• The Magazine of the IEIE
• /
• v.33 no.4 s.263
• /
• pp.39-48
• /
• 2006

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.199-204
• /
• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.228.1-228.1
• /
• 2015

We demonstrate a simple route to hybridize two different nanomaterials by using three-dimensional nanodishes that can be used as small plasmonic containers to host guest nanoparticles. Our nanodishes were fabricated using nanoimprint lithography and oblique-angle film deposition, and the guest nanoparticles were drop-casted onto the host nanodishes. Based on the proposed method, colloidal Au nanoparticles were assembled inside Au nanodishes in the form of a labyrinth. These Au nanoparticle-nanodish hybrids excited a strong surface plasmon resonance, as verified by a numerical simulation of the local field enhancement and by direct observation of the enhanced Raman signals. Our results point to the potential of the nanodishes as a useful platform for combining diverse nanomaterials and their functionalities.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1119-1122
• /
• 2004

In the UV-NIL process using an elementwise patterned stamp (EPS), which includes channels formed to separate each element with patterns, low-viscosity resin droplets with a nano-liter volume are dispensed on all elements of the EPS. Following pressing of the EPS, the EPS is illuminated with UV light to cure the resin; and then the EPS is separated from several thin patterned elements on a wafer. Experiments on UV-NIL were performed on an EVG620-NIL. 50 － 70 nm features of the EPS were successfully transferred to 4 in. wafers. Especially, the wafer deformation during imprint was analyzed using the finite element method (FEM) in order to study the effect of the wafer deformation on the UV-NIL using EPS.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2006.05a
• /
• pp.86-90
• /
• 2006

Nanoimprint lithography (NIL) is a novel method to fabricate nanometer scale patterns. It is a simple process with low cost, high throughput and high resolution. NIL process creates patterns by the mechanical deformation of imprint resist and physical contact process. This physical contact process causes the stiction between the resist and the stamp. Stiction becomes a key issue especially in the stamps including narrow pattern size and wide area during NIL process development. The antistiction layer coating using fluorocarbon is very effective to prevent this problem and ensure successful NIL. In this paper, the concept of antistiction coating is explained and different preparation methods for nanoimprinting are briefly discussed.

• Proceedings of the KSME Conference
• /
• 2003.04a
• /
• pp.1078-1082
• /
• 2003

A feasibility study for the fabrication of master replication with nanostructures by Nanoimprint Lithography (NIL) was investigated for application of polymer Photonic Bandgap (PBG) devices used in photonic IC. Large area gratings of $9{\times}15(mm^2)$ with p = 400 nm was successfully embossed on PMMA on silicon wafer and the embossing parameters (temperature, pressure, time) were established. A precise control of $O_2$ plasma Reactive Ion Etching (RIE) process time allowed window opening over the whole area despite the presence of wafer bending. Master replication with aspect ratio 1 was successfully fabricated, but master replication with aspect ratio 3 needs to optimize parameters. All replications were done in a NIL process.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1934-1938
• /
• 2008

Formation of air bubble is the one of common defects in UV nano imprint lithography. Location of dispensing and volume of droplets are among the most important parameters in the process. ]n this study, UV curable resin droplets with different volumes were dispensed at different locations and pressed to investigate air bubble formation. By varying volume of droplet and dispensing location, process conditions were found for minimum air bubble area.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.40-44
• /
• 2008

The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2010.05a
• /
• pp.24.2-24.2
• /
• 2010

고분자 몰드를 이용한 nanoimprint lithography (NIL)는 고분자소재의 유연성과 투명성으로 인하여, 유기전자소자나 유연한 디스플레이소자 등 다양한 응용이 가능하다. 하지만, 고분자소재는 일반적으로 열저항성과 내구성이 낮아서, 고분자 몰드를 이용한 패턴형성 시, 자외선 경화방식이 주로 사용된다. 만약 복제가 쉽고, 가격이 저렴하며, 열저항성과 내구성이 강한 고분자 몰드를 제작한다면, thermoplastic-NIL 기술에 적용할 수가 있기 때문에, 고온을 요구하는 소자의 패턴형성 공정에 사용 가능하다. 본 연구에서는 이러한 고분자 몰드 제작을 위하여, 열저항성과 내구성이 강한 polyimide 필름과 polyurethane acrylate (PUA)를 기반으로 제작된 resin을 이용하였다. 먼저 Polyimide 필름 위에 자외선 노광을 사용하여, PUA resin 을 경화시킴으로써 패턴을 형성하였다. 이렇게 만들어진 몰드를 thermoplastic-NIL기술에 적용함으로써, Si 기판 위에 sub-마이크로 급 패턴을 형성하였다. 또한, 제작된 고분자 몰드를 사용하여 반복적인 NIL 공정을 수행함으로써 몰드의 내구성을 확인하였으며, 곡면 기판 위에 NIL을 함으로써 몰드의 유연성을 확인 할 수 있었다.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.3
• /
• pp.473-478
• /
• 2012

In this paper, the air bubble formation mechanism in the rectangular and triangular line-and-space pattern during dispensing UV Nanoimprint Lithography (UV-NIL) at an atmospheric condition is studied. To investigate the air bubble formation, an analytic model based on geometric approach and a numerical model based on CFD(computational fluid dynamics) were used in the analysis. It was found in the numerical analysis that every time the flow front passed through a corner of the pattern, it proceeded with a newly formed shape, occurring due to interface reconfiguration, since the flow fronts were formed such that they minimized the surface energy. Moreover, the conditions for the air bubble formation were investigated by applying the analytic analysis based on geometric approach and the numerical analysis. Good overall agreement was found between the analytic and numerical analysis.