• Resources Recycling
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• v.4 no.1
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• pp.4-11
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• 1995

The amounts of waste stone and stone powder sludge that occurred in the quarry and processing plant of s stone plates, have been increased with the development of stone industry. The manufactunng process of 따tificial s stone was studied to reduce the outlet of these wastes and utilIze them as raw materials for architecture, interior decoration and art work. In order to compare the properties of artiflcial stone with those of natural building-stone, the physi$\alpha$II properties of artificial stone such as specific gravity, absorption ratio, elastic wave velocity, compressive s strength, tensile strength, shore hardness, elasticity and Poission's ratio were measured. From the mesaured d data of physical properties, it was found that physical propertIes of artificial stone were controlled by homogeneous m mixing ratio of constituents, molding pressure, and amount of binder. Also, from the thermo-gravimetric analysis, it was found that artIfIcial stone manufactured had a good thermal stability up to $300^{\circ}C$. It was concluded that t the optimum conditions for manufacturing process of artificial stone were $200kg/\textrm{cm}^2$ of molding pressure, 12-15 w weight % of binder amounts.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.4
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• pp.723-736
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• 1992

Most degeneating diseases and back pains in the orthopaedic disease are originated from the unbalance of stress distribution in the low-lumbar spine. Therefore the stress analysis of lowerback is indispensible to the clinical diagnosis for the developing reason and the developing process of diseases. Therefore the same model materials as following are eveloped to analyze the stress distributions of lower-back by photoelastic experiment. The verterbral body and the process are molded from epoxy resin(the weight ratio of Araldite and hardner is 10 to 3), models are geometrically identical to them in vivo respectively and the ratio of their elastic modulus to that of model material is 1 to 10. It is assured that KE-1300 Silicon(E=0.8MPa), TSE-3562 Silicon(0.5MPa) and the composite silicon(3MPa) (the weight ratio of KE-1300 silicon and Jioreal : 10 to 4) are respectively effective as the model materials of ligament, musles and intervertevral disc which is essential to the movement of low-lumbar spine. All the elements associated with the movement of the low-lumbar spine are molded through the molding method developed in this research and assembled with the angles between the verterbra and the disc in the normal human lumbosacral spine. The stress distributions of the assembled model are analyzed by photoelastic experiment. It is certified by comparing the results of photoelastic experimebt with the clinical situations that the loading dveice and the loading conceptions used in this paper are effective.

• Composites Research
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• v.26 no.4
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• pp.259-264
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• 2013

This study manufactured the radiating element of multi-band antenna skin structure which satisfy electrical and mechanical performance and is made by double injection molding process. Structural test including impact and buckling test is carried out and stress analysis is simulated to evaluate safety of radiating element for the axial and shear loads, when changing of the skin structure is occurred by the external force. To predict allowable load of structure and evaluate safety on impact and buckling, experimental and analytic method is used in strength analysis of structure.

• Design & Manufacturing
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• v.8 no.2
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.67-72
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• 2001

An Effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele-Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The optimization program based on the complex method integrated with flow analysis program has been successfully used to obtain the optimal filling conditions to avoid short shot.

• Composites Research
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• v.31 no.6
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• pp.311-316
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• 2018

In the present study, the effect of GO in damping capacity of CF/epoxy laminates was studied via free vibration analysis. The composite laminates were manufactured by using vacuum assisted resin transfer molding technique. The damping properties of the prepared hybrid composites were determined in terms of natural frequency and damping ratio in free vibration test. The foremost aspire of this investigation was to compare the vibration properties i.e. natural frequency and modal damping of the prepared composites with the numerical results. The numerical study was carried out via FEA using $ANSYS^{TM}$ workbench software. The parametric study of the numerical models was also studied considering the beam free length and the beam thickness. It was found that the incorporation of GO enhanced the damping capacity of the composite and the variation of natural frequencies in mode1varied by 2-5% compared to the experimental study.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.3
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• pp.50-55
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• 2007

The purpose of this research is to enhance the luminance of the LED and to improve the implementation of color by mounting an array lens on the LED without special technology in process. The workmanship of key components considering the economical efficiency and the injection molding technology for high quality of the product are essential to achieve it. In this paper, the mold was computer-aided was designed and manufactured by CAM software (NX4) and high speed machining center. the applied final machining conditions were 3,000-5,000mm/min feed speed, 15,000-25,000rpm and ${\Phi}0.3mm$ ball end-mill. And the Flow analysis was performed using the mold flow software(MPI) in order to get uniformity of resin. Injection conditions acquired by the flow analysis and the injection experiment are as follows. The cylinder temperature is $220-260^{\circ}C$, the mold temperature is $70-80^{\circ}C$, the injection time is about 1.2sec, the injection pressure and velocity is each 7.8-14.7Mpa, and the injection velocity is 0.8-1.2m/sec.

• Fibers and Polymers
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• v.2 no.4
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• pp.203-211
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• 2001

Residual stresses were predicted by a flow analysis in the mold cavity and residual stress distribution in the injection molded product was measured. Flow field was analyzed by the hybrid FEM/FDM method, using the Hele Shaw approximation. The Modified Cross model was used to determine the dependence of the viscosity on the temperature and the shear rate. The specific volume of the polymer melt which varies with the pressure and temperature fields was calculated by the Tait\`s state equation. Flow analysis results such as pressure, temperature, and the location of the liquid-solid interface were used as the input of the stress analysis. In order to calculate more accurate gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise direction was predicted in two cases, the free quenching, under the assumption that the shrinkage of the injection molded product occurs within the mold cavity and that the solid polymer is elastic. Effects of the initial flow rate, packing pressure, and mold temperature on the residual stress distribution was discussed. Experimental results were also obtained by the layer removal method for molded polypropylene.

• Journal of the Korean Applied Science and Technology
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• v.24 no.4
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• pp.416-426
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• 2007

Polypropylene (PP) composites with wood flour/wax/coupling agent were manufactured by melt compounding and injection molding. The influence of wood flour(WF), wax, and coupling agent on the mechanical and thermal properties of the composites was investigated. The addition of wood flour to neat PP has the higher tensile modulus and strength compared with neat PP. The presence of wax also improved the tensile modulus. At the same loading of PP and WF, the addition of coupling agent highly decreased the tensile modulus, and increased the tensile strength. From thermogravimetric analysis (TGA), the addition of wax improved the thermal stability of the composites in the later stages of degradation. The presence of MAPP and wood flour in turn decreased thermal stabilities of composites. From differential scanning calorimetry analysis (DSC), neither the loading of wax. nor the presence of MAPP has shown significant effect on the thermal transition of composites.