• Title/Summary/Keyword: package model

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The high-rate brittle microplane concrete model: Part I: bounding curves and quasi-static fit to material property data

  • Adley, Mark D.;Frank, Andreas O.;Danielson, Kent T.
    • Computers and Concrete
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    • v.9 no.4
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    • pp.293-310
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    • 2012
  • This paper discusses a new constitutive model called the high-rate brittle microplane (HRBM) model and also presents the details of a new software package called the Virtual Materials Laboratory (VML). The VML software package was developed to address the challenges of fitting complex material models such as the HRBM model to material property test data and to study the behavior of those models under a wide variety of stress- and strain-paths. VML employs Continuous Evolutionary Algorithms (CEA) in conjunction with gradient search methods to create automatic fitting algorithms to determine constitutive model parameters. The VML code is used to fit the new HRBM model to a well-characterized conventional strength concrete called WES5000. Finally, the ability of the new HRBM model to provide high-fidelity simulations of material property experiments is demonstrated by comparing HRBM simulations to laboratory material property data.

ASP 매출 변화에 관한 동태적 분석: SD 기법을 활용한 버전 차별화 전략을 중심으로

  • Kim, Sang-Jun;Lee, Jin-Su;Lee, Sang-Geun
    • 한국경영정보학회:학술대회논문집
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    • 2008.06a
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    • pp.454-471
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    • 2008
  • This study suggests the dynamic pricing model which reveals the organic relationship between ASP (Application Service Provider) price and the related factors, using system dynamics methodology. Basically, we applied the law of supply and demand for analyzing price changes. Then, we deducted ASP price, focusing on fixed cost and variable cost. We also researched the customer's buying behavior according to version differentiation policy. In the version policy, we set up the proposition about customer's satisfaction and willingness-to-pay, using option system. As a result, this research designed the simulation model which analyzes the changes of the sales according to version differentiations and customer's willingness-to-pay. Through this research, we can find effective version differentiation strategies. This paper also found that the larger the number of package, the greater the demand and customer's willingness-to-pay. The increase of the number of package causes the increase of the sales. The increase of the sale is not exactly relative to the number of package. Drawing S-curve, the sales was increased. This dynamic pricing model suggests the ground that the ASP price changes based on the existing version differentiation theory and the demand of customers can affect the changes of the sales. We expect that this model suggests a clear standard of ASP pricing by combining real cases.

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A Driver Space Design of Passenger Vehicle using Forward Kinematics Model (Forward Kinematics 모델을 이용한 자동차 운전공간의 설계)

  • Jeong, Seong-Jae;Park, Min-Yong
    • Journal of the Ergonomics Society of Korea
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    • v.21 no.2
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    • pp.47-58
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    • 2002
  • This research suggested the mathematical model (forward kinematics method) to provide the reference points of driver space more easily and accurately in designing the package layout of vehicle interiors. For this purpose, the lengths of body segments of drivers and various joint angles occurred while were used. The length data between joints for the mathematical model were extracted from $SAFEWORK^{\circed{R}}$ as well as 95th percentile male and 5th percentile female body dimensions were utilized. In addition, the angles of body segments were applied on its diverse values within proper ranges in order to compare them each other. the mathematical model in this study was based on the concept of converting polar coordinate system to Cartesian coordinate system so that reference points of driver space were acquired in Cartesian coordinate system after using the segment lengths of drivers and the joint angles of driving postures as an input of polar coordinate system. It is expected that reference points of driver space obtained from this research are helpful to the study on package layout that is appropriate for physical characteristics of drivers.

Influence of the Biodegradable Packaging Material on the Rheological Properties of Eggs (생분해성 포장재질이 달걀의 물성에 미치는 영향 연구)

  • Kim, Ji-Hyun;Park, Jong-Shin;Kim, Byung-Yong
    • Applied Biological Chemistry
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    • v.40 no.6
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    • pp.525-530
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    • 1997
  • The changes in rheological properties of egg white stored in biodegradable package were investigated by pH change, failure stress and stress relaxation curve, and compared with control without package and complex PE. Initial pH of egg white stored in biodegradable package changed from 8.39 to 9.3 after 8 day storage, showing similar trend in pH change as that of control without package. Initial 14.25 N failure stress was changed into 6.76 N in biodegradable package and 9.31 N in control. Complex PE, having a relatively low gas permeability compared to biodegradable package, showed less pH changes from 8.30 to 8.81, but a greater decrease in failure stress into 5.29 N, indicating more deteriorating effect in complex PE package. Viscoelastic constants, such as elastic constant and viscous constant, obtained from stress-relaxation curve by three element Maxwell model were not significantly different between control and biodegradable package, but eggs stored in complex PE showed greater changes during storage. Therefore, the permeability seems to be the major factors to influence the rheological properties of egg and biodegradable packaging materials showed a potential substitute package for eggs.

