• Title/Summary/Keyword: multi layer multi pass

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Techniques for Estimating Temper Bead Welding Process by using Temperature Curves of Analytical Solution (해석 해의 온도곡선을 이용한 템퍼비이드 용접공정 평가기술)

  • Lee, Ho-Jin;Lee, Bong-Sang;Park, Kwang-Soo;Byeon, Jin-Gwi;Jung, In-Chul
    • Journal of Welding and Joining
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    • v.28 no.5
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    • pp.51-57
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    • 2010
  • Brittle microstructure created in a heat affected zone (HAZ) during the welding of low alloy steel can be eliminated by post-weld heat treatment (PWHT). If the PWHT is not possible during a repair welding, the controlled bead depositions of multi-pass welding should be applied to obtain tempering effect on the HAZ without PWHT. In order to anticipate and control the tempering effect during the temper bead welding, the definition of temperature curve obtained from the analytical solution was suggested in this research. Because the analytical solution for heat flow is expressed as a mathematical equation of weld parameters, it may be effective in anticipating the effect of each weld parameter on the tempering in HAZ during the successive bead depositions. The reheating effect by the successive bead layer on the brittle coarse grained HAZ formed by earlier bead deposition was estimated by comparing the overlapped distance between the temperature curves in the HAZ. Three layered weld specimens of SA508 base metal with A52 filler were prepared by controlling heat input ratio between layers. The tempering effect anticipated by using the overlapped distance between the temperature curves was verified by measuring the micro-hardness distribution in the HAZ of prepared specimens. The temperature curve obtained from analytical solution was expected as a good tool to find optimal temper bead welding conditions.

Microstructure and Mechanical Properties of AA6061/AA5052/AA6061 Complex Sheet Fabricated by Cold-Roll Bonding Process (냉간압연접합법에 의해 제조된 AA6061/AA5052/AA6061 복합판재의 미세조직 및 기계적 성질)

  • Hwang, Ju-Yeon;Lee, Seong-Hee
    • Korean Journal of Materials Research
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    • v.29 no.6
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    • pp.392-397
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    • 2019
  • A cold roll-bonding process is applied to fabricate an AA6061/AA5052/AA6061 three-layer clad sheet. Two AA6061 and one AA5052 sheets of 2 mm thickness, 40 mm width, and 300 mm length are stacked, with the AA5052 sheet located in the center. After surface treatment such as degreasing and wire brushing, sample is reduced to a thickness of 1.5 mm by multi-pass cold rolling. The rolling is performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 400 mm at rolling speed of 6.0 m/sec. The roll bonded AA6061/AA5052/AA6061 complex sheet is then hardened by natural aging(T4) and artificial aging(T6) treatments. The microstructures of the as-roll bonded and age-hardened Al complex sheets are revealed by optical microscopy; the mechanical properties are investigated by tensile testing and hardness testing. After rolling, the roll-bonded AA6061/AA5052/AA6061 sheets show a typical deformation structure in which grains are elongated in the rolling direction. However, after T4 and T6 aging treatment, there is a recrystallization structure consisting of coarse equiaxed grains in both AA5052 and AA6061 sheets. The as roll-bonded specimen shows a sandwich structure in which an AA5052 sheet is inserted into two AA6061 sheets with higher hardness. However, after T4 and T6 aging treatment, there is a different sandwich structure in which the hardness of the upper and lower layers of the AA6061 sheets is higher than that of the center of the AA5052 sheet. The strength values of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.4 times, respectively, compared to that value of the starting material.

Antenna-Diplexer Module for Cellular/SDMB Band Using LTCC Technology (LTCC 공법을 사용한 Cellular/SDMB 안테나-다이플렉서 모듈)

  • Ha, Jeung-Uk;Chang, Ki-Hun;Yoon, Young-Joong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.7
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    • pp.774-783
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    • 2007
  • This paper presents an integrated packaging antenna-diplexer module for wireless communication systems in the Cellular and SDMB band. The design and the realization of the proposed one are experimentally analyzed and discussed. It consists of a dual-resonance antenna and a diplexer with a multi-layer LTCC(${\varepsilon}_r=7.8,\;tan\;{\delta}=0.0043$) technology with integration capability and low loss. The dual-resonance antenna of the proposed module has the meander line structure for size reduction and has the shorting structure of an inverted F antenna to achieve good impedance matching. The diplexer of the proposed module was designed with the combination of low pass filter(LPF) and high pass filter(HPF). Decreasing the mutual interference between them provides a high isolation characteristic. The proposed antenna-diplexer module with dimensions of $27.5{\times}12.0{\times}2.2mm$ operates within a range from 813 MHz to 902 MHz for the cellular band and from 2,586 MHz to 2,655 MHz for the SDMB band. And the measured gain of the fabricated module is -1.96 dBi for Cellular band and -5.43 dBi for SDMB band. The parameters for the antenna-diplexer module are investigated and the several performances are discussed.