• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.19-22
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• 2004

The resonant planar transformer, which had power capacity of 300 W, input voltage of 220 V, output voltage of 15 V, and switching frequency of 500 kHz, was designed and manufactured by using the planar core with large effective area and the flat copper lead frames for miniaturization and high efficiency of the switching mode power supply (SMPS). As well as, a resonant converter equipped with the above mentioned planar transformer was manufactured and electromagnetic characteristics were investigated. The numerical value of turns for 1st and 2nd winding were 12 and 2 respectively. The self inductance of 1st winding was 33.2 ${\mu}H$, very low leakage inductance of 1.27 ${\mu}H$, and the coupling factor of 0.98 were obtained at switching frequency of 300 kHz. The high efficiency of 88.21 % for the SMPS equipped with planar transformer was obtained at power capacity of 300 W.

• 한국전기전자재료학회논문지
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• 제33권3호
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• pp.225-230
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• 2020

Recently, with the miniaturization of GIS, there is a need for the miniaturization of spacers as accessories. Miniaturized spacers make it difficult to secure adequate insulation distances, resulting in a more concentrated electric field at the triple junction of high-voltage (HV) conductor-insulator (spacer)-insulation gas (SF₆), which is a weakness in GIS. Therefore, by introducing a new concept design technology, functionally graded material (FGM), which is recently applied to various materials and parts industries, three-dimensional control of the dielectric constant distribution in a spacer can be expected to alleviate triple-junction electric field occupancy and improve insulation performance. In this study, we propose an optimized model using NSGA-II to optimize the permittivity distribution of FGM applied spacer.

• 센서학회지
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• 제19권4호
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• pp.259-270
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• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• 한국정밀공학회지
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• 제21권3호
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• pp.180-187
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• 2004

The miniaturization technologies are perceived as potential key technologies of the future. They will bring about completely different ways in which people and machines interact with the physical world. However, at the present time, the primary technologies used fur miniaturization are dependent on the microelectronic fabrication techniques. The principal shortcomings associated with such techniques are related to the inability of to produce arbitrary three-dimensional features not only in electronics but also in a wide range of metallic materials. In this paper, a ultramicro-stereolithography system assisted with a femto-second laser was developed to fabricate the arbitrary three-dimensional nano/micro-scaled features. In the developed process, a femto-second laser is projected according to CAD data on a photosensitive monomer resin, it induces polymerization of the liquid resin. After the polymerization, a droplet of ethanol is dropped to remove the liquid resin and then the polymerized nano-scaled features only remain. By a newly developed process, miniature devices for an extremely wide range of applications would become a technologically feasible reality. Some of nano/micro-scaled features as examples were fabricated to prove the usefulness of this study at the fundamental stage.

• 한국화재소방학회논문지
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• 제32권3호
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• pp.134-139
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• 2018

최근 초미세먼지는 사회적 재난으로 간주될만큼 국민건강에 심각하게 영향을 미쳐 사회문제가 되고 있다. 기존의 미세먼지 측정 방식은 베타선 흡수방식을 사용하여 실시간 측정 및 소형화가 어려운 단점이 존재한다. 본 논문에서는 광산란 방식을 사용하여 소형화 및 저비용의 센싱 장치를 개발하였다. 광산란 방식을 적용한 센서는 내부에 반도체 레이저 다이오드를 사용하여 구성하였으며, 전압레벨의 신호를 주파수레벨로 변환하여 기존 방식의 한계를 극복하고 미세먼지 입자 크기별 분리가 가능하도록 구현하였다. 또한 개발 시스템은 블루투스 통신으로 스마트폰과 연결하여 미세먼를 모니터링하고, 장치를 제어할 수 있다.

• International Journal of Air-Conditioning and Refrigeration
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• 제16권2호
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• pp.64-69
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• 2008

Electronic and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers. The liquid-cooling heat exchangers had twelve rectangular channels with different flow paths of 1, 2, and 12. Silicon rubber heaters were used to control the heat load to the heat exchangers. Heat input ranged from 293 to 800W, and inlet temperatures of working fluid varied from 15 to $27^{\circ}C$. The heat transfer coefficients were strongly affected by flow conditions. All liquid-cooling heat exchangers showed higher cooling performance than the air-cooling heat exchanger. The heat exchanger with 2-paths could provide more controllability on the maximum temperature than the others.

• Earthquakes and Structures
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• 제16권2호
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• pp.149-163
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• 2019

By integrating an active tuned mass damper (ATMD) and an inerter, the ATMDI has been proposed to attenuate undesirable oscillations of structures under the ground acceleration. Employing the mode generalized system, the dynamic magnification factors (DMF) of the structure-ATMDI system are formulated. The criterion can then be defined as the minimization of maximum values of the DMF of the controlled structure for optimum searching. By resorting to the defined criterion and the particle swarm optimization (PSO), the effects of varying the crucial parameters on the performance of ATMDI have been scrutinized in order to probe into its superiority. Furthermore, the results of both ATMD and tuned mass dampers inerter (TMDI) are included into consideration for comparing. Results corroborate that the ATMDI outperforms both ATMD and TMDI in terms of the effectiveness and robustness. Especially, the ATMDI may greatly reduce the demand on both the mass ratio and inerter mass ratio, thus being capable of further miniaturizing both the ATMD and TMDI. Likewise the miniaturized ATMDI still keeps nearly the same stroke as the TMDI with a larger mass ratio. Hence, the ATMDI is deemed to be a high performance control device with the miniaturization and suitable for super-tall buildings.

• Nuclear Engineering and Technology
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• 제55권8호
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• pp.2873-2878
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• 2023

The purpose of this study is to perform radiation monitoring by acquiring gamma images and real-time optical images for ^99mTc vial source using charge couple device (CCD) cameras equipped with the proposed compact gamma camera. The compact gamma camera measures 86×65×78.5 mm³ and weighs 934 g. It is equipped with a metal 3D printed diverging collimator manufactured in a 45 field of view (FOV) to detect the location of the source. The circuit's system uses system-on-chip (SoC) and field-programmable-gate-array (FPGA) to establish a good connection between hardware and software. In detection modules, the photodetector (multi-pixel photon counters) is tiled at 8×8 to expand the activation area and improve sensitivity. The gadolinium aluminium gallium garnet (GAGG) measuring 0.5×0.5×3.5 mm³ was arranged in 38×38 arrays. Intrinsic and extrinsic performance tests such as energy spectrum, uniformity, and system sensitivity for other radioisotopes, and sensitivity evaluation at edges within FOV were conducted. The compact gamma camera can be mounted on unmanned equipment such as drones and robots that require miniaturization and light weight, so a wide range of applications in various fields are possible.

• Design & Manufacturing
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• 제18권2호
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• pp.9-16
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• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• 한국전자파학회논문지
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• 제16권5호
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• pp.526-533
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• 2005

본 논문에서는 GPS 중심 주파수 1.575 GHz에서 마이크로스트립 안테나의 공진 길이 방향 양끝을 접거나 또는 네 방향 끝을 패치 아래로 모두 접어들이는 방법으로 선형 편파와 원형 편파 마이크로스트립 안테나의 소형화시키는 방법을 제시하고 설계, 제작하였다. 먼저 선형 편파의 경우, 마이크로스트립 안테나를 수직으로 내린 구조로써 안테나의 가시 길이를 $31.7\%(\varepsilon_r=1.06)$ 단축시켰으며, 이러한 접혀진 상태의 안테나를 다시 한번 안테나의 중심방향으로 접어 넣는 구조로 선형 편파 마이크로스트립 안테나를 구현하였다 그 결과 안테나의 가시 길이 단축율은 $73.6\%$이었으며 이득 5.12 dBd를 얻었다 -10 dB bandwidth는 $64MHz(4\%)$이고, E-plane과 H-plane의 HPBW는 각각 $151^{\circ},\;79.2^{\circ}$이었다. 또한 원형 편파의 경우, 네 방향 모두 선형 편파 안테나의 폴디드 구조를 적용시켰으며 접혀 넣어진 밑면의 면적 활용도를 높이기 위해 삼각형 구조로 설계하였다. 이때 안테나의 가시 면적 축소율은 $72.5\%$이었으며, 이득은 3.96 dBd이었다. -10 dB bandwidth는 $84 MHz(5.3\%)$, E-plane과 H-plane의 HPBW는 각각 $80.6^{\circ}$과 $82.1^{\circ}$이었다 이 결과들로부터, 선형 편파와 원형 편파의 폴디드 마이크로스트립 안테나가 일반적인 마이크로스트립 패치 안테나의 특성을 유지하면서 소형화되었기 때문에 본 논문에서 제안된 구조가 소형화에 적합함을 확인할 수 있었다.