• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1313-1314
• /
• 2007

This paper presents organic thin-film transistors (OTFTs) with poly(3-hexylthiophene)(P3HT) semiconductor and several polymeric dielectric materials of poly(vinyl phenol)(PVP), poly(vinyl alcohol)(PVA), and polyimide(PI) by using soluble process. The fabricated OTFT's have inverted staggered structure using transmission line method(TLM) pattern. In order to evaluate the electrical characteristics of the OTFT, capacitance-voltage(C-V) and current-voltage(I-V) were measured. C-V graphs were measured at several frequencies of 100 Hz, 1 kHz, and 1 MHz and ID-VDS graphs according to $V_{GS}$. The current on/off ratio and threshold voltage with each of PVP, PVA, and PI based OTFTs were measured to $10^3$, and -0.36, -0.41, and -0.62 V. Also, the calculated mobility with each of PVP, PVA, and PI was 0.097, 0.095, and 0.028 $cm^{2}V^{-1}s^{-1}$, respectively. In the cases of PVP and PVA, the hole mobility of P3HT was in excellent agreement with the published value of 0.1 $cm^{2}V^{-1}s^{-1}$.

• Applied Chemistry for Engineering
• /
• v.30 no.5
• /
• pp.523-529
• /
• 2019

In this study, we investigated the pretreatment technologies of volatile organic compounds (VOCs) which is a problem as the semiconductor and display industry develops recently. The conventional concentrator used in the direct combustion system, is easily contaminated by the exhaust gas in the manufacturing process of the display, resulting in the low treatment efficiency of generated VOCs. Physical/Chemical analyses of the exhaust gas showed high boiling point and viscosity in addition to a large amount of molecular weight alcohols and oil components. In this study, we tried to treat degrading materials by using the heat exchanger in a pretreatment facility and some materials degrading the concentrator were condensed more than 90%. In addition, it was also confirmed that an auxiliary device of the grease filter could remove the redispersion polymer oil from the heat exchanger.

• Journal of the Korea Organic Resources Recycling Association
• /
• v.31 no.2
• /
• pp.5-18
• /
• 2023

As a result of the survey on the emission status of fluorine-based chemicals in Korea, 13 kinds of substances, including hydrogen fluoride (91%) and perfluorocarbons (5%), were emitted in workplaces. By regional groups, about 98% was emitted in the Gyeongbuk, Gyeonggi and Chungcheong regions, and about 98% in three sectors of industry related to manufacture of electronic parts, chemicals and non-metallic mineral products. The detection status of PFOS and PFOA in domestic main rivers was continuously detected in the Nakdong River, the Geum River and the Anseong Stream estuary with high fluorine-related chemical emissions, and four sites of PFOS and two sites of PFOA were detected for the first time in 2021. PFOS and PFOA were continuously detected in relatively high concentrations in the rivers where there were many semiconductor and display related sectors of industry.

• Journal of Adhesion and Interface
• /
• v.24 no.3
• /
• pp.86-94
• /
• 2023

To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm² and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.151-151
• /
• 2009

Recently, there has been increasing interest in amorphous oxide semiconductors to find alternative materials for an amorphous silicon or organic semiconductor layer as a channel in thin film transistors(TFTs) for transparent electronic devices owing to their high mobility and low photo-sensitivity. The fabriction of amorphous oxide-based TFTs at room temperature on plastic substrates is a key technology to realize transparent flexible electronics. Amorphous oxides allows for controllable conductivity, which permits it to be used both as a transparent semiconductor or conductor, and so to be used both as active and source/drain layers in TFTs. One of the materials that is being responsible for this revolution in the electronics is indium-zinc-tin oxide(IZTO). Since this is relatively new material, it is important to study the properties of room-temperature deposited IZTO thin films and exploration in a possible integration of the material in flexible TFT devices. In this research, we deposited IZTO thin films on polyethylene naphthalate substrate at room temperature by using magnetron sputtering system and investigated their properties. Furthermore, we revealed the fabrication and characteristics of top-gate-type transparent TFTs with IZTO layers, seen in Fig. 1. The experimental results show that by varying the oxygen flow rate during deposition, it can be prepared the IZTO thin films of two-types; One a conductive film that exhibits a resistivity of $2\times10^{-4}$ ohm${\cdot}$cm; the other, semiconductor film with a resistivity of 9 ohm${\cdot}$cm. The TFT devices with IZTO layers are optically transparent in visible region and operate in enhancement mode. The threshold voltage, field effect mobility, on-off current ratio, and sub-threshold slope of the TFT are -0.5 V, $7.2\;cm^2/Vs$, $\sim10^7$ and 0.2 V/decade, respectively. These results will contribute to applications of select TFT to transparent flexible electronics.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.363-363
• /
• 2014

