• 펄프종이기술
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• 제39권2호
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• pp.68-77
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• 2007

It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

• 한국디자인학회:학술대회논문집
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• 한국디자인학회 2002년도 봄 학술발표회 논문집
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• pp.202-203
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• 2002

• 대한인간공학회지
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• 제18권2호
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• pp.57-69
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• 1999

The primary objective of this research was to suggest the design dimensions of automotive seating package that has an important effect upon seating package design. To conduct the research, a set of manikin dimensions that are representative for Korean was determined by using a statistical scheme. With these dimensions, we generated nine manikins for male and female, respectively. Also, the preferred driving posture was investigated using the experimental setup. To find each joint angle for subjects, a driving monitoring system was developed and a three dimensional motion analysis system was employed. The joint angle for the subject was established and compared with related literature. With the generated manikins and each joint angle, the driving posture was simulated by using SAFEWORK that is a program to generate manikins. The positions and adjustable ranges from the accelerator heel point to the hip point and the steering wheel center point that are important variables in order to design seating package were suggested. Further research is needed to determine the seating package dimensions three dimensionally.

• 한국인쇄학회지
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• 제30권2호
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• pp.47-58
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• 2012

The purpose of this study is to provide how various elements of package design affect on consumer response. Those consumers who is living at Sung-nam district and who is using or have used herbal shampoo were selected as respondents for this research. For testing hypotheses. frequency analysis, reliability analysis, and multi regression analysis were utilized with SPSS 12. All elements of package design influenced on brand attitude and purchasing intention. Typography is the most effective element influencing on brand attitude, while illustration is on purchasing intention. This result could be a useful reference for package designer and brand manager to trigger positive brand attitude and purchasing intention.

• 한국산학기술학회논문지
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• 제11권3호
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• pp.853-858
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• 2010

본 논문은 알루미늄의 양극산화를 통하여 알루미나(Alumina, $Al_2O_3$)를 형성함으로써 알루미나 및 알루미늄의 적층 구조 DRAM 패키지 기판을 구현하였다. 전송선 기반의 설계를 적용하기 위해 2차원 전자장 시뮬레이션을 수행하였다. 분석 결과를 바탕으로 새로운 기판에 적용할 신호선의 폭 및 간격과 알루미나 두께 등의 설계인자를 최적화하였다. 테스트 패턴 제작 및 측정을 통해 설계인자를 검증하였으며, 이를 바탕으로 설계 룰(Design rule)을 정하고 패키지의 개념 설계 및 상세 설계를 진행하여 DDR2 DRAM 패키지 기판을 성공적으로 제작하였다.

• 디자인융복합연구
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• 제18권1호
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• pp.49-60
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• 2019

이 연구는 고령화 사회 및 개인핵가족사회에 진입하는 우리나라의 현 상황에서 가정편의식 제품을 편리하게 사용할 수 있는 디자인에 대하여 알아보고자 한다. 연구방법으로 첫째, 가정편의식 이론적 고찰로서 문헌자료 및 선행연구조사를 하였다. 둘째, 디자인 조사로서 가정편의식 디자인 사례 분류를 하였다. 셋째, 실제 사용하는 이용자를 대상으로 사용자 평가 및 감성평가 조사를 실시하였다. 제품 디자인 감성평가에 의한 요인분석 결과 3개의 대표 요인으로 분류되어졌다. 1요인은 "형태적 감성", 2요인은 "기능적 감성", 3요인은 "심리적 감성"으로 연구자에 의한 대표 감성언어 명칭을 3가지로 부여하였다. 가정편의식 패키지 디자인으로 다음과 같이 제작되어져야할 것이다. 첫째, 용기를 들때 대부분 비닐용기로 되어져있어 미끄러지고 떨어뜨리기 쉽기 때문에 용기에 그립감을 주어 잘 떨어뜨리지 않게 한다. 둘째, 손목이나 손가락 힘이 약한 고령자를 위하여 쉽게 뜯을 수 있게 제작 한다. 또한, 색상과 관련하여 차가운 한색계열 색상보다는 따뜻한 난색 계열색상을 이용하여 제공한다.

• 디자인학연구
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• 제11권2호
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• pp.179-188
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• 1998

현재 사회는 커뮤니케이션(communication)의 과잉의 시대로 보여진다. 다양화된 상품과 정보통신의 발달로 언어적 특성의 사회는 시각적 환경으로 변화되었다. 이런 변화의 시대 속에 패키지가 소비자와 올바른 커뮤니케이션을 하기 위해서는 마케팅계획과 마케팅전략의 분석을 통해 소비자가 원하는 요구(needs)를 파악하고 형상화시켜 전달해야 된다고 보여진다. 이러한 올바른 커뮤니케이션 방법을 제시하기 위하여 본고에서는 마케팅 개념과 환경의 변화를 살펴보았으며, 마케팅 활동과 패키지 활동의 유기적 관계에 대해서 연구하여 패키지 프로세스로의 도입을 시도하였다. 본고의 목적은 현재 소비자 기호 변화에 따른 마케팅 환경 변화에 대응하는 커뮤니케이션 도구로서의 패키지 디자인을 개발함에 있어 마케팅 전략을 도입하여 이론적 프로세스를 개발하고, 또 시각화시키는데 있다.

• 전자공학회논문지A
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• 제32A권12호
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• pp.149-158
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• 1995

This paper describes the development of a software tool LCD FRAME that may guide the analyzing process for the electrical characteristics and the design procedure for constructing the thin film transistor liquid crystal display(TFT/LCD) packages. LCD FRAME can analyze its electrical characteristics from the TFT/LCD system package configuration, and provide the design variables to meet the user's requirements. These analysis and design procedure can be done in real time according to the model at simplified package level of TFT/LCD. LCD_FRAME is an object-oriented expert system which considers package elements as objects. With this LCD_FRAME software tool, we analyzed the I-V characteristics of a-Si TFT and its signal distortion which has maximum 1.58 $\mu$s delay along the panel scan line of the package containing 480 ${\times}$ 240 pixels. We designed the package structure of maximum 6.35 $\mu$s signal delays and 3360 ${\times}$ 780 pixels, and as a result we showed that the proper structure of 20 $\mu$m scan line width, 60$\mu$m panel TFT gate width and 8 $\mu$m gate length. This LCD_FRAME software tool provides results of the analysis and the design in the form of input files of the SPICE program, text data files, and graphic charts.

• 한국소음진동공학회논문집
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• 제14권2호
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• 대한기계학회논문집A
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• 제20권4호
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• pp.1347-1355
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• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.