• 한국전기전자재료학회논문지
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• 제25권5호
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• pp.353-360
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• 2012

As semiconductor device technology continuously shrinks, low-open area etch process prevails in front-end etch process, such as contact etch as well as one cylindrical storage (OCS) etch. To eliminate over loaded wafer processing test, it is commonly performed to emply diced small coupons at stage of initiative process development. In nominal etch condition, etch responses of whole wafer test and coupon test may be regarded to provide similar results; however, optical emission spectroscopy (OES) which is frequently utilize to monitor etch chemistry inside the chamber cannot be regarded as the same, especially etch mask is not the same material with wafer chuck. In this experiment, we compared OES data acquired from two cases of etch experiments; one with coupon etch tests mounted on photoresist coated wafer and the other with coupons only on the chuck. We observed different behaviors of OES data from the two sets of experiment, and the analytical results showed that careful investigation should be taken place in OES study, especially in coupon size etch.

• 한국재료학회지
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• 제25권2호
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• pp.100-106
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• 2015

Plasma properties of dielectric barrier discharges (DBDs) at atmospheric pressure were measured and characterized using optical emission spectroscopy. Optical emissions were measured from argon, nitrogen, or air discharges generated at 5-9 kV using 20 kHz power supply. Emissions from nitrogen molecules were markedly measured, irrespective of discharge gases. The intensity of emission peaks was increased with applied voltage and electrode gap. The short wavelength peaks (315.9 nm and 337.1 nm) measured at the middle of DBDs were significantly increased with applied voltage. The optical emission from DBDs decreased with the addition of oxygen gas, which was especially significant in argon discharge. Emission from oxygen molecules cannot be measured from air discharge and argon discharge with 4.8% oxygen. The emission intensity at 337.1 nm and 357.7 nm related with nitrogen molecule was sensitively changed with electrode types and discharge voltages. However, the pattern of argon emission spectrum was nearly the same, irrespective of electrode type, oxygen content, and discharge voltage.

• 플랜트 저널
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• 제16권3호
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• pp.47-52
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• 2020

본 연구에서는 알루미늄으로 제작된 심해 장비의 부식 저항 능력 향상시키기 위해 알루미늄 부식 방지 방법과 측정방법을 조사하였다. 조사된 부식 방지 방법은 Cathodic Protection(음극화 보호), Conversion Coating, Anodizing, 및 Organic Coating이었다. 그리고 간단하게 조사된 측정 방법은 Scanning Electron Microscope (SEM), Electrochemical Impedance Spectroscopy (EIS), Glow discharge optical emission spectrum spectroscopy (GD-OES), Fourier Transform Infrared Spectroscopy (FT-IR), Transmission Electron Microscopy (TEM), X-ray Photoelectron Spectroscopy (XPS), Scanning Vibrating Electrode Technique (SVET), Contact Angle(접촉각), Interfacial Tension (경계면 장력)이었다. 알루미늄 부식을 방지하기 위해 널리 사용되는 방법은 Anodizing과 Organic Coating이었으며, 부식 측정을 위해서는 여러 방법들이 골고루 사용되었다. 그 중 많이 사용되는 방법은 표면의 구조를 관찰하 위한 SEM과 부식 저항 능력을 측정하기 위한 접촉각 측정이었다.