• Current Photovoltaic Research
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• 제10권1호
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• pp.1-5
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• 2022

Bifacial photovoltaic (PV) technology has received considerable attention in recent years due to the potential to achieve a higher annual energy yield compared to its monofacial PV systems. In this study, we fabricated the bifacial c-Si PV module with a shingled design using the conventional patterned bifacial solar cells. The shingled design PV module has recently attracted attention as a high-power module. Compared to the conventional module, it can have a much more active area due to the busbar-free structure. We employed the transparent backsheet for a light reception at the rear side of the PV module. Finally, we achieved a conversion power of 453.9 W for a 1300 mm × 2000 mm area. Moreover, we perform reliability tests to verify the durability of our Shingled Design Bifacial c-Si Photovoltaic module.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

• Current Photovoltaic Research
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• 제4권3호
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• pp.119-123
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• 2016

We discussed various cover glass substrates available for photovoltaic (PV) modules, and investigated the fabrication methods of light trapping structures for the efficiency enhancement of PV modules: wet and dry etching or laser and direct patternings. We also introduced the analysis of haze at etched glass surfaces as a function of wavelength and also presented a anti-reflection coating technology for PV module.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 춘계학술발표대회 논문집
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• pp.92-97
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• 2008

To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. The properties of Ethylene Vinyl Acetate(EVA) sheet in photovoltaic encapsulant materials have to meet conditions that are high optical transmittance, good adhesion and high cross-linking rate. The objective of this paper is to understand the property evaluation methods of EVA sheet. Through this research, we could confirm that properties of EVA sheet have an effect on durability and operating efficiency of photovoltaic module.

• 전자공학회논문지A
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• 제31A권12호
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• pp.16-22
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• 1994

In this paper, transmitter and receiver modules for free space optical interconnection are implemented and characterized. In the transmitter module, bias circuitry which inject current into the direct modulated laser diode is fabricated and in the receiver module, p-i-n diode is integrated with an MMIC amplifying stage. Laser diode has a direct-modulated bandwidth of 2 GHz at 1.4 Ith bias while p-i-n diode and amplifying stage has a bandwidth of 1.3 GHz and 1.5 GHz, repectively. Optical interconnection has a bandwidth of 1.3 GHz and linearly transmit modulated voltage signal up to 1.5 Vp-p. Measured loss of optical interconnection is 5dB which is composed of optoelectronic conversion loss of 15 dB, electrical impedance mismatch loss of 6.7 dB in transmitter module and gain of 18 dB in receiver module. Seperation between transmitter and receiver can be extended up to 50 cm by using a lens.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2001년도 종합학술발표회 논문집 Vol.11 No.1
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• pp.222-226
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• 2001

In this paper, 2.4GHz RF Module using Even Harmonic Mixer(EHM) was designed and fabricated for Direct conversion(DC) system. By minimizing performance degradation of DC system with DC offset and LO radiation, the capability of minimization and one chip solution in wireless system was proposed. The designed EHM using anti-parallel diode pair represented 9dB conversion loss and about -60dBm 2LO leakage radiation in RF port, and output reflection and reverse transmission characteristic of low noise amplifier was improved. So superior DC offset suppression characteristic is expected. RF Module which consists of EHM, LNA, RF amplifier, Frequency synthesizer and Duplexer was designed and fabricated.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권6호
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• pp.295-299
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• 2004

A new design technique of fabricating 40 GHz up-converter modules for digital microwave radios has been developed. The design of the up-converter module is based on unit circuit blocks, which are to be characterized using a special test fixture. The complete module design may be as simple as a cascade layout of these unit circuit blocks. Also, the 40 GHz up-converter module employs a new microstrip-to-waveguide transition and a tapped edge-coupled filter, which are less sensitive to fabrication tolerances.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.16-21
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• 2016

In this paper, we have designed and fabricated a receiver module for 5.8GHz Microwave Wireless Power Transmission. The receiver module was composed of an antenna, BPF (Band Pass Filter) and RF-DC converter. The antenna was designed to RHCP (Right Hand Circular Polarization). And we used ${\lambda}g/2$ open-circuited stubs for the BPF. In addition, the RF-DC converter used the tripler voltage circuit for voltage multipliers. The integrated receiver RF module for 5.8GHz Microwave Wireless Power Transmission has been designed and fabricated. The voltage was measured to the distance of 50cm.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.85-88
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• 2017

In this paper, we have designed and fabricated a RF-DC voltage multiplier for 5.8GHz microwave wireless power transmission. In order to obtain higher voltage, the RF-DC voltage multiplier with 10 diodes (D-10) and the receiver module with an antenna and BPF (Band Pass Filter) was manufactured. The measured and compared results show that the voltages of the proposed one are lower than those of the previous tripler module up to 40cm. However, the voltage of the proposed one with the voltage multiplier is higher than that of the tripler module at the distances of 45cm and 50cm due to the voltage multiplier with 10 diodes.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2003년도 추계종합학술대회
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• pp.758-761
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• 2003

전원장치의 소형화 핵심기술인 반도체 스위칭 기술을 이용하여 단일 전원을 사용하는 소형, 경량화 전자기기에 적합한 5 V/500 mA급 트랜스리스형 파워 모듈(transless type power module)을 설계하였다. 파워 모듈은 강압형 chopper 방식을 이용한 스위칭회로, 제어회로, 전압검출회로, 그리고 정전압 회로 둥으로 구성되어 있으며, 하이브리드-집적회로형(hybrid-IC type)으로 제작되었다. 본 연구에서 설계한 스위칭 레귤레이터 전원회로는 5 V/500 mA급 트랜스리스형 파워 모듈의 전기적 특성을 만족하였다.