• Title/Summary/Keyword: nickel compound

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An Influence of Additional Metals over Ni/SiO2 or Ni/Al2O3 on the Formation of CFC-1113 from CFC-113 (CFC-113로부터 CFC-1113의 합성시 Ni/SiO2(또는 Al2O3) 촉매상에서 다른 금속의 첨가효과)

  • Kim, JinHo;Park, Kun-You;Ha, Baik-Hyon
    • Applied Chemistry for Engineering
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    • v.10 no.2
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    • pp.237-241
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    • 1999
  • Nickel was impregnated on the $SiO_2$ and $Al_2O_3$ supports and applied to the reduction reaction of CFC-113 ($CF_2Cl$-$CFCl_2$) with hydrogen to 3FCl ($CF_2$=CFCl, CFC-1113). The conversion was rapidly declined on the Ni/$SiO_2$(or $Al_2O_3$) and the deactivation accelerated as the increase of Ni content. However, the selectivity of 3FCl was maintained at around 80% level. The simultaneous coprecipitation of copper and lithium on Ni/$Al_2O_3$ improved both the conversion and selectivity to 3FCl, but an excessive amount of lithium reduced the conversion as well as the selectivity of 3FCl. However, in the case of Ni/$SiO_2$, the conversion was greatly reduced possibly due to a loss of silica support with high surface area by the reaction of $SiO_2$ with HF. Such a reduction in conversion also can be ascribed to the decrease in active sites, caused by the addition of alkali metal compound, LiOH.

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Studies on the Interfacial Reaction between Electroless-Plated UBM (Under Bump Metallurgy) on Cu pads and Pb-Sn-Ag Solder Bumps (Cu pad위에 무전해 도금된 UBM (Under Bump Metallurgy)과 Pb-Sn-Ag 솔더 범프 계면 반응에 관한 연구)

  • Na, Jae-Ung;Baek, Gyeong-Uk
    • Korean Journal of Materials Research
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    • v.10 no.12
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    • pp.853-863
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    • 2000
  • In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

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Study on Sn-Ag-Fe Transient Liquid Phase Bonding for Application to Electric Vehicles Power Modules (전기자동차용 파워모듈 적용을 위한 Sn-Ag-Fe TLP (Transient Liquid Phase) 접합에 관한 연구)

  • Byungwoo Kim;Hyeri Go;Gyeongyeong Cheon;Yong-Ho Ko;Yoonchul Sohn
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.61-68
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    • 2023
  • In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn2 IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni3Sn4/FeSn2/Ni3Sn4 was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni3Sn4/FeSn2 interface and then propagated into FeSn2. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.