Ruthenium (Ru) has attractive material properties due to its promising characteristics such as a low resistivity ($7.1{\mu}{\Omega}{\cdot}cm$ in the bulk), a high work function of 4.7 eV, and feasibility for the dry etch process. These properties make Ru films appropriate for various applications in the state-of-art semiconductor device technologies. Thus, it has been widely investigated as an electrode for capacitor in the dynamic random access memory (DRAM), a metal gate for metal-oxide semiconductor field effect transistor (MOSFET), and a seed layer for Cu metallization. Due to the continuous shrinkage of microelectronic devices, better deposition processes for Ru thin films are critically required with excellent step coverages in high aspect ratio (AR) structures. In these respects, atomic layer deposition (ALD) is a viable solution for preparing Ru thin films because it enables atomic-scale control of the film thickness with excellent conformality. A recent investigation reported that the nucleation of ALD-Ru film was enhanced considerably by using a zero-valent metallorganic precursor, compared to the utilization of precursors with higher metal valences. In this study, we will present our research results on the synthesis and characterization of novel ruthenium complexes. The ruthenium compounds were easy synthesized by the reaction of ruthenium halide with appropriate organic ligands in protic solvent, and characterized by NMR, elemental analysis and thermogravimetric analysis. The molecular structures of the complexes were studied by single crystal diffraction. ALD of Ru film was demonstrated using the new Ru metallorganic precursor and O2 as the Ru source and reactant, respectively, at the deposition temperatures of $300-350^{\circ}C$. Self-limited reaction behavior was observed as increasing Ru precursor and O2 pulse time, suggesting that newly developed Ru precursor is applicable for ALD process. Detailed discussions on the chemical and structural properties of Ru thin films as well as its growth behavior using new Ru precursor will be also presented.

• Korean Journal of Materials Research
• /
• v.6 no.1
• /
• pp.106-115
• /
• 1996

본 연구에서는 PET(PentaEthoxy Tanatalum:Ta(OC2H5)5) 유기금속 화합물 전구체를 사용하여 차세대 초고집적회로 제조시 고유전체 물질로 유망한 Ta2O5 박막을 열화학증착 방법에 의하여 증착하였다. 본 증착실험을 통하여 여러 가지 운속기체, 기판온도, 반응압력 등의 공정변수가 층덮힘에 미치는 영향을 고찰하였으며 Monte Carlo 전산모사 결과와 기판온도 변화에 따른 층덮힘 패턴의 변화에 대한 실험결과를 비교하여 부착계수를 산출하였다. 운송기체로는 N2, Ar, He을 바꿔가며 실험하였으며 He>N2>Artns으로 층덮힘이 양호한 것으로 나타났다. 이는 운송기체의 종류에 따라 운동량 확산도, 열 확산도, 물질 확산도 등의 이동현상 특성값들이 다르기 때문이라 생각된다. 기판온도의 증가는 운송기체의 종류에 관계없이 층덮힘을 악화시켰으며 도랑내부에서의 Knudsen 확산과 표면반응물의 탈착에 비해 표면반응이 보다 지배적인 역할을 담당함을 알 수 있었다. 또한 질소를 운송기체로 사용한 경우에 부착계수의 겉보기 활성화 에너지는 15.9Kcal/mol로 나타났다. 그리고 3Torr 이하에서 반응압력이 증가하는 반응압력이 증가하는 경우에는 물질 확산도의 감소 효과 때문에 층덮힘이 악화되었다. 본 연구결과 3Torr, 35$0^{\circ}C$에서 He 운송기체를 이용한 경우가 가장 우수한 층덮힘을 얻을 수 있는 최적 공정 조건임을 알 수 있었다.

• Journal of Industrial Technology
• /
• v.28 no.A
• /
• pp.19-22
• /
• 2008

In recent years, much attention has been paid to "Photocatalytic oxidation" as an alternative technique, where the pollutants are degraded by UV-irradiation in the presence of a semiconductor suspension such as titanium dioxide. $TiO_2$ is the most often used photocatalyst due to its considerable photocatalytic activity, high stability, non-environmental impact and low cost. 1n this research, the photocatalytic degradation of humic acid, acetaldehyde and methylene blue in $UV/TiO_2$ systems has been stydied. The effect of calcination temperature for manufacturing of $TiO_2$ photocatalysts and type of photocatalysts on photodegradation has been investigated. Photocatalysts with various metal ions(Mn, Fe, Cu and Pt) loading are tested to evaluate the effects of metal ions impurities on photodegradation. The photodegradation efficiency with $Pt-TiO_2$ or $Fe-TiO_2$ or $Cu-TiO_2$ is higher than Degussa P-25 powder. However, the photodegradation efficiency with $Mn-TiO_2$ is lower than Degussa P-25 powder. The photocatalytic properties of the nanocrystals were strongly dependent upon the crystallinity, particle size, standard reduction potential of various transition metal and electronegativity of various transition metal. As a result photocatalysts with various metal ion loading evaluated the effect of photodegradation.

• Proceedings of the Korean Environmental Health Society Conference
• /
• 2004.06a
• /
• pp.139-141
• /
• 2004

Emission of volatile organic compounds (VOCs) are one of the popular issues of air pollution in Korea, especially in Ulsan city, where much chemical plants are located. It is necessary to detect the VOCs precisely in order to control the air pollution during the plant operation. In general, to examine the concentration of VOCs, gas chromatography (GC) is used. However, most plant operators are using the easy operating handy VOCs detector, which is imported, because GC is difficult to treat and the installation price is high although it is very useful equipment. Therefore, the development of the VOCs detector becomes one of the urgent issues. In this study, sensing characteristics of selected VOCs for the development of VOCs detector was investigated. Semiconductor sensor and several VOCs such as aliphatic, aromatic, and non-homogeneous hydrocarbons were used for the experiment. Through the various experiments, sensor used in the experiment has shown high linearity and sensitivity for most VOCs in the range of 1 -500 ppm concentration.

• Journal of Surface Science and Engineering
• /
• v.38 no.1
• /
• pp.28-36
• /
• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.