Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging
(전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석)
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- Proceedings of the Korean Society For Composite Materials Conference
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- 2000.04a
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- pp.175-183
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- 2000