• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.838-842
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• 2006

0.03Pb$(Sb_{0.5}Nb_{0.5})O_{3}-0.03Pb(Mn{1/3}Nb{2/3)O_{3}-(0.94-x)PbTiO_{3}-xPbZrO_{3}$ ceramics doped with $CeO_{2}$ were synthesized by conventional bulk ceramic processing technique. Phases analysis, microstructures and piezoelectric properties were investigated as a function of $CeO_{2}$ content (0.03, 0.05, 0.1 0.3, 0.5 and 0.7 wt%). Microstructures and phases information were characterized using a scanning electron microscope (SEM) and an X-ray diffractometer (XRD). Mechanical quality factor ($Q_{m}$) and coupling factor(kp) were obtained from the resonance measurement method. Both $Q_{m}$ and $k_{p}$ were shown to reach to the maximum at 0.1 wt% $CeO_{2}$. In order to evaluate the stability of resonance frequency and effective electromechanical coupling factor ($K_{eff}$) as a function of $CeO_{2}$, the variation of resonance and anti-resonance frequency were also measured using a high voltage frequency response analyzer under various alternating electric fields from 10 V/mm to 80 V/mm. It was shown that the stability of resonance frequency and effective electromechanical coupling factor were increased with increasing the $CeO_{2}$ contents.

• Journal of the Korean earth science society
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• v.27 no.3
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• pp.328-340
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• 2006

In Janghwa-ri of Kanghwa Island morphological changes in four transects, 112 surface, and 2 core sediments were analyzed to understand the seasonal variation of the muddy tidal-flat environment. Sedimentary of facies can be classified into four facies; sand, muddy sand, sandy mud, and silt. During winter, the coarse-grained sediment facies expanded seaward. In the subsurface part of the core sediments, poorly sorted silty sediments dominate the area. According to the Pb-210 isotope analysis, accumulation rates of the tidal flat in Jangwha-ri appear to be $5{\sim}19mm/yr$. In the study area, the result is suggestive of a rapid change in depositional environments in recent years.

• Journal of the Korean Society of Food Science and Nutrition
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• v.42 no.7
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• pp.1003-1007
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• 2013

In this study, the antibacterial activities of selected barleys (UB, unhulled barley; PB, pearl barley; and NB, naked barley) and wheat (WG, wheat with germ and endosperm) extracts were evaluated against the food-borne pathogens Staphylococcus aureus KCTC 1927, Escherichia coli KCTC 2593, Salmonella Typhimurium KCTC 2054, and Bacillus cereus KCTC 1014. The amount of the antibacterial biomarker, 2,6-dimethoxy-1,4-benzoquinone (DMBQ), present in selected barleys and wheat, was measured by HPLC. Furthermore, antioxidant activity of samples was determined using the oxygen radical absorbance capacity (ORAC) assay. WG ($22.35{\pm}0.04mm$) was found to be highly inhibitory to Staphylococcus aureus followed by UB ($17.91{\pm}0.10mm$), PB ($16.87{\pm}0.05mm$), and NB ($15.69{\pm}0.20mm$). The antibacterial activity of the selected grains was correlated with antioxidant activities and the amount of DMBQ (Pearson's correlation coefficient, 0.7831). The antioxidant activity of the selected grains was also correlated with the total phenolic content (Pearson's correlation coefficient, 0.9934). WG extract showed significantly higher antibacterial activity, compared with barley extracts such as UB, PB, and NB. The results of this study suggest that barley has a potential in the development of natural antimicrobials and food preservatives for controlling food-borne pathogens.

• Journal of the Microelectronics and Packaging Society
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• v.2 no.1
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• pp.69-75
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• 1995

압전세라믹스를 제조하여 발음체 소자의 두께 직경등의 칫수 변화에 따른 압전발을 체 소자의 전기적 특성 및 압전세라믹스와 금속진동판의 상관관계를 조사하고 공명용 수지 case등을 고려하여 공진 주파수에서 효율좋은 음을 발생시킬수 있는 압전발음체를 설계하였 다. 본 실험에서 사용딘 압전세라믹스 (Pb0.95Sr0.05)(Zr0.53Ti0.47)O3+0.8wt%Nb2O5의 특성은 전 기기계 결합계수(KP)가 69%이며 기계적 품질계수(Qm)은 87 비유전율은 2100 tan$\delta$는 0.016이었다. 금속진동판의 공진주파수는 사용되는 재료의 stiffness와 관계가 있고 주파수 -impedance 특성은 재질의 음속, 밀도, Young율 등에 크게 의존하였다. 주파수 대역 2.0~ 2.2khz에서 공진시키기 위한 공명체의 설계에서 압전세라믹스의 외경과 두께가 각각 14mm, 0.1mm 이고 금속진동판의 그것이 각각 20mm, 0.1mmdlfEo 공명기는 방음공의 직경이 3.0mm, cavity의 직경이 18.5mm, cavity의 높이가 4.5mm의 구조로 설계되었을때가 최적조 건이었다.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.508-513
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• 1994

For Pb-20wt%Cu alloys, severe macrosegregation due to density difference of the resulting phases in normal directional solidification has been minimized and a uniformly aligned dendritic structure has been produced by axially rotating the sample of 5mm diameter in conjunction with horizontal directional solidification. Under the constant growth velocity of $20{\mu}m/sec$, increasing the rotation rate from 0.18 to 12rpm results in a transition from an aligned columnar to an equiaxed Cu-dendritic structure. With a constant rotation rate of 0.18rpm, increasing the growth velocity from 10 to $50{\mu}m/sec$ also has promoted a transition from columnar to equiaxed structure.

• Korean Journal of Crystallography
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• v.12 no.3
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• pp.157-161
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• 2001

The observe relaxation phenomena and freezing behavior in Pb(Mg/sub ⅓/Nb/sub ⅔/O₃, relaxor ferroelectrics, weak electric-field properties as well as strong electric-field properties were investigated. The temperature dependence of the dielectric properties obtained using the low electric-field of 1 V/w was investigated. The dielectric properties obtained from the slope of the dielectric hysteresis loop and the temperature dependence of the pyroelectric properties were also investigated. When fitting all the experimental data with the Vogel-Filcher relation, a close agreement between the experimental data and equation was observed. The freezing temperature could be consistently calculated by the various methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.446-450
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• 2001

In this study, microstructural and electrical properties of (Pb)(La,Nd)$TiO_3$ cerramics were investigated as a function of CuO addition. Taking into consideration Tc of $325^{\circ}C$, dynamic range of 49dB( at the wafer form) and density of $7.71g/cm^{3}$, it can be concluded that the specimen S2 sintered at $1200^{\circ}C$ is the best for the resonator application, Dynamic characteristics of energy-trapped 20MHz SMD type resonator as a function of internal dot size variation were also investigated. Dynamic range characteristics showed the highest value of 60.72dB at S2-4(dot size 1.13mm).

• Journal of Welding and Joining
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• v.19 no.2
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• pp.176-181
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• 2001

Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.446-450
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• 2001

In this study, microstructural and electrical properties of (Pb)(La,Nd)TiO$_3$ ceramics were investigated as a function of CuO addition. Taking into consideration Tc of 3$25^{\circ}C$, dynamic range of 49dB( at the wafer form) and density of 7.71g/㎤, it can be concluded that the specimen S2 sintered at 120$0^{\circ}C$ is the best for the resonator application. Dynamic characteristics of energy-trapped 20MHz SMD type resonator as a function of internal dot size variation were also investigated. Dynamic range characteristics showed the highest value of 60.72dB at S2-4(dot size 1.13mm).

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.