• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.107-112
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• 2016

In this paper, the hydrophobic rough surfaces were prepared by employing a conventional nano-imprint lithography technique, and the effects of surface parameter, ratio of the top surface to the flat unit cell, on the impingement behaviors of liquid droplet were investigated to improve robustness of hydrophobic functionality. The critical height defined for the transition from rebound to fragmentation is measured by droplet impingement test in order to study dynamic behavior of an impinged droplet. It showed the critical height decreased with high surface parameter while it increased with low surface parameter. However, the critical height decreased again as surface parameter decreased further. Observed results suggest that the optimized surface pattern should be designed for the increased critical height.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.33-39
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• 2010

The moisture absorption properties such as diffusion coefficient and moisture content ratio of liquid type epoxy resin systems with the filler were investigated. Bisphenol A type and Bisphenol F type epoxy resin, Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these liquid type epoxy encapsulant according to the change of filler size. The temperature of glass transition (Tg) of these epoxy resin systems was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these epoxy resin systems according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these systems were calculated in terms of modified Crank equation based on Ficks' law. An increase of Tg and diffusion coefficient with filler size in these systems can be observed, which are attributed to the increase of free volume with Tg. The change of maximum moisture absorption ratio according to the filler size and filler content cannot be observed; however, the diffusion coefficients of these systems decreased with filler content. The diffusion via free volume is dominant in the epoxy resin systems with low nano-sized filler content; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the liquid type epoxy encapsulant with high nano-sized filler content.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.41-46
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• 2017

In this study, rapid cooling method was proposed to improve the anti-scratch performance of anti-reflection film fabricated by nanoimprint lithography. Effects of cooling time on the mechanical properties and optical properties were evaluated. Pencil hardness measurements showed that anti-scratch performance enhanced as the cooling time increased while characterization on the optical property showed that reflectance on scratch increased as the cooling time increased. Therefore, it was concluded that the anti-scratch performance and optical properties are highly influenced by the cooling time. The observed results explained in terms of residual stress and free volume in polymeric materials.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.3
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• pp.99-104
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• 2009

Soy protein isolate (SPI)-based nanocomposite films with three different types of nanoclays, such as Cloisite $Na^+$, Cloisite 20A, and Cloisite 30B, were prepared using a solution casting method, and their optical, tensile, and water vapor barrier properties were determined to investigate the effect of nano-clay type on film properties. Among the tested nanoclays, Cloisite $Na^+$, a hydrophilic montmorillonite (MMT), exhibited the highest transparency with least opaqueness, the highest tensile strength, and the highest water vapor barrier properties, indicating Cloisite $Na^+$ is the most compatible with SPI polymer matrix to form nanocomposite films. The film properties of SPI/Cloisite $Na^+$ nanocomposite films were strongly dependent on the concentration of the clay. Film properties such as optical, tensile, and water vapor barrier properties improved significantly (p<0.05) as the concentration of clay increased. However, the effectiveness of addition of the clay reduced above a certain level (i.e., 5wt%), indicating that there is an optimum amount of clay addition to exploit the full advantage of nanocmposite films.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Applied Chemistry for Engineering
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• v.27 no.3
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• pp.245-251
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• 2016

Trends of bioplastics, especially biomass-based bioplastics which is one of the most promising ways to solve the depletion of fossil fuels and global warming problems, were investigated. Emerged bioplastic polymers such as polylacticacid (PLA), polyglycolicacid (PGA) for cosmetic additive, polyhydroxyalkanoate (PHA) produced by bacterial fermentation, and cost effective starch-based polymer were discussed with their general studies. Also recent technologies of environment-friendly bioplastics for packaging and construction materials as well as disposable hygienic goods were briefly reviewed.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.339-343
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• 2005

Pt-$SrBi_2Nb_2O_9(SBN)-Pt-Y_2O_3-Si$ gate field effect transistors (MFMISFETs) have been fabricated and the SBN thin films are rapid thermal annealed in oxygen plasma. The grain size of the SBN becomes 4 times much larger than that of furnace annealed SBN films even at the same annealing temperature of $700^{\circ}C$, remnant polarization value of Pt-SBN-Pt is improved by 2 times. Using the rapid grain growth of SBN for the MFM-ISFET, memory window and programming characteristics of on/off states are fairly well improved.