design increases, interconnects gain importance. Because interconnects directly affect on two major components of circuit performance, power dissipation and operating speed, circuit engineers are concerned with the optimal design of interconnects and the aid tool to design them. When circuit models of interconnects are given (including geometry and material information), the analysis process for the given structure is not an easy task, but conversely, it is much more difficult to design an interconnect structure with given circuit characteristics. This paper focuses on the latter process that has not been foucsed on much till now due to the complexity of the problem, and prsents a design aid tool(DATOIS) to synthesize interconnects. this tool stroes the circuit performance parameters for normalized interconnect geometries, and has two oeprational modes:analysis mode and synthesis mode. In the analysis mode, circuit performance parameters are obtained by searching the internal database for a given geometry and interpolates results if necessary . In thesynthesis mode, when a given circuit performance parameter satisfies a set of geometry condition in the database, those geometry structures are printed out.

• 한국안전학회지
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• 제15권1호
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• pp.121-125
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• 2000

This study was executed by dust explosion experiment of terephthalic acid which was widely used for various purposes of food packing material and film etc. and the demand was rapidly increasing. The particle size and concentration of dust affected the minimum ignition energy largely and the lean concentration and the minimum ignition energy in the range of this study were obtained 50$g/m^3$ and 19mJ respectively. Minimum ignition energy was shown at the 4 and 5mm gap distance of discharge electrode, and when the gap distance was below 2mm the explosion could not generated although the sufficient energy was given. It was also found that the ignition energy decreased linearly with the decreasing of dust mean particle size.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2001년도 춘계종합학술대회
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• pp.321-324
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• 2001

MOSFET는 전력감소, 도핑농도 증가, 캐리어 속도 증가를 위해서 많은 변화를 가져왔다. 이러한 변화를 받아들이기 위해서, 채널의 길이와 공급전압이 감소해야만했으며, 그것으로 인해 소자가 더욱 작아지게 되었다. 본 논문에서는 이러한 변화를 두 가지의 시뮬레이터를 사용하여 비교 분석하였다. 사용되어진 시뮬레이터는 Micro-Tec과 ISE-TCAD이며, 본 논문에서 LDD(lightly-doped drain) MOSFET에 관하여 시뮬레이션 하였다. 게이트 길이는 180nm를 기준으로 MOSFET의 특성과 전계를 비교 분석하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.273-276
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• 2005

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

• E2M - 전기 전자와 첨단 소재
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• 제9권9호
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• pp.925-932
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• 1996

Using the d.c. 2-probe method, we have examined the temperature dependence of CO gas sensitivity of pure ZnO and ZnO CuO thick films prepared by the acqueous precipitation. At 200ppm CO gas, pure ZnO thick film shows the maximum sensitivity of -6.5 at 300.deg. C. On the other hand, the maximum sensitivity of 1-5 mol% and 10-15 mol% CuO added ZnO thick films are 2.8-2.5 and 1.6, respectively. Therefore, the sensitivity of pure ZnO thick film is about three times larger than those of ZnO-CuO thick films. We suggest that the promotion of maximum sensitivity is caused by low packing and the increase of chemical adsorptions for $O_{2}$ gas.