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A Study on Improving the Efficiency of Logistics Networks in Express Package Deliveries

  • Ko, Chang-Seong;Chung, Ki-Ho;Ko, Hyun-Jeung
    • Journal of Navigation and Port Research
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    • v.36 no.4
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    • pp.305-311
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    • 2012
  • The market competition of express package deliveries in Korea is severe because a large number of companies have entered into the market. This study thus suggests an approach to the reconfiguration of express service networks with respect to the strategy partnership of closing/keeping service centers among companies involved and the adjustments of their cutoff times. For this we propose an integer programming model and a genetic algorithm based solution procedure for allowing companies involved to maximize their incremental profit. An illustrative numerical example is presented to demonstrate the practicality and efficiency of the proposed model.

A Study on ERP Package Assessment Model in Business Firms

  • Lee, Sun-Kyu;Yim, Ki-Heung
    • 한국디지털정책학회:학술대회논문집
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    • 2004.11a
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    • pp.343-358
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    • 2004
  • Many IT specialists say that ERP (Enterprise Resource Planning) is the best way to manage resources in enterprise effectively. Actually lots of companies are using ERP solutions in the hope of getting competitiveness and employing global standard business practice. Wishing to take advantage of ERP S/W, companies have a preference for purchasing it and outsourcing ERP project. This paper is focusing on ERP Package assessment model in business firms. This paper finds out what differences there are in purchasing ERP S/W for organization characteristics and building characteristics, and suggests some guidelines of S/W development to venders. The results would be strong implications for ERP vendors. Especially this paper identify what the reasons and the checkpoints are when firms introduce ERP S/W. To do this, this paper used empirical data obtained from companies in South Korea and analyzed it using statistical software.

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The Analysis of Heat Transfer through the Multi-layered Wall of the Insulating Package

  • Choi, Seung-Jin
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.12 no.1
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    • pp.45-53
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    • 2006
  • Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

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A Study on ERP package Assessment Model in Business Firms

  • Yim, Ki-Heung
    • Journal of Digital Convergence
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    • v.2 no.2
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    • pp.101-118
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    • 2004
  • Many IT specialists say that ERP (Enterprise Resource Planning) is the best way to manage resources in enterprise effectively Lots of companies are using ERP solutions in the hope of getting competitiveness and employing global standard business practice. Wishing to take advantage of ERP S/W, companies have a preference for purchasing it and outsourcing ERP project. This paper focuses on ERP Package assessment model in business firms. This paper finds out what differences there are in purchasing ERP S/W for organization characteristics and building characteristics, and suggests some guidelines of S/W development to vendors. The results would be strong implications for ERP vendors. Especially this paper identifies what the reasons and the checkpoints are when firms introduce ERP S/W. To do this, this paper uses empirical data obtained from companies in South Korea and analyzes it using statistical software.

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Personalized Travel Path Recommendations with Social Life Log (소셜 라이프 로그를 이용한 개인화된 여행 경로 추천)

  • Paul, Aniruddha;Lim, Jongtae;Bok, Kyoungsoo;Yoo, Jasesoo
    • Proceedings of the Korea Contents Association Conference
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    • 2017.05a
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    • pp.453-454
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    • 2017
  • The travellers using social media leave their location history in the form of trajectories. These trajectories can be bridged for acquiring information, required for future recommendation for the future travelers, who are new to that location, providing all sort of information. In this paper, we propose a personalized travel path recommendation scheme based on social life log. By taking advantage of two kinds of social media such as travelogue and community contributed photos, the proposed scheme can not only be personalized to user's travel interest but also be able to recommend a travel path rather than individual Points of Interest (POIs). It also maps both user's and routes' textual descriptions to the topical package space to get user topical package model and route topical package model (i.e., topical interest, cost, time and season).

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Modeling and Thermal Characteristic Simulation of Power Semiconductor Device (IGBT) (전력용 반도체소자(IGBT)의 모델링에 의한 열적특성 시뮬레이션)

  • 서영수;백동현;조문택
    • Fire Science and Engineering
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    • v.10 no.2
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    • pp.28-39
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    • 1996
  • A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

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