• 제목/요약/키워드: ohmic layer

검색결과 168건 처리시간 0.027초

전사지를 이용한 다전지식 평관형 고체산화물 연료전지 제작 및 셀 특성 (Fabrication and Cell Properties of Flattened Tube Segmented-in-Series Solid Oxide Fuel Cell-Stack Using Decalcomania Paper)

  • 안용태;지미정;박선민;신상호;황해진;최병현
    • 한국재료학회지
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    • 제23권3호
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    • pp.206-210
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    • 2013
  • In the segmented-in-series solid-oxide fuel cells (SIS-SOFCs), fabrication techniques which use decalcomania paper have many advantages, i.e., an increased active area of the electrode; better interfacial adhesion property between the anode, electrolyte and cathode; and improved layer thickness uniformity. In this work, a cell-stack was fabricated on porous ceramic flattened tube supports using decalcomania paper, which consists of an anode, electrolyte, and a cathode. The anode layer was $40{\mu}m$ thick, and was porous. The electrolyte layers exhibited a uniform thickness of about $20{\mu}m$ with a dense structure. Interfacial adhesion was improved due to the dense structure. The cathode layers was $30{\mu}m$ thick with porous structure, good adhesion to the electrolyte. The ohmic resistance levels at 800, 750 and $700^{\circ}C$ were measured, showing values of 1.49, 1.58 and $1.65{\Omega}{\cdot}cm^2$, respectively. The polarization resistances at 800, 750 and $700^{\circ}C$ were measured to be 1.63, 2.61 and $4.17cm^2$, respectively. These lower resistance values originated from the excellent interfacial adhesion between the anode, electrolyte and cathode. In a two-cell-stack SOFC, open-circuit voltages(OCVs) of 1.915, 1.942 and 1.957 V and maximum power densities(MPD) of 289.9, 276.1 and $220.4mW/cm^2$ were measured at 800, 750 and $700^{\circ}C$, respectively. The proposed fabrication technique using decalcomania paper was shown to be feasible for the easy fabrication of segmented-in-series flattened tube SOFCs.

연료중의 이산화탄소 불순물에 의한 고분자전해질연료전지의 성능변화 연구 (Effect of Carbon Dioxide in Fuel on the Performance of PEMFC)

  • 서중근;권준택;김준범
    • 전기화학회지
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    • 제11권1호
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    • pp.42-46
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    • 2008
  • 연료전지는 수소를 직접 사용하는 것이 가장 효율이 높지만 가정이나 사무실에서는 수소 저장탱크를 사용하기보다는 도시가스(메탄가스)를 연료 source로 하여 수소를 생산하는 것이 유리하다. 연료전지에 사용하는 수소는 천연가스나 바이오가스, 탄화수소계열의 연료를 개질하여 생산하며 개질반응과정에서 필연적으로 여러 성분의 불순물이 포함되어 있다. CO, $CO_2$, $H_2S$, $NH_3$, $CH_4$등의 불순물이 포함된 수소연료가 PEM fuel cell에 공급되면 연료전지 성능에 영향을 준다고 보고되어 있다. 이러한 영향에는 전극 촉매의 피독에 의한 kinetic losses, 전해질막과 촉매이온층의 양이온 전도성 감소에 의한 ohmic losses 그리고 촉매층의 구조나 소수성 감소에 의한 mass transport losses가 있다. 개질기에서 생산된 수소연료는 약 73%의 $H_2$와 20% 이하의 $CO_2$, 5.8% 이하의 $N_2$, 2% 이하의 $CH_4$, 10ppm 이하의 CO로 최종 공급된다. 본 연구에서는 연료 중에 $CO_2$가 고분자전해질 연료전지 anode측 성능에 미치는 영향을 조사하였다. 실험은 연료전지에 공급되는 연료중에 $CO_2$농도를 10%, 20%, 30%로 전류와 전압의 성능곡선과 장시간(10시간)실험 그리고 임피던스를 측정하였다. 또한 가스크로마토그래피를 이용하여 순수한 수소와 $CO_2$가 함유된 수소의 혼합을 통해 나온 연료전지 inlet에서의 불순물의 농도를 검증하였다.

