• 자원리싸이클링
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• 제4권1호
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• pp.4-11
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• 1995

국내 각 채석장 및 석재 가공공정에서 발생되는 폐석과 석분 슬러지를 활용하여 장식재, 바닥재 및 내외장재 등에 쓰이는 인조 석판재 제조기술을 개발하고자 하였다. 인조석재는 폐석과 결합제 및 경화제 등을 혼합하여 제조하였으며 성형압력, 폐석 및 석분 슬러지의 결합비 그리고 결합제의 양 등의 변화에 따른 인조석재 각각의 특성을 비교하였다. 천연석재와 인조석재와의 물성을 비교하기 위하여 $\circled1$ 비중,$\circled2$ 흡수율, $\circled3$ 탄성파속도, $\circled4$ 압축강도, $\circled5$ 인장강도, $\circled6$ 반발경도, $\circled7$ 탄성계수 $\circled8$ 포아송비를 측정하였으며 $\circled9$ 내열성도 함께 조사하였는데 석재의 물성은 원료의 혼합정도, 성형압력 및 결합제의 양에 의해 좌우됨을 알 수 있었다. 본 인조석재의 제조에도 석분에 비해 고가인 결합제의 사용을 가능한한 최소로 하여 폐기물로 배출되는 폐석 및 석분슬러지를 최대한 활용할 수 있도록 하였으며 성형압력 $200kg/\textrm{cm}^2$, 결합제의 양 12~15wt.%의 제조조건에서 원하는 물성을 갖는 인조석재를 제조할 수 있었다.

• 대한기계학회논문집
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• 제16권4호
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• pp.723-736
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• 1992

본 연구에서는 복압력(abdominal pressure) 및 복근(abdominal musles)만을 제외(하중의 계산시 이들의 역활을 포함하였다.) 한 요추골 운동에 관계하는 모든 역 학적 요소를 포함시키고 해부학적으로 매우 충실한 실험용 광탄성 모델과 하중장치를 개발하여, 이러한 모델과 하중장치의 유효성을 임상의학적으로 규명 하는것을 본 연구 의 목적으로 한다.

• Composites Research
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• 제26권4호
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• pp.259-264
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• 2013

본 연구에서는 기계적 전기적 기능을 모두 만족하는 다중대역 스킨구조물에서의 복사 소자를 2중 사출으로 제작하였다. 추후 외부 스킨 구조 변형에 따른 복사 소자의 안정성을 검증하기 위하여 충격 및 좌굴에 대한 시험과 축 하중과 전단 하중에 대한 강도 해석을 실시하였다. 그리고 다중 대역 안테나 스킨 구조의 복사 소자에 대한 실험적 방법과 해석적 방법을 통한 강도 분석 결과, 구조의 허용 하중을 예측하고 충격과 좌굴에 대한 안정성을 평가할 수 있었다.

• Design & Manufacturing
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• 제8권2호
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• 한국정밀공학회지
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• 제28권2호
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.67-72
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• 2001

반도체 칩 캡슐화성형시 칩 캐비티에서의 유동을 보다 엄밀하게 모델링하고 해석하기 위한 연구가 이루어졌다. 리드프레임에서의 구멍부위를 통과하는 유동의 모델링을 시도하였고 리드프레임에서의 열 경계조건을 정확하게 취급하였다. 유동의 이론적 해석을 위해 헬레쇼오 모델을 채택하였고 리드프레임에 의해 아래 위로 분리된 각각의 캐비티로 가정하여 해석하였다. 리드프레임에서 구멍부위를 통과하는 유동은 헬레쇼오 모델링시에 질량 소스(source) 항으로 삽입되었다. 유동해석 프로그램과 콤플렉스 방법에 기반을 둔 최적화 프로그램을 연계하여 미성형 방지를 위한 최적 공정조건을 성공적으로 정확하게 얻어낼 수 있었다.

• Composites Research
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• 제31권6호
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• pp.311-316
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• 2018

In the present study, the effect of GO in damping capacity of CF/epoxy laminates was studied via free vibration analysis. The composite laminates were manufactured by using vacuum assisted resin transfer molding technique. The damping properties of the prepared hybrid composites were determined in terms of natural frequency and damping ratio in free vibration test. The foremost aspire of this investigation was to compare the vibration properties i.e. natural frequency and modal damping of the prepared composites with the numerical results. The numerical study was carried out via FEA using $ANSYS^{TM}$ workbench software. The parametric study of the numerical models was also studied considering the beam free length and the beam thickness. It was found that the incorporation of GO enhanced the damping capacity of the composite and the variation of natural frequencies in mode1varied by 2-5% compared to the experimental study.

• 한국공작기계학회논문집
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• 제16권3호
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• pp.50-55
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• 2007

The purpose of this research is to enhance the luminance of the LED and to improve the implementation of color by mounting an array lens on the LED without special technology in process. The workmanship of key components considering the economical efficiency and the injection molding technology for high quality of the product are essential to achieve it. In this paper, the mold was computer-aided was designed and manufactured by CAM software (NX4) and high speed machining center. the applied final machining conditions were 3,000-5,000mm/min feed speed, 15,000-25,000rpm and ${\Phi}0.3mm$ ball end-mill. And the Flow analysis was performed using the mold flow software(MPI) in order to get uniformity of resin. Injection conditions acquired by the flow analysis and the injection experiment are as follows. The cylinder temperature is $220-260^{\circ}C$, the mold temperature is $70-80^{\circ}C$, the injection time is about 1.2sec, the injection pressure and velocity is each 7.8-14.7Mpa, and the injection velocity is 0.8-1.2m/sec.

• Fibers and Polymers
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• 제2권4호
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• pp.203-211
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• 2001

Residual stresses were predicted by a flow analysis in the mold cavity and residual stress distribution in the injection molded product was measured. Flow field was analyzed by the hybrid FEM/FDM method, using the Hele Shaw approximation. The Modified Cross model was used to determine the dependence of the viscosity on the temperature and the shear rate. The specific volume of the polymer melt which varies with the pressure and temperature fields was calculated by the Tait\`s state equation. Flow analysis results such as pressure, temperature, and the location of the liquid-solid interface were used as the input of the stress analysis. In order to calculate more accurate gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise direction was predicted in two cases, the free quenching, under the assumption that the shrinkage of the injection molded product occurs within the mold cavity and that the solid polymer is elastic. Effects of the initial flow rate, packing pressure, and mold temperature on the residual stress distribution was discussed. Experimental results were also obtained by the layer removal method for molded polypropylene.

• 한국응용과학기술학회지
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• 제24권4호
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• pp.416-426
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• 2007

Polypropylene (PP) composites with wood flour/wax/coupling agent were manufactured by melt compounding and injection molding. The influence of wood flour(WF), wax, and coupling agent on the mechanical and thermal properties of the composites was investigated. The addition of wood flour to neat PP has the higher tensile modulus and strength compared with neat PP. The presence of wax also improved the tensile modulus. At the same loading of PP and WF, the addition of coupling agent highly decreased the tensile modulus, and increased the tensile strength. From thermogravimetric analysis (TGA), the addition of wax improved the thermal stability of the composites in the later stages of degradation. The presence of MAPP and wood flour in turn decreased thermal stabilities of composites. From differential scanning calorimetry analysis (DSC), neither the loading of wax. nor the presence of MAPP has shown significant effect on the thermal transition of composites.