• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.1-7
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• The monthly packaging world
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• s.110
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• pp.104-109
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• 2002

• The monthly packaging world
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• s.268
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• pp.91-95
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• 2015

• Corrugated packaging logistics
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• v.1 no.4
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• pp.143-146
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• 1994

• The monthly packaging world
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• s.128
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• pp.130-147
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• 2003

• The monthly packaging world
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• s.115
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• pp.146-151
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• 2002

• The monthly packaging world
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• s.204
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• pp.60-65
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• 2010

• The monthly packaging world
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• s.139
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• pp.53-57
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• 2004

• Corrugated packaging logistics
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• v.1 no.3
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• pp.89-94
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• 1994

• Corrugated packaging logistics
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• v.1 no.3
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• pp.95-100
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• 1994