Si 기판위에 열증착법으로 제조한 copper phthalocyanine(CuPc) 박막의 구조 및 광전특성 (Structural and photoelectrical properties of copper phthalocyanine(CuPc) thin film on Si substrate by thermal evaporation)

  • 이혜연;정중현;이종규
    • 센서학회지
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    • 제6권5호
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    • pp.407-413
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    • 1997
  • 기판온도 $300^{\circ}C$에서 열증착법에 의해 p형 <100> Si 기판위에 CuPc(Copper Phthalocyanine) 결정 박막을 증착하였다. X선 회절분석으로부터 CuPc 박막은 a-축 방향으로 성장하였음을 알 수 있었다. CuPc분자들이 기판면위에 수직인 CuPc/Si박막의 광전특성을 조사하기 위하여 수직방향의 전류-전압 (I-V) 특성을 기판 Si의 특성과 비교 관찰하였다. 저항성 접촉을 위해 기판인 p형 Si위에 전극으로 Au를 증착시켰다. Au/Si 접합에 빛을 조사한 결과 전류는 증가하지만 광기전력효과는 관찰되지 않았다. p형 반도체인 CuPc 박막과 기판 p-Si의 접합은 장벽을 형성하지 않기 때문에 빛을 조사하지 않았을 때의 I-V 특성은 저항성을 나타낸다. 빛을 조사하였을 때 CuPc/Si 접합의 증가된 광전류는 Si 웨이퍼보다 현저하게 큰 것을 알 수 있다. 따라서 CuPc 층이 600 nm 파장에서의 붉은 빛을 현저하게 흡수하여 광전류에 기여하는 다량의 광캐리어를 형성함을 알 수 있다. CuPc/Si 박막은 $J_{sc}$ (short-circuit photocurrent) $4.29\;mA/cm^{2}$$V_{oc}$ (open circuit photovoltage) 12 mV의 광기전력 특성을 보여준다.

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Analysis of Subwavelength Metal Hole Array Structure for the Enhancement of Quantum Dot Infrared Photodetectors

  • 하재두;황정우;강상우;노삼규;이상준;김종수
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.334-334
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    • 2013
  • In the past decade, the infrared detectors based on intersubband transition in quantum dots (QDs) have attracted much attention due to lower dark currents and increased lifetimes, which are in turn due a three-dimensional confinement and a reduction of scattering, respectively. In parallel, focal plane array development for infrared imaging has proceeded from the first to third generations (linear arrays, 2D arrays for staring systems, and large format with enhanced capabilities, respectively). For a step further towards the next generation of FPAs, it is envisioned that a two-dimensional metal hole array (2D-MHA) structures will improve the FPA structure by enhancing the coupling to photodetectors via local field engineering, and will enable wavelength filtering. In regard to the improved performance at certain wavelengths, it is worth pointing out the structural difference between previous 2D-MHA integrated front-illuminated single pixel devices and back-illuminated devices. Apart from the pixel linear dimension, it is a distinct difference that there is a metal cladding (composed of a number of metals for ohmic contact and the read-out integrated circuit hybridization) in the FPA between the heavily doped gallium arsenide used as the contact layer and the ROIC; on the contrary, the front-illuminated single pixel device consists of two heavily doped contact layers separated by the QD-absorber on a semi-infinite GaAs substrate. This paper is focused on analyzing the impact of a two dimensional metal hole array structure integrated to the back-illuminated quantum dots-in-a-well (DWELL) infrared photodetectors. The metal hole array consisting of subwavelength-circular holes penetrating gold layer (2DAu-CHA) provides the enhanced responsivity of DWELL infrared photodetector at certain wavelengths. The performance of 2D-Au-CHA is investigated by calculating the absorption of active layer in the DWELL structure using a finite integration technique. Simulation results show the enhanced electric fields (thereby increasing the absorption in the active layer) resulting from a surface plasmon, a guided mode, and Fabry-Perot resonances. Simulation method accomplished in this paper provides a generalized approach to optimize the design of any type of couplers integrated to infrared photodetectors.

