• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06b
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• pp.55-85
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• 1996

지르코니아 분말은 ZrO2 결정상이 온도변화에 따라 부피변화를 수반하는 상전이변태를 나타낸다. 단사정 ZrO2가 110$0^{\circ}C$에서는 정방정으로, 2$700^{\circ}C$ 내외에서는 입방정으로 결정구조가 가역적으로 변한다. 이 ZrO2에 금속산화물을 고용시키면 형석 (CaF2:Florite)형의 입방정 결정구조가 실온에서도 안정하게 존재하게 된다. 안정화제 산화물은 caO, MgO등 2가 산화물외에 3가 또는 4가의 금속산화물로서 Sc2O3, Y2O3, Sm2O3, Nd2O3, Gd2O3, Y2O3, CeO2 등이며 이들은 금속이온의 원자가가 변하기 쉬운 희토류 산화물이다. 안정화 지르코니아는 형석형 결정구조이며 결정화학적으로 보면 금속양이온이 산소이온에 대해서 정육면체형의 8배위를 하고 있다. 이때 이온반경비(양이온/음이온)에 따라 Zr+4자리와 O-2자리의 격자위치와 모양이 형성되므로 비틀어진 정육면체구조이건 이상적인 정육면체 형석구조를 이룬다. 이는 지르코니아의 결정상의 2상-3상인 부분안정화 지르코니아다결정체(PSZ : partially stabilized zirconia)이거나 단일상-2상인 정방정 지르코니아다결정체(TZP : tetragonal zirconia polycrystal)의 결정구조를 가지는데 기인한다. PSZ는 주로 MgO, CaO를 안정화제로 고용시켜 입방정 영역에서 소결하고 이를 다시 입방정과 정방정의 상 영역에서 열처리하여 입방정 입자내부에 정방정을 석출 형성시킨 것이며 TZP는 Y2O3 및 CeO2를 고용시켜 PSZ와 다르게 일반적인 상압소결한 정방정 결정상의 미립자이다. 산화지르코늄 분말은 지르콘사에서 열분해시킨 지르코늄소결.융해괴(caustic fusion clinker)를 산처리하여얻어진 지르코늄산용액(zirconyl acid solution : cloride, sulfide, nitride 등)으로부터 제조된다. 고순도 산화지르코늄은 용액 결정석출법에 의해 ZrOCl2.8H2O, 5ZrO2.3SO3.15H2O, ZrO(NO3)2.xH2O 등의 지르코늄 수화물만을 재결정화시킨 것으로부터 얻을 수 있으며 이 지르코늄염 수용액으로부터 입자미세구조를 효과적으로 제어하여 산화지르코늄 및 안정화 지르코니아 분말제조가 가능하다. 안정화 지르코니아 분말은 ZrO2와 안정화산화물의 고용을위하여 가열처리를 필요로 하며 일정온도에서 최적상태로 숙성하므로서 2가지 상(phase) 이상의 고용체를 가지게 된다. 안정화 지르코니아 분말은 고용처리온도를 낮추고 효과적으로 생성시키기 위해서는 지르코늄 및 안정화제염을 혼합하고 습식 직접합성하여 저온에서 고용체의 합해진상 영역을 생성시키는 것이다. 이는 지르코니아 원료분말의 미세구조를 제어하므로서 가능하며 이때 화학성분조성과 크기형태가 균일하게 분포된 입자분말을 얻을 수 있다.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2010.04a
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• pp.618-619
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• 2010

