• Proceedings of the KIEE Conference
• /
• 2009.04b
• /
• pp.259-262
• /
• 2009

Several universities in Korea are beginning studies related to soft stamping processes but since the studies are done with manual works thus systematic tests can't be performed due to difficulties in producing reproducible and repeatable fine patterns. Therefore, the phenomenon of destruction of the pattern forms of elastic polymers occurred during working because of inconsistent printing pressures and pinting time and there have been difficulties in maintaining flatness or producing uniform and fault-free fine structures in pinting large areas and also, there have been difficulties in multi-layered processes as patterns were changed by contacts in registering and errors in alignments. The purpose of development of this technology is to improve the process of soft lithography so that contacts between PDMS stamps and metal coated substrates in order to develop a stamp printing device that can not only shorten but also optimize processes, secure reproducibility and repeatability and is advantageous in printing large areas. Also, using this technology, this author is to develop equipment technologies and applied technologies for nano grade pattern printing processes with new concepts based on fine contact printing processes in order to apply them to diverse nano pattering processes.

• Journal of Radiation Industry
• /
• v.8 no.3
• /
• pp.147-153
• /
• 2014

This paper describes a large area CMOS image sensor module Implementation using the precision align inspection program. This work is needed because wafer cutting system does not always have high precision. The program check more than 8 point of sensor edges and align sensors with moving table. The size of a $2{\times}1$ butted CMOS image sensor module which except for the size of PCB is $170mm{\times}170mm$. And the pixel size is $55{\mu}m{\times}55{\mu}m$ and the number of pixels is $3,072{\times}3,072$. The gap between the two CMOS image sensor module was arranged in less than one pixel size.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.11
• /
• pp.41-46
• /
• 2019

The purpose of this study is to examine and propose a high quality blade manufacturing method by applying ELID grinding technology to machining the tungsten carbide blade edge for MLCC sheet cutting. In this study, experiments are performed according to the abrasive type of grinding wheel, grinding method and grinding direction using the non-stop continuous dressing ELID grinding technology. By comparing and analyzing the chipping phenomena and surface roughness of both the blade grinding surface and the processed surface, a method for machining the tungsten carbide blade for cutting MLCC sheet is proposed. From the analysis of the surface roughness and chipping phenomena, it is confirmed that the use of diamond abrasive is advantageous for the blade machining. In addition, it succeeds in the machining of $6{\mu}m$ fine blade without any chipping, by using the grinding wheel #4000 with the diamond abrasive.

• Journal of Sensor Science and Technology
• /
• v.33 no.3
• /
• pp.173-178
• /
• 2024

Development of pressure sensors for harsh environments with high pressure, humidity, and temperature is essential for many applications in the aerospace, marine, and automobile industries. However, existing materials such as polymers, adhesives, and semiconductors are not suitable for these conditions and require materials that are less sensitive to the external environment. This study proposed a pressure sensor that could withstand harsh environments and had high durability and precision. The sensor comprised a piezoresistor pattern and an insulating film directly formed on a stainless-steel membrane. To achieve the highest sensitivity, a pattern design method was proposed that considered the stress distribution in a circular membrane using finite element analysis. The manufacturing process involved depositing and etching a dielectric insulating film and metal piezoresistive material, resulting in a device with high linearity and slight hysteresis in the range of a maximum of 40 atm. The simplicity and effectiveness of this sensor render it a promising candidate for various applications in extreme environments.

• 유체기계공업학회:학술대회논문집
• /
• 2006.08a
• /
• pp.145-146
• /
• 2006

Recently, the next-generation advanced flow visualization techniques such as holographic PIV, dynamic PIV, echo-PIV, micro/nano-PIV, and X-ray PIV have been introduced. These advanced measurement techniques have a big potential as the core technology for analyzing outmost thermo-fluid flows in future. These would be indispensable in solving complicated thermo-fluid flow problems not only in the industrial fields such as automotive, space, electronics, aero- and hydro-dynamics, steel, and information engineering, but also in the research fields of medical science, bio-medical engineering, environmental and energy engineering etc. Especially, NT (Nano Technology) and BT (Bio Technology) strongly demand these advanced measurement techniques, because it is impossible for conventional measurement methods to observe most complicated nano- and bio-fluidic phenomena. In this presentation, the basic principle of these high-tech flow visualization techniques and their practical applications which cannot be resolved by conventional methods, such as blood flows in a micro-tube, in vivo analysis of micro-circulation, and flow around a living body will be introduced as a blue ocean strategy.

• Journal of the Korean Society of Visualization
• /
• v.4 no.2
• /
• pp.3-5
• /
• 2006

Recently, the next-generation advanced flow visualization techniques such as holographic PIV, aynni.c PIV, echo-PIV, micro/nano-PIV, and X-ray PIV have been introduced. These advanced mea-surement techniques have a big potential as the core technology for analyzing outmost thermo-fluid flows in future. They would be indispensable in solving complicated thermo-fluid flow problems not only in industrial fields such as automotive, space, electronics, aero- and hydro-dynamics. steel, and information engineering, but also in the research fields of medical science, bio-medical engineering, environmental and energy technology etc. Especially, NT (Nano Technology) and BT (Bio Technology) strongly demand these advanced measurement techniques, because it is impossible for conventional measurement methods to observe the nano- and bio-fluidic flow phenomena. In this article, the basic principle of these high-tech flow visualization techniques and their practical applications which cannot be resolved by conventional methods, such as blood flows in a micro-tube, in vivo analysis of micro-circulation, and flow around a living body are introduced as a blue ocean strategy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.11a
• /
• pp.76-79
• /
• 2003

The characteristic of single wall carbon nanotube (SW-CNT) and herringbone nano fiber (HB-CNF) emitters was described. SW-CNT synthesized by arc discharge and HB-CNF prepared by thermal CVD were mixed with binders and conductive materials, and then were formed by screen-printing process. In order to obtain efficient field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNT and CNF emitters. The basic structure of FED was of a diode type through fully vacuum packaging. Also, we proposed a new triode type of field emitter using a mesh gate plate having tapered holes and could achieve the ideal triode properties with no gate leakage currents.

• International journal of advanced smart convergence
• /
• v.5 no.3
• /
• pp.61-65
• /
• 2016

In the TV broadcasting, movie production and business the transportation of video between creators (programmers, studios) and distributors (broadcast and cable networks, cable and satellites companies) is still a mix of File Transfer Protocol (FTP), physical delivery, and expensive multicast satellite. Cloud-based file sync-and-share providers like Dropbox and box are playing an increasing role, but the industry's unique demands for speed and multicasting have fueled the growth of IP Video transport. This paper gives a solid grasp of the major elements of IP video technology, including content preparation, system architecture alternatives and network performance management.

• Transactions on Electrical and Electronic Materials
• /
• v.7 no.4
• /
• pp.167-172
• /
• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.35-37
• /
• 2005

100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.