• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1996년도 춘계공동학술대회논문집; 공군사관학교, 청주; 26-27 Apr. 1996
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• pp.104-107
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• 1996

This paper focuses on a automation selection of optimal cutting conditions and cycle time for multi-spindle metal cutting machines based on machining parameters and tool change schemes which are the two most common terms used in the metal cutting. In this research we used two step generative approach, step 1 is mathematical modeling for the selection fo optimal cutting conditions and the other is GMDH-Type modeling to estimate the system performance evaluation. We developed computer programs for these models and the fitting manufacturing examples are applied to this model and it was shown that the proposed approach has a good potential and offers a valuable tools to analyse the metal cutting system.

• Structural Engineering and Mechanics
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• 제69권3호
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• pp.283-291
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• 2019

Accurately determining the natural frequencies and mode shapes of a structural floor is an essential step to assess the floor's human-induced vibration serviceability. In the theoretical analysis, the prestressed concrete floor can be idealized as a multi-span continuous anisotropic plate. This paper presents a new analytical approach to determine the natural frequencies and mode shapes of a multi-span continuous orthotropic plate. The suggested approach is based on the combined modal and perturbation method, which differs from other approaches as it decomposes the admissible functions defining the mode shapes by considering the intermodal coupling. The implementation of this technique is simple, requiring no tedious mathematical calculations. The perturbation solution is validated with the numerical results.

• 한국CDE학회논문집
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• 제11권5호
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• pp.384-392
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• 2006

In this research, the feasibility of distributed finite element analysis system with STEP and CORBA has been investigated. The enabling technologies such as CORBA and Java play key roles in the development of integrated and geographically distributed application software. In addition to the distribution of analysis modules, numerical solution process itself is again divided into parallel processes using multi-frontal method for computational efficiency. In contrast to the specially designed parallel process for specific hardware, CORBA-based parallel process is well suited for heterogeneous platforms over the network. The idea of Web-based distributed analysis system may be applied to the engineering ASP for design and analysis in the product development processes. We believe that the proposed approach for the analysis can be extended to the entire product development process for sharing and utilizing common product data in the distributed engineering environment, thus eventually provide basis for virtual enterprise.

• 한국CDE학회논문집
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• 제2권1호
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• pp.44-52
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• 1997

A design process is difficult to describe comprehensively because a design problem has a multi-disciplinary nature and the design itself evolves as solutions are attempted by the designer. The process of design has been investigated in this paper with the purpose of characterizing the role that a system of this kind may have. In defining the system, an approach has been used that privileges the relationships with the existing CAD tools based on data exchange standards in course of definition today. Integrated design environment normally consists of a centralized data model a data management system and a set of CAD tools. In this study, all further investigations are directed towards the data management system, as one of the main components of the proposed environment. Moreover, product modeling, as a prerequisite for the data management core, is taken into special consideration.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.

• 제어로봇시스템학회논문지
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• 제22권6호
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• pp.477-482
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• 2016

This paper presents a simple approximation-based design approach for consensus tracking of heterogeneous second-order nonlinear systems under a directed network. All nonlinearities of followers are assumed to be unknown and non-identical. In the controller design procedure, graph-independent error surfaces are used and an unimplementable intermediate controller for each follower is designed at the first design step. Then, by adding and subtracting a graph-based term at the second step, the actual controller for each follower is designed by using one neural network employed to estimate a lumped and distributed nonlinearity. Therefore, the proposed local controller for each follower has a simpler structure than existing approximation-based consensus tracking controllers for multi-agent systems with unmatched nonlinearities.

• 융합신호처리학회논문지
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• 제12권2호
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• pp.91-95
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• 2011

In this paper, we present an improved multi-scale gradient algorithm. The proposed algorithm works the effectively handling of both step and blurred edges. In the proposed algorithm, the image sharpening operator is sharpening the edges and contours of the objects. This operation gives an opportunity to get noise reduced image and step edged image. After that, multi-scale gradient operator works on noise reduced image in order to get a gradient image. The gradient image is segmented by watershed transform. The approach of region merging is used after watershed transform. The region merging is carried out according to the region area and region homogeneity. The region number of the proposed algorithm is 36% shorter than that of the existing algorithm because the proposed algorithm produces a few irrelevant regions. Moreover, the computational time of the proposed algorithm is relatively fast in comparison with the existing one.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제24권3호
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• pp.243-291
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• 2020

In this paper, multi-block generalized backward differentiation methods for numerical solutions of ordinary differential and differential algebraic equations are introduced. This class of linear multi-block methods is implemented as multi-block boundary value methods (MB₂ VMs). The root distribution of the stability polynomial of the new class of methods are determined using the Wiener-Hopf factorization of a matrix polynomial for the purpose of their correct implementation. Numerical tests, showing the potential of such methods for output of multi-block of solutions of the ordinary differential equations in the new approach are also reported herein. The methods which output multi-block of solutions of the ordinary differential equations on application, are unlike the conventional linear multistep methods which output a solution at a point or the conventional boundary value methods and multi-block methods which output only a block of solutions per step. The MB₂ VMs introduced herein is a novel approach at developing very large scale integration methods (VLSIM) in the numerical solution of differential equations.

• 한국측량학회지
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• 제32권3호
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• pp.191-204
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• 2014

In recent years, multi-camera systems have been recognized as an affordable alternative for the collection of 3D spatial data from physical surfaces. The collected data can be applied for different mapping(e.g., mobile mapping and mapping inaccessible locations)or metrology applications (e.g., industrial, biomedical, and architectural). In order to fully exploit the potential accuracy of these systems and ensure successful manipulation of the involved cameras, a careful system calibration should be performed prior to the data collection procedure. The calibration of a multi-camera system is accomplished when the individual cameras are calibrated and the geometric relationships among the different system components are defined. In this paper, a new single-step approach is introduced for the calibration of a multi-camera system (i.e., individual camera calibration and estimation of the lever-arm and boresight angles among the system components). In this approach, one of the cameras is set as the reference camera and the system mounting parameters are defined relative to that reference camera. The proposed approach is easy to implement and computationally efficient. The major advantage of this method, when compared to available multi-camera system calibration approaches, is the flexibility of being applied for either directly or indirectly geo-referenced multi-camera systems. The feasibility of the proposed approach is verified through experimental results using real data collected by a newly-developed indirectly geo-referenced multi-camera system.

• Journal of Electrical Engineering and Technology
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• 제6권2호
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• pp.280-283
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• 2011

In the present work, a new approach is proposed for via interconnects of semiconductor devices, where multi-wall carbon nanotubes (MWCNTs) are used instead of conventional metals. In order to implement a selective growth of carbon nanotubes (CNTs) for via interconnect, the buried catalyst method is selected which is the most compatible with semiconductor processes. The cobalt catalyst for CNT growth is pre-deposited before via hole patterning, and to achieve the via etch stop on the thin catalyst layer (ca. 3nm), a novel 2-step etch scheme is designed; the first step is a conventional oxide etch while the second step chemically etches the silicon nitride layer to lower the damage of the catalyst layer. The results show that the 2-step etch scheme is a feasible candidate for the realization of CNT interconnects in conventional semiconductor devices.