LED는 기존의 발광원에 비해 훨씬 높은 파워와 효율성으로 인해 최근 들어 각종 조명이나 교통신호 등에서 사용이 급증하고 있다. LED 재료를 위해 지금까지 여러가지가 연구되어 왔는데, 갈륨 질화물 (Gallium Nitride, GaN)에 기반한 시스템이 최근들어 가장 큰 관심을 받고 있다. GaN 방식은 열적으로 매우 안정성이 있고, 1.9 ~ 6.2 eV 범위의 넓은 밴드의 Gap, 그리고 인듐이나 알루미늄과 결합하여 청, 녹, 백색등의 다양한 빛을 발생할 수 있는 장점을 가지고 있다. 예를 들어 청색 LED는 광학 방식의 기록매체에, 백색 LED는 기존의 조명램프의 대체용으로 활용이 가능하다. 이러한 장점 덕분에 GaN기반 LED 시장은 1994년에 최초로 상용화 된 이래 최근 급격한 성장을 보여 왔다. 그러나 GaN은 다른 III~V 타입의 반도체 재료와는 달리 재료가 성장하기 위해 사파이어와 같은 별도의 기판을 필요로 하는 문제가 있다. 이것은 결국 전위발생과 같은 격자의 부조화 같은 문제를 야기하여 결국 LED의 성능을 떨어뜨리는 요인이 된다. 이러한 문제를 해결하기 위해 HVPE(Hydride Vapor Phase Epitaxy) 방법이 개발되었는데, 이 방법은 시간당 100 미크론의 매우 빠른 성장속도로 높은 두께의 레이어를 만드는 장점이 있다. 이렇게 성장된 GaN 레이어는 베이스 기판에서 쉽게 분리되어 활용이 가능하다. 그러나 HVPE 기술은 성장 공정에서 두께를 균일하게 만들도록 제어하는 것이 매우 어렵다는 문제가 있다. 따라서 HVPE 방식에서는 이러한 조건을 만족시키기 위해 반응현상에 대한 물리적 해석을 토대로 공정조건을 정밀하게 설계해야 한다. 이를 위해 최근에 실험 또는 시뮬레이션을 활용하여 이러한 공정조건을 향상시키기 위한 여러 연구가 진행되었다. 본 연구에서는 이러한 연구의 일환으로 반응로에 투입되는 여러 기체의 유량과 존별 주변온도 조건을 입력변수로 하고, 이들이 GaN 성장에 미치는 영향을 분석하였다. HVPE 시스템에서 가장 이상적인 목표는 반응기체가 층류유동을 유지하면서 대부분의 반응이 기판위에서 이뤄지며, 기판위에서 성장되는 재료의 두께가 균일하게 되는 것이다. 입력변수들이 이러한 결과에 어떠한 영향을 미치는 지 분석하기 위해 전산유체역학(CFD, Computational Fluid Dynamics)을 수행하는 상용코드 FLUENT를 사용하였다. 보다 실제에 가까운 해석을 위해서는 기체간의 화학반응을 포함해야 하나, 해석의 편의와 효율을 위해 본 연구에서는 열 및 유동해석만을 수행하였다. 한편 실제 반응로의 우수성은 성장속도와 두께분포의 균일도를 통해 평가된다. CFD 해석을 통해 이들을 분석하기 위해 기존에 수행한 실험조건을 해석하고 해석결과의 유동패턴/압력분포를 실험결과의 성장속도/두께분포와 비교하고, 이중에서 관련성이 높은 해석결과변수를 우수성 평가에 활용하였다. 기존의 실험결과를 토대로 이러한 중요 결과변수와 함께 이들에 대한 목표값이 도출되고 나면, 입력 공정조건 - 사용기체의 유량과 주변온도 조건 - 에 대해 실험계획(DOE,Design of Experiment)을 수립하고 목표성능을 구현하기 위한 최적설계를 수행할 수 있다. 일반적으로 CFD를 통해 최적의 설계나 공정조건을 탐색하는 작업은 1회의 CFD 계산시간이 매우 오래 소요되기 때문에 쉽지 않다. 그러나 본 연구에서는 CFD와 DOE의 적절한 조합을 통해 적은 수의 해석을 가지고도 원하는 결과를 효율적으로 얻는 것이 가능함을 입증하고자 한다. 본 발표에서는 아직 이러한 연구가 완성되지 않은 시점에서 제반 연구개요를 소개하고 현 시점까지의 연구 결과 및 향후 계획을 소개하고자 한다.

