• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.118.1-118.1
• /
• 2016

The laser surface modification has been reported for its functional applications for improving tribological performance, wear resistance, hardness, and corrosion property. In most of these applications, continuous wave lasers and pulsed lasers were used for surface melting, cladding, alloying. Since flexibility in processing, refinement of microstructure and controlling the surface properties, technology utilizing lasers has been used in a number of fields. Especially, femtosecond laser has great benefits compared with other lasers because its pulsed width is much shorter than characteristic time of thermal diffusion, which leads to diminish heat affected zone. Moreover, laser surface engineering has been highlighted as an effective tool for micro/nano structuring of materials in the bio application field. In this study, we applied femtosecond and nanosecond pulsed laser to treat biometals, such as Mg, Mg alloy, and NiTi alloy, by heating to improve corrosion properties and functionalize their surface controlling cell response as implantable biomedical devices.

• 한국연소학회:학술대회논문집
• /
• 2012.11a
• /
• pp.101-103
• /
• 2012

Characteristic of aluminum ignition under high temperature and high pressure is studied using lasers. The laser ablation method is used to generate aluminum particles exposed to a high pressure by using a nanosecond pulsed laser where the range of ablation pressure varies between 0.35 and 2.2 GPa. A $CO_2$ laser is used to supply radiative heat to the aluminum target surface for providing high temperature ranging between 5000~9300 Kelvin. The ignition is confirmed using spectroscopy analysis of AlO vibronic band 484 nm wavelength. Also the radiative temperature is measured in various high pressure range for tracing the ignition temperature in high pressure conditions.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.21 no.4
• /
• pp.77-83
• /
• 2022

Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

• Journal of the Korean institute of surface engineering
• /
• v.57 no.4
• /
• pp.331-337
• /
• 2024

Platinum has been utilized as an excellent electrocatalyst with low overpotential for the hydrogen evolution reaction (HER) in water splitting, despite of its high cost. In this study, platinum particles were produced using pulsed laser technology as a HER catalyst for water splitting. The colloidal platinum particles were synthesized by nanosecond pulsed laser irradiation (PLI) without reducing agents, not traditional polyol processes including reducing agents. The crystal structure, shape and size of the synthesized platinum particles as a function of pulsed laser irradiation time were investigated by XRD and SEM analysis. Additionally, the electrochemical properties for the HER in water splitting of the irradiation time-dependent platinum electrocatalysts were studied with the analysis of overpotentials in linear sweep voltammetry and Tafel slope.

• Journal of Photoscience
• /
• v.6 no.3
• /
• pp.109-115
• /
• 1999

Intense excimer laser irradiation of polymer films results in expansion and the following contraction , recovering ithe initial flat surface. The morphological dynamics is meausred directly by nanosecond time-resolved interferometry for polystyrene(PS), polyurethane, and polyimide films. The expansion proceeds with a speed of a few nm/ns , while the contraction depends upon the polymer ; very low contraction for PS, rapid 2 component shrinking for polyurethane, and rapid monotonous decay for polymide. These characteristic behavior are considered from viewpoints of interpenetrating structures of polymers, glass-rubber phase transitioni, thermal diffusion, and photothermal mechanism.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.27 no.9
• /
• pp.1335-1341
• /
• 2003

This paper describes the process of nanoparticle synthesis by laser ablation of microparticles and consolidated sample. We have generated nanoparticles by high-power pulsed laser ablation of AI, Cu and Ag microparticles using a Q-switched Nd:YAG laser (wavelength 355nm, FWHM 6ns, fluence $0.8{\sim}2.0J/cm^2$). Microparticles of mean diameter $18{\sim}80{\mu}m$ are ablated in the ambient air. The generated nanoparticles are collected on a glass substrate and the size distribution and morphology are examined using a scanning electron microscope and a transmission electron microscope. The effect of laser fluence, collector position and compacting pressure on the distribution of particle size is investigated. To better understand the process of laser ablation of microparticle(LAM), we investigated the Nd: YAG laser-induced breakdown of Cu microparticle using time-resolved optical shadow images. Nanosecond time-resolved images of the ablation process are also obtained by laser flash shadowgraphy. Based on the experimental results, discussions are made on the dynamics of ablation plume.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.2
• /
• pp.20-24
• /
• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

• Laser Solutions
• /
• v.14 no.4
• /
• pp.14-20
• /
• 2011

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

• Laser Solutions
• /
• v.13 no.4
• /
• pp.7-13
• /
• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Journal of the Optical Society of Korea
• /
• v.19 no.1
• /
• pp.7-12
• /
• 2015

Up to ${\sim}520{\mu}J$ broadband mid-infrared (IR) supercontinuum (SC) generation in telecommunication multimode fiber (MMF) directly pumped by a $2.054{\mu}m$ nanosecond Q-switched Tm, $Ho:YVO_4$ laser is demonstrated. An average output power of 3.64 W is obtained in the band of ~1900 to ~2600 nm, and the corresponding optic-to-optic conversion efficiency is 67% by considering the coupling efficiency. The spectrum has extremely high flatness with negligible intensity variation (<2%) in the wavelength interval of ~2070 to ~2475 nm. The SC long-wavelength edge is limited by the silicon glass material loss, and by optimizing the MMF length, the SC spectrum could extend out to ${\sim}2.6{\mu}m$. The output SC pulse shapes are measured at different output powers, and no splits are found. The SC laser beam is nearly diffraction limited with an $M^2=1.15$ in $2.1{\mu}m$ measured by the traveling knife-edge method, and the laser beam spot is monitored by an infrared vidicon camera.