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P3HT:PCBM 활성층을 갖는 유기 박막태양전지의 후속 열처리 효과 (The Post Annealing Effect of Organic Thin Film Solar Cells with P3HT:PCBM Active Layer)

  • 장성규;공수철;장호정
    • 마이크로전자및패키징학회지
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    • 제17권2호
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    • pp.63-67
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    • 2010
  • 본 연구에서는 P3HT와 PCBM 물질을 전자도너와 억셉터 광활성층 물질로 사용하여 벌크이종접합 구조를 갖는 Glass/ITO/PEDOT:PSS/P3HT-PCBM/Al 구조의 유기박막태양전지를 제작하였다. P3HT와 PCBM은 각각 0.5 wt%의 농도로 톨루엔 용액에 용해하였다. 광활성층 농도를 최적화하기 위하여 P3HT:PCBM= 3:4, 4:4, 4:3 wt%의 농도비로 소자를 제작하고, 농도비에 따른 전기적 특성을 조사하였다. 또한 활성층의 후속열처리 온도가 소자의 전기적 특성에 미치는 영향을 조사하였다. P3HT와 PCBM의 농도비가 4:4 wt%의 비율에서 가장 우수한 전기적 특성을 나타내었으며, 이때 단락전류밀도 ($J_{SC}$), 개방전압 ($V_{OC}$), 및 충실인자 (FF)는 4.7 $mA/cm^2$, 0.48 V 및 43.1%를 각각 나타내었다. 또한 전력변환효율(PCE)은 0.97%의 값을 얻었다. 최적화된 농도비를 갖는 태양전지 소자에 대해 $150^{\circ}C$에서 5분, 10분, 15분, 20분간 후속 열처리를 실시한 결과 P3HT 전자도너의 흡광계수가 증가하는 경향을 보였다. 후속 열처리 조건이 $150^{\circ}C$에서 15분인 경우 전기적 특성이 열처리 하지 않은 소자에 비해 특성이 개선되었다. 즉, 이때의 전기적 특성은 $J_{SC},\;V_{OC}$, FF, PCE의 값이 각각 7.8 $mA/cm^2$, 0.55 V, 47%, 2.0%를 나타내었다.

GaN를 이용한 Schottky diode형 자외선 수광소자의 제작 (Fabrication of a Schottky Type Ultraviolet Photodetector Using GaN Layer)

  • 성익중;이석헌;이채향;이용현;이정희;함성호
    • 전자공학회논문지D
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    • 제36D권6호
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    • pp.28-34
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    • 1999
  • 본 논문에서는 GaN 박막 위에 각각 알루미늄(Al)과 백금(Pt)을 증착하여 저항성 전극 및 투명한 schottky 전극을 형성한 평면형 자외선 수광소자를 제작하였다. 제작된 소자에 대해 전기적 특성과 광학적 특성을 조사하여 자외선 센서로서의 적합성을 검토하였다. 사파이어 기판위에 성장된 GaN 박막은 $7.8{\times}10^{16}cm^{-3}$의 도핑(doping)농도와 $138 cm^2/V{\cdot}s$의 이동도(mobility)를 가졌으며, 파장이 365 nm 이하인 빛만을 흡수하는 자외선 감지막 특성을 나타내었다. 5 V의 역방향 전압을 인가하였을 때 제조된 schottky형 자외선 센서는 325 nm의 자외선 파장에서 응답도가 2.84 A/W였고, $4{\times}10^4$의 큰 신호대 잡음비(SNR)의 $3.5{\times}10^9$W의 잡음등가전력(NEP)을 나타내었다. 따라서 이들 결과로부터 GuN를 이용한 schottky 다이오드가 가시광 차단 UV photodetector를 제조할 수 있음을 확인하였다.

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Bi 계열 Glass Frit 조성이 계면저항에 미치는 영향 (The Effects of Composition on the Interface Resistance in Bi-System Glass Frit)