• Journal of Adhesion and Interface
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• v.19 no.3
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• pp.113-117
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• 2018

Boron carbide is lower in hardness than diamond or boron nitride but has a hardness of more than 30 GPa and is used for manufacturing tank armors and ammo shells due to its high hardness. It is also used as a neutron absorber due to its ability to absorb neutrons, which is increasing its use in nuclear power projects. Neutrons have no interaction with electrons and are known to pass through the material without interactions. Along with boron carbide, the atoms with high interaction with neutrons are hydrogen, and high hydrogen concentration polyesters and epoxy polymers including boron are used as materials for manufacturing products for nuclear power generation waste. In this paper, the surface of boron carbide is treated with iron oxide and tungsten to improve interaction between modified boron carbide and epoxy polymer. XRD and XPS were used to confirm that iron oxide and tungsten are well attached on the surface of boron carbide, respectively. The mechanical strength of the surface treated boron carbide was measured by a universal testing machine (UTM) and the dynamic characteristics of the cured product were observed by using a dynamic analyzer (DMA).

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.236-242
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• 2001

HfN/Si$_3$N$_4$and NbN/Si$_3$N$_4$ multilayer coatings were deposited onto a high speed tool steel substrate by reactive sputtering and their mechanical properties were evaluated in terms of the dependence of hardness and adhesion strength on the sputter deposition process parameters. The hardnesses of both HfN/Si$_3$N$_4$and NbN/Si$_3$N$_4$ multiplayer coatings increase up to the flux ratio of 0.4 but nearly do not change after that as the $N_2$/Ar flux ratio in nitride sputter deposition increases. The hardnesses of both multiplayer coatings nearly do not change with annealing at low temperatures but decrease owing to oxidation with annealing at a high temperature like 80$0^{\circ}C$ after depositing the layers by sputtering. Post-annealing at low temperatures increases the adhesion strength of the multilayers. but high temperature annealing is not desirable since it decreases the adhesion strength besides the hardness deterioration.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• Resources Recycling
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• v.25 no.5
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• pp.75-83
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• 2016

AlN powder was prepared by carbon reduction and subsequent nitridation method through the scale-up experiments of 0.7 ~ 1.5 kg per batch. AlN powder was synthesized using the mixture of $Al_2O_3$ powder and carbon black at $1,550{\sim}1,750^{\circ}C$ for 0.5 ~ 4 hours under nitrogen atmosphere (flow rate of nitrogen gas: $10{\sim}40{\ell}/min$) at $2.0{\times}10^{-1}Torr$. Experimental results showed that $1,700{\sim}1,750^{\circ}C$ for the reaction temperature, 3 hr for reaction time, and $40{\ell}/min$ for the flow rate of nitrogen gas were the optimal conditions. Also, in order to remove carbon in the synthesized AlN, the remained carbon was removed at $650{\sim}750^{\circ}C$ for 1 ~ 2 hr using horizontal tube furnace. The results showed that 1 : 3.2 mol ratio of $Al_2O_3$ to carbon black, reaction temperature of $750^{\circ}C$, reaction time of 2 hours, rotating speed of 1.5 rpm under atmosphere condition were the optimal conditions. Under these conditions, high-purity AlN powder over 99% could be prepared: carbon and oxygen contents of the AlN powder were 835 ppm and 0.77%, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.11
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• pp.2075-2082
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• 2006

This paper presents modeling and optimization techniques for hish efficiency solar cell process on single-crystalline float zone (FZ) wafers. Among a sequence of multiple steps of fabrication, the followings are the most sensitive steps for the contact formation: 1) Emitter formation by diffusion; 2) Anti-reflection-coating (ARC) with silicon nitride using plasma-enhanced chemical vapor deposition (PECVD); 3) Screen-printing for front and back metalization; and 4) Contact formation by firing. In order to increase the performance of solar cells in terms of efficiency, the contact formation process is modeled and optimized using neural networks and genetic algorithms, respectively. This paper utilizes the design of experiments (DOE) in contact formation to reduce process time and fabrication costs. The experiments were designed by using central composite design which consists of 24 factorial design augmented by 8 axial points with three center points. After contact formation process, the efficiency of the fabricated solar cell is modeled using neural networks. Established efficiency model is then used for the analysis of the process characteristics and process optimization for more efficient solar cell fabrication.

• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.384-391
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• 2005

A polymer optical microring resonator, which is laterally coupled to a straight bus waveguide, has been proposed and demonstrated using a nanoimprint technique. The propagation loss of the ring waveguide and the optical power coupling between the ring and bus waveguides was calculated by using a beam propagation method, then the dependence of the device performance on them was investigated using a transfer matrix method. We have especially introduced an imprint stamp incorporating a smoothing buffer layer made of a silicon nitride thin film. This layer played an efficient role in improving the sidewall roughness of the waveguide pattern engraved on the stamp and thus reducing the scattering loss. As a result the overall Q factor of the resonator was greatly increased. Also it reduced the gap between the ring and bus waveguides effectively to enhance the coupling between them, without relying on the direct writing method based on an e-beam writer. As for the achieved device performance at the wavelength of 1550 nm, the quality factor, the extinction ratio, and the free spectral range were ~103800, ~11 dB, and 1.16 m, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.173-173
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• 2010

Recently, a patterned sapphire substrate (PSS) has been intensively used as one of the effective ways to reduce the dislocation density for the III-nitride epitaxial layers aiming for the application of high-performance, especially high-brightness, light-emitting diodes (LEDs). In this paper, we analyze the growth kinetics of the atoms and crystalline quality for the undopped-GaN depending on the facets of the pattern fabricated on a sapphire substrate. The effects of the PSS on the device characteristics of InGaN/GaN LEDs were also investigated. Several GaN samples were grown on the PSS under the different growth conditions. And the undoped-GaN layer was grown on a planar sapphire substrate as a reference. For the (002) plane of the undoped-GaN layer, as an example, the line-width broadening of the x-ray diffraction (XRD) spectrum on a planar sapphire substrate is 216.0 arcsec which is significantly narrower than that of 277.2 arcsec for the PSS. However, the line-width broadening for the (102) plane on the planar sapphire substrate (363.6 arcsec) is larger than that for the PSS (309.6 arcsec). Even though the growth parameters such as growth temperature, growth time, and pressure were systematically changed, this kind of trend in the line-width broadening of XRD spectrum was similar. The emission wavelength of the undoped-GaN layer on the PSS was red-shifted by 5.7 nm from that of the conventional LEDs (364.1 nm) under the same growth conditions. In addition, the intensity for the GaN layer on the PSS was three times larger than that of the planar case. The spatial variation in the emission wavelength of the undoped-GaN layer on the PSS was statistically ${\pm}0.5\;nm$ obtained from the photoluminescence mapping results throughout the whole wafer. These results will be discussed in terms of the mixed dislocation depending on the facets and the period of the patterns.

• Korean Journal of Materials Research
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• v.10 no.10
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• pp.703-708
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• 2000

As the engine design changes to get high efficiency and performance of commercial diesel engine, surface w wear of the earn follower becomes an important issue as applied load increasing at the contact face between cam follower and cam. We developed the ceramic cam follower made of sili$\infty$n nitride ceramic which was more wear resistant than the cast iron or sintered metal cam follower. Ceramic cam follower was made by direct brazing of thin ceramic disk to steel body using an active brazing alloy without the interlayer. In-situ crowning(R), resulted from the difference of thermal expansion coefficient between ceramic and carbon steel after direct brazing without any stress-relieving inter]ayer, could be controlled. When a earbon steel was heated above $A_{c1}$ point and then c$\infty$led, the expansion curve represented a hysteresis. Appropriate crowning was achieved below the $A_{c1}$ point(about $723^{\circ}C$) and crowning increased with brazing temperature exponentially above the $A_{c1}$ point. Optimum brazing temperature range was from 700 to $720^{\circ}C$. We developed successfully the ceramic cam follower having appropriate crowning and being inexpensive. Also we could successfully control the crowning of ceramic earn follower by hysteresis behavior of thermal expansion of earbon steel during direct brazing process.