• Title/Summary/Keyword: molten solder

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Spalling of Intermetallic Compound during the Reaction between Electroless Ni(P) and Lead-free Solders (무전해 Ni(P)과 무연솔더와의 반응 중 금속간화합물의 spalling 현상에 관한 연구)

  • Sohn Yoon-Chul;Yu Jin;Kang S. K.;Shih D. Y,;Lee Taek-Yeong
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.3 s.32
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    • pp.37-45
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    • 2004
  • Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

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Study on the Manufacturing Techniques of Metallic Ornament of Treasure 930, the Staffs of Yi Gyeong-seok (보물 제930호 이경석 지팡이에 사용된 장석의 제작기법 고찰)

  • Lee, Jae-sung;Jeon, Ik-hwan
    • Journal of Conservation Science
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    • v.31 no.3
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    • pp.309-318
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    • 2015
  • The staff given with chair to Yi Gyeong-seok, senior official over 70 years old by King Hyeonjong of Joseon Dynasty is representative handcraft of Joseon Dynasty. Results of analysis on the metallic decoration show that the metallic ornament of the end part which is connected to the spade was made by rolling of iron plate and brass plating. The plated part is limited to the ornament of the end part connected to the spade and the plating was not applied to the spade. Brass including 20% zinc was used for the connecting part of guard while brass gilded iron was used for the spade. This suggests that the tone of the connecting part of the guard and the spade was not different for reason of visual harmonization. Potential applied plating method can be amalgam, dippping in molten brass, and brushing but the analysis result suggests that dipping in molten brass method is the most likely accepted method. The brass guard of knife was joined by tin-lead solder. Rivet used to fix the blade was made by pure iron as an optimum material which satisfies flexibility and strength.

Micro Joining Process Using Solderable Anisotropic Conductive Adhesive (Solderable 이방성 도전성 접착제를 이용한 마이크로 접합 프로세스)

  • Yim, Byung-Seung;Jeon, Sung-Ho;Song, Yong;Kim, Yeon-Hee;Kim, Joo-Heon;Kim, Jong-Min
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.73-73
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    • 2009
  • In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

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Study on the Casting Method and Manufacturing Process of Bronze Bells Excavated from the Hoeamsa Temple Site (회암사지 금탁(琴鐸)의 주조방법과 가공기술 연구)

  • Lee, Jae Sung;Baek, Ji Hye;Jeon, Ik Hwan;Park, Jang Sik
    • Korean Journal of Heritage: History & Science
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    • v.43 no.3
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    • pp.102-121
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    • 2010
  • Three bronze bells excavated from the Hoeamsa temple site were investigated for their microstructures and chemical compositions in an effort to understand the technology applied in fabrication, which may represent the related industry established in the early Joseon period. The result shows that the bells were cast from alloys of approximately 85% copper-8% tin-7% lead. The chemical analysis for ten trace elements shows that they were all kept below 0.3 weight %, suggesting that the alloys were made of relatively well-refined copper, tin and lead. The presence of sulfur and iron indicates that chalcopyrite or chalcocite may have been used in the smelting of copper. Evidence has been found that the bells were cast by pouring the liquid metal from the top of the sand molds that were set up in an upright position. No additional treatments, thermal or mechanical, other than a little grinding were applied upon the completion of casting. After the shaping process, a balancing plate was attached to the top of the bell using a steel connection ring. The connection assembly was then fixed to the main body by using molten bronze as a solder. The surface inscription was found carved using different techniques. The differences in the order of strokes and the calligraphic style indicate that the carving was carried out by more than one master. In the absence of documentary evidence on past bronze technology, the present bronze bells with known chronology, provenance and the main agent of production, prove to be a rare and valuable archaeological material for the understanding of the related technology in use in the early Joseon period.