  • 김인애;신효순;여동훈;정대용
    • 한국전기전자재료학회논문지
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    • 제26권12호
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    • pp.858-862
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    • 2013
  • The front electrode should be used to make solar cell panel so as to collect electron. The front electrode is used by paste type, printed on the Si-solar cell wafer and sintered at about $800^{\circ}C$. The paste is composed Ag powder and glass frit which make the ohmic contact between Ag electrode and n-type semiconductor layer. From the previous study, the Ag electrodes which used two commercial glass frit of Bi-system were so different on the interface resistance. The main composition of them was Bi-Zn-B-Si-O and few additives added in one of them. In this study, glass frit was made with the ratio of $Bi_2O_3$ and ZnO on the main composition, and then paste using glass frit was prepared respectively. And, also, the paste using the glass frit added oxide additives were prepared. The change of interface resistance was not large with the ratio of $Bi_2O_3$ and ZnO. In the case of G6 glass frit, 78 wt% $Bi_2O_3$ addition, the interface resistance was $190{\Omega}$ and most low. In the glass frit added oxide, the case of Ca increased over 10 times than it of G6 glass frit on the interface resistance. It was thaught that after sintering, Ca added glass frit was not flowed to the interface between Ag electrode and wafer but was in the Ag electrode.

결정질 실리콘 태양전지에 적용하기 위한 후면전극 형성에 관한 연구 (An Analysis on rear contact for crystalline silicon solar cell)

  • 권혁용;이재두;김민정;이수홍
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.91.1-91.1
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    • 2010
  • There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

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TCO/Si 접합 EWT 태양전지에 관한 전기적 및 광학적 특성 (Electrical and Optical Properties for TCO/Si Junction of EWT Solar Cells)

  • 송진섭;양정엽;이준석;홍진표;조영현
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.39.2-39.2
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    • 2010
  • In this work we have investigated electrical and optical properties of interface for ITO/Si with shallow doped emitter. The ITO is prepared by DC magnetron sputter on p-type monocrystalline silicon substrate. As an experimental result, The transmittance at 640nm spectra is obtained an average transmittance over 85% in the visible range of the optical spectrum. The energy bandgap of ITO at oxygen flow from 0% to 4% obtained between 3.57eV and 3.68eV (ITO : 3.75eV). The energy bandgap of ITO is depending on the thickness, sturcture and doping concentration. Because the bandgap and position of absorption edge for degenerated semiconductor oxide are determined by two competing mechanism; i) bandgap narrowing due to electron-electron and electron-impurity effects on the valance and conduction bands (> 3.38eV), ii) bandgap widening by the Burstein-Moss effect, a blocking of the lowest states of the conduction band by excess electrons( < 4.15eV). The resistivity of ITO layer obtained about $6{\times}10^{-4}{\Omega}cm$ at 4% of oxygen flow. In case of decrease resistivity of ITO, the carrier concentration and carrier mobility of ITO film will be increased. The contact resistance of ITO/Si with shallow doped emitter was measured by the transmission line method(TLM). As an experimental result, the contact resistance was obtained $0.0705{\Omega}cm^2$ at 2% oxygen flow. It is formed ohmic-contact of interface ITO/Si substrate. The emitter series resistance of ITO/Si with shallow doped emitter was obtained $0.1821{\Omega}cm^2$. Therefore, As an PC1D simulation result, the fill factor of EWT solar cell obtained above 80%. The details will be presented in conference.

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MoSe2가 Cu(In,Ga)Se2 박막 태양전지 모듈의 ZnO/Mo 접합의 접촉 저항에 미치는 영향 (Effect of MoSe2 on Contact Resistance of ZnO/Mo Junction in Cu(In,Ga)Se2 Thin Film Solar Module)

  • 조성욱;김아현;이경아;전찬욱
    • Current Photovoltaic Research
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    • 제8권3호
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    • pp.102-106
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    • 2020
  • In this paper, the effect of MoSe2 on the contact resistance (RC) of the transparent conducting oxide (TCO) and Mo junction in the scribed P2 region of the Cu(In,Ga)Se2 (CIGS) solar module was analyzed. The CIGS/Mo junction becomes ohmic-contact by MoSe2, so the formation of the MoSe2 layer is essential. However, the CIGS solar module has a TCO/MoSe2/Mo junction in the P2 region due to structural differences from the cell. The contact resistance (RC) of the P2 region was calculated using the transmission line method, and MoSe2 was confirmed to increase RC of the TCO/Mo junction. B doped ZnO (BZO) was used as TCO, and when BZO/MoSe2 junction was formed, conduction band offset (CBO) of 0.6 eV was generated due to the difference in their electron affinities. It is expected that this CBO acts as a carrier transport barrier that disturbs the flow of current, resulting in increased RC. In order to reduce the RC caused by CBO, MoSe2 must be made thin in a CIGS solar module.