• Journal of Electrical Engineering and Technology
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• v.3 no.1
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• pp.121-124
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• 2008

This paper presents the fabrication and field emission of carbon nanotube field emitters for a micro mass spectrometer. The carbon nanotube is an adequate material as a field emitter since it has good characteristics. We have successfully fabricated a diode field emitter and a triode field emitter. Each field emitter has been constructed using several micromachining processes and a thermal CVD process. In the case of the diode field emitter, to increase the electric field, the carbon nanotubes are selectively grown on the patterned nickel catalyst layer. The electron current of the diode field emitter is 73.2 ${\mu}A$ when the anode voltage is 1100V. That of the triode field emitter is 3.4 pA when the anode voltage is 1000V.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.5
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• pp.1363-1371
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• 1996

This paper presents the design, fabrication, and testing of polysilicon electrostatic microactuators that resonate in the direction parallel to the silicon susbstrates. A set of six different designs has been developed using a theoretical model and design formulae developed for the mocroactuators. Microactuator prototypes are fabricated from a 2.1 $\mu{m}$-thick LPCVD polysilicon film, using a 4-mask surface-micromachining process. The prototypes are tested under a d.c. bias voltage of 45V with an a.c. drive voltage amplitude of 20 v.Measured resorant frequencies are in the ranges of 40-60 kHz, showing a good agreement to their theoretical estimates within error bounds of .$\pm$.5%. Important issues inthe design and microfabrication of the microactuators are discussed, together with potential applicaitons of the key technology involved.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.1
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• pp.24-28
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• 2005

A micromachined biochip with a three dimensional silicon chamber was developed for the construction of biosensors. Anisotropic etching was used fur the formation of the chamber on the p-type silicon wafer(100) and then was glued to the Pyrex glass bottom-substrate with pre-deposited platinum electrode. The electrochemical characterization of its Pt electrode and Ag/AgCl reference electrode was investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.181-184
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• 2002

In these day, fabrication technologies for micro parts become more important with the increase of interest on microsystem and developed through the various approaches in the whole world. Among these technologies; micro mechanical machining is one of the most effective methods for the fabrication of micro parts. In this study, we fabricated micro shafts using micro endmill and micromachining system and measured the cutting force at the process. Also, Based on the data, we simulated the deformation of micro shafts due to the cutting force. Through the simulation results, it was verified that the cutting force at the process is enough to cause dimensional error at the micro shafts.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2245-2247
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• 2000

The purpose of this paper is to demonstrate for the design and the fabrication of suspended spiral inductors using the micromachining technology. Also. the characteristics of spiral inductors with substrate lossless are simulated by lumped-element model. The absence of the lossy silicon substrate after micormachining results in significantly improved quality factor characteristics of 14. Micromachined spiral inductors have the improvement of a quality factor of about 60% than spiral inductors on silicon which is not micromachined.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.121-126
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• 2012

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is $200{\mu}m$ and $190{\mu}m$, respectively. The gap between sensing elements is only $10{\mu}m$. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with $10{\mu}m$ alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.925-928
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• 2005

In this study, we fabricated the DAMLs using surface micromachining technology as well a low loss coupler for the millimeter-wave band applications using these DAMLs. The structure of DAML is that a signal line is supported on ground plane by dielectric posts. Therefore it has advantages about the loss characteristic and the stable structure. The other advantage of the DAML process is a simple and convenient technique using 4 mask steps, even if it has a micromachining technology. The lowