• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.217-221
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• 2022

Container system automatically controlled in its atmosphere of high CO₂/low O₂ was devised to contain and store pork belly meat at chilled temperature. The meat in the container system was compared in the quality preservation at 0℃ for 21 days to that in air-filled container and vacuum package. The container atmosphere could be controlled to be of 47~60% CO₂ and 7~10% O₂ through time-controlled intermittent CO₂ injection. The controlled atmosphere in the developed system was effective in suppressing pH change and aerobic bacterial growth contributing to sensory quality preservation. Compared to control of air-filled container, vacuum packaging showed lower microbial growth and slower pH change on the meat but with high drip loss. The devised container system to keep high CO₂ and mildly low O₂ concentrations is effective in the meat quality preservation on overall, and may be extended to a variety of meat products with possible modification tuned for product requirements.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.7-11
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• 2003

The semiconductor chips or electronic components generate heat, which causes malfunction of the parts when it was not cooled properly. Bulky heat sink and cooling fan are used to get rid of the heat. However, with this bulky system, it is hard to integrate the electronics system in a small scale. The cooling efficiency of the system depends on the surface area of the heat sink, thermal conductivity of the material and the method of integration. In order to develop a novel cooling system, a micro-heatsink with a large surface area while retaining small volume was fabricated by electroless deposition of gold/copper inside a Track-etched membrane. The structure of the micro-heatsink was investigated using SEM or optical microscope. It was also found that the micro-heatsink is more efficient than a flat copper plate.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.29-33
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• 2010

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.211-215
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• 2004

Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.7-12
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• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.384-389
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• 2001

New methods are studied that can suppress EMI noises, especially common mode currents produced in the motor drive system. One is a packaging technique that forms power converters using a four-layer printed power circuit board. The other is a method based on the generation mechanism of common mode currents which was developed from experimental analyses. It is proved by experiments that the former can effectively control common mode currents, including radiated emissions, and the latter can suppress them without any compensators between the inverter and the motor.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.1-4
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• 2015

Qualification includes all activities to demonstrate that a product meets and exceeds the reliability goals. Manufacturers need to spend time and resources for the qualification processes under the pressure of reducing time to market, as well as offering a competitive price. Failure to qualify a product could result in economic loss such as warranty and recall claims and the manufacturer could lose the reputation in the market. In order to provide valid and reliable qualification results, manufacturers are required to make extra effort based on the operational and environmental characteristics of the product. This paper discusses optimal interval censoring design for reliability prediction of electronic packages under limited time and resources. This design should provide more accurate assessment of package capability and thus deliver better reliability prediction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.97-102
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• 2000

We have studied etching characteristic of Ta film using Electron Cyclotron Resonance (ECR) etcher system. Microwave source power. RF bias power. and working pressure were varied to investigate the etch Profile. And we have used two step etching method to acquire the goWe have studied etching characteristic of Ta film using Electron Cyclotron Resonance (ECR) etcher system. Microwave source power. RF bias power. and working pressure were varied to investigate the etch Profile. And we have used two step etching method to acquire the good etch profile preventing the microloading effect.od etch profile preventing the microloading effect.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.13-17
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• 2002

In ceramic systems, many components including embedded passives and TRL(transmission line) are used for composition of 3-dimensional circuit. So the exact analysis on this components must be performed. As for the TRL's, material properties including electrical conductivity of metal, loss factor and effective dielectric constant of dielectric material and geometrical factors like roughness of surface, vias, dimension of stripline structure have a large effect on the charactersistics of transmission lines. In this research, effect of material and geometrical factors on the characteristics of stripline structure is analyzed and quantified by simulation and measurement.