• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.42-58
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• 1999

Packaging materials and articles that are used in food contact applications can transfer constituents in the foodstuffs. This kind of risk of possible health hazards to consumers has been generally recognized for a long time with the consequence of establishing corresponding food regulations in most developed countries. However, the language of these laws, their interpretation, and their level of enforcement vary from country to country. Accordingly, the actual migrating levels from packaging materials can be varied depending on the migration testing methods as prescribed in the national legislation in each countries. Therefore, there are needs of elimination of non-tariff trade barriers raised by sanitary and phytosanitary or technical measures under the Final Act of the UR Agreement. In this connection, the EU and USA are currently in an ongoing process of legislation harmonization to overcome potential barriers to free trade. In general, regulations governing component transfer in the USA are more complicated and comprehensive than similar regulations in Europe. In future, standard migration testing procedures for microwave heat susceptor materials and for the use of fatty food simulant should be established and also harmonized among countries. The objective of this investigation is to compare the current regulations for migration testing for plastic containers and packaging materials in USA, EU and Korea or Japan. For those regulations, Korean standards are required to be kept up with the international standards. By doing this, the related Korean regulation could be amended along with the worldwide progress for harmonization.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Proceedings of the Korean Geotechical Society Conference
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• 1991.10a
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• pp.123-132
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• 1991

The GEOKST program was used to solve the tunnel example problem. The package can solve such geotechnical problem as excavation, embankment, foundations, etc., in which the soil can be modeled by various elastoplastic geomaterial models. The main objective was to consider the effects of excavation depth to the face of the tunnel on the stability of the ground and support system. Depended on the strength of the ground materials, the limit excavation depth without any support system could be established by analyzing three-dimensional excavation problem. In this given example problem, the strengths of the ground materials were enough for the stability of the tunnel without any support system up to fairly deep excavation and the maximum tunnel section displacement was stabilized as the excavation proceed. The asymptotic value was approximately the same as that of the plane strain analysis. Thus, assuming the plain strain condition and simulation the actual excavation procedure, the maximum tunnel section displacement was caculated after final step. The maximum calculated displacement occured at the top section of the tunnel geometry and was about 8mm.

• Bulletin of the Korean Chemical Society
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• v.25 no.7
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• pp.1061-1064
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• 2004

Molecular visualization software has the common objective of manipulation and interpretation of data from numerical simulations. They visualize many complicated molecular structures with personal computer and workstation, to help analyze a large quantity of data produced by various computational methods. However, users are often discouraged from using these tools for visualization and analysis due to the difficult and complicated user interface. In this regard, we have developed an easy-to-use three-dimensional molecular visualization and analysis program named POSMOL. This has been developed on the Microsoft Windows platform for the easy and convenient user environment, as a compact program which reads outputs from various computational chemistry software without editing or changing data. The program animates vibration modes which are needed for locating minima and transition states in computational chemistry, draws two and three dimensional (2D and 3D) views of molecular orbitals (including their atomic orbital components and these partial sums) together with molecular systems, measures various geometrical parameters, and edits molecules and molecular structures.

• Advanced Composite Materials
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• v.18 no.4
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• pp.327-338
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• 2009

In this paper, through an evaluation process conducted on several designs of mini-LIPCA (Lightweight Piezo-Composite curved Actuator), an optimal design of a mini-LIPCA has been proposed. Comparing with the LIPCA-C2, the design of the mini-LIPCA comes with reduced overall size and a thinner active layer. Since a variation in the number and lay-up of fiber composite layers may strongly affect the performance of the device, one is able to configure several designs of mini-LIPCA. The evaluation process is then followed in order to determine a configuration which characterizes the possibly optimal performance. That is, a design of a mini-LIPCA is said to be optimal if it is capable of producing a maximum out-of-plane displacement. The size of the LIPCA to be investigated was selected to be $10\;mm\;{\times}\;20\;mm$ in which the thickness of PZT plate is about 0.1 mm. The thickness of glass/epoxy and carbon/epoxy are about 0.09 mm and 0.1 mm, respectively. The evaluation process has been conducted thoroughly, i.e., analytical estimation, numerical approximation and the experimental measurement are all involved. Firstly, the design equation was used to calculate essential parameters of proposed lay-up configurations. Secondly, ANSYS, a commercial FEA package, was utilized to estimate displacement outputs of the actuators upon being excited. Finally, experimental measurements were able to verify the predicted results.

• Korean Journal of Materials Research
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• v.17 no.12
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• pp.637-641
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• 2007

The total energy and strength of Mg alloy doped with Al, Ca and Zn, were calculated using the density functional theory. The calculations was performed by two programs; the discrete variational $X{\alpha}\;(DV-X{\alpha})$ method, which is a sort of molecular orbital full potential method; Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The fundamental mixed orbital structure in each energy level near the Fermi level was investigated with simple model using $DV-X{\alpha}$. The optimized crystal structures calculated by VASP were compared to the measured structure. The density of state and the energy levels of dopant elements was discussed in association with properties. When the lattice parameter obtained from this study was compared, it was slightly different from the theoretical value but it was similar to Mk, and we obtained the reliability of data. A parameter Mk obtained by the $DV-X{\alpha}$ method was proportional to electronegativity and inversely proportional to ionic radii. We can predict the mechanical properties because $\Delta{\overline{Mk}}$is proportional to hardness.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.10 no.3
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• pp.71-77
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• 1996

This paper is described on the eddy current for a peripheral magnetic objects of under ground power cable. The materials of cable rack is used FRP and SUS in the place of iron. Each specimen were measureed for eddy current loss and Hysteresis loss by Epstein's method. The results is compared each other. Hysteresis loss is inversely proportional to $\textrm{f}^{0.6}$ of frequence as supply voltage is constant. Also, iron loss is increased to 0.86 times for varinace of frequency from 60[Hz] to 50[Hz] as a maxium flux density is constant. In the case of Fe, Hysteresis loss is above 70[% ] of total iron loss. In the other hand, SUS is decreased to go[%] of Fe. by the simulation results using Loss Program Package. The iron loss of materials SUS, FRP is near zeor by Epstein's method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.271-271
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• 2010

$BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.322-323
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• 2008

Multi layered thin films with ZnS/$Na_3AlF_6$/ZnS were deposited on glass substrate by thermal evaporator precess and simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. ZnS and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cu was chosen as mid reflective material. Optical properties including color effect were systematically studied. in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$. of optical thickness showed mixed color range between bluish green and red purple, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.69-73
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• 2008

This article shows that the susceptibility of the device pattern to thermal stress-induced damage has a strong dependence on its proximity to the device comer in semiconductor devices utilizing lead-on-chip (LOC) die attach technique. The result, as explained based on numerical calculation and experiment, indicateds that the stress-driven damage potential of the passivation layer is the highest at the device comer. Thus, the bonding pads, which are very susceptible to passivation damage, should be designed to be located along the central region rather than the peripheral region of the device.