• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.307-314
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• 2021

Diamond-like carbon (DLC) is difficult to achieve sufficient adhesion because of weak bonding between DLC film and the substrate. The purpose of this study is to improve the adhesion between substrate and DLC film. DLC film was deposited on AISI H13 using linear ion source. To improve adhesion, the substrate was treated by dual post plasma nitriding. In order to define the mechanism of the improvement in adhesive strength, the gradient layer between substrate and DLC film was analyzed by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The microstructure of the DLC film was analyzed using a micro Raman spectrometer. Mechanical properties were measured by nano-indentation, micro vickers hardness tester and tribology tester. The characteristic of adhesion was observed by scratch test. The adhesion of the DLC film was enhanced by active screen plasma nitriding layer.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.142-143
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• 2006

Combinatorial methods are being used increasingly to develop the next generation of polymers, coatings and adhesive formulations. Allied to this approach, a new genre of measurement and characterization methods are emerging. These characterization techniques are required to handle and take measurements from small samples. This has led to a number of uses for this technology which usefully fall between convention test specimen and micro- or nano-scale test methods. A versatile measurement platform will be presented which can offer useful indentation, puncture, compression, adhesion and scratch resistance data for a wide variety of material types and that continues to develop and evolve in capability.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.2
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• pp.142-148
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• 2012

This study presents the assessment results of adhesive properties on the interface between a silicon wafer and nano-scale polymer thin film pattern through UAFM images by using the contact resonance frequency of the cantilever. For the experiment, we varied surface treatment processes for the silicon wafer and fabricated a 300nm polymer thin film pattern through lithography. Images from the optical microscope were used to compare the produced test specimens for adhesive condition and the critical load value from the nano scratch test was used to verify the adhesive condition of the nano pattern. Each test specimen resulted in a $1{\mu}m{\times}1{\mu}m$ surface image and subsurface adhesive image. Adhesive condition was evaluated by image contrast differences on the interface according to the changing amplitudes and phases of contact resonance frequency.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1398-1401
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• 2005

The nano/microstructure, the aging response (in T5 heat treatment), and the mechanical/tribological properties of the eutectic regions in squeeze-cast A356 alloy were investigated using nano/micro-indentation and mechanical scratching, combined wit optical microscopy and atomic force microscope(AFM). Most eutectic Si crystals in the A356 alloy showed a modified morphology as fine-fibers. The loading curve for the eutectic region was more irregular than that of the primary Al region due to the presence of various particles of varying strength. In addition, the eutectic region showed lower pile-up and higher elastic recovery than the primary Al region. The aging responses of the eutectic regions in the squeeze-cast A356 alloys aged at $150^{\circ}C$ for different times(0, 2, 4, 8, 10, 16, 24, 36 and 72 h) were investigated. As the aging time increased, acicular Si particles in the eutectic regions gradually came to a fine structure. Both Vickers hardness ($H_V$) and indentation ($H_{IT}$) test results showed almost the same trend of aging curves, and the peak was obtained at the same aging time of 10 h. A remarkable size-dependence of the tests was found. The friction coefficient for the eutectic region was lower than that for the primary Al region.

• Journal of the Korean institute of surface engineering
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• v.41 no.4
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• pp.147-155
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• 2008

The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.41-46
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• 2009

The fit between dental implant fixture and zirconia abutment is affected by many variables during the fabrication process by CAD/CAM program and milling working. The purpose of this study was to evaluate the surface compatibility and electrochemical behaviors of zirconia abutment for prosthodontics. Zirconia abutments were prepared and fabricated using zirconia block and milling machine. For stabilization of zirconia abutments, sintering was carried out at $1500^{\circ}F$ for 7 hrs. The specimens were cut and polished for gap observation. The gap between dental implant fixture and zirconia abutment was observed using field-emission scanning electron microscopy (FE-SEM). The hardness and corrosion resistance of zirconia abutments were observed with vickers hardness tester and potentiostat. The gap between dental implant fixture and zirconia abutment was $5{\sim}12{\mu}m$ for small gap, and $40{\sim}60{\mu}m$ for large gap. The hardness of zirconia surface was 1275.5 Hv and showed micro-machined scratch on the surface. The corrosion potentials of zirconia abutment/fixture was .290 mV and metal abutment/fixture was .280 mV, whereas $|E_{pit}-E_{corr}|$ of zirconia abutment/fixture (172 mV) was higher than that of metal abutment/fixture (150 mV). The corrosion morphology of metal abutment/fixture showed the many pit on the surface in compared with zirconia abutment/fixture.

• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.75-78
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• 2006

In case of contacts between semiconductor and metal in semiconductor circuits, they become unstable because of thermal budget. To prevent these problems, we use diffusion barrier that has a good thermal stability between metal and semiconductor. So we consider the diffusion barrier to prevent the increase of contact resistance between the interfaces of metals and semiconductors, and the increase of resistance and the reaction between the interfaces. In this paper we deposited tungsten boron carbon nitride (W-B-C-N) thin film on silicon substrate. The impurities of the $1000\;{\AA}-thick$ W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between metal thin films $(Cu-2000\;{\AA})$ and silicon during the high temperature $(700\~1000^{\circ}C)$ annealing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean institute of surface engineering
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• v.40 no.6
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• pp.254-257
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• 2007

TiN coating on tool steel has been widely used for the improvement of durability of tools. In this work, radical nitriding(RN) is carried out on SKD61 at $450^{\circ}C$ for 5 hours in the ammonia gas pressure $2.7{\times}10^3\;Pa$. The TiN coating is carried out by arc ion plating(AIP) with the process parameters: arc power 150 A, bias voltage -50V, coating time 40 minutes and nitrogen gas pressure $4{\times}10^3\;Pa$. Hardness, elastic modulus, friction coefficient and adhesion of TiN coating on substrates of both TiN/SKD61 and TiN/RN SKD61 coatings are investigated comparatively. The primary crystalline faces of TiN surface are(200) and(111) for TiN/SKD61 and TiN/RN SKD61 respectively. In addition to the primary phase, Fe phase exists in TiN/SKD61 coating, but not in TIN/RN SKD61. The hardness of TiN/RN SKD61 is about 700 Hv, 250 Hv(56%) higher than that of TiN/SKD61 at the near interface of TiN and substrates. At the TiN surface, hardness of TiN/RN SKD61 is 2,149 Hv, 71 Hv(3%) higher than that of TiN/SKD61. The elastic modulus of TiN coating is improved to 26.7 GPa(6%) by radical nitriding. The adhesion is improved by the RN coating showing no spalling. buckling and chipping on the scratch test track which are shown on the non-RN TiN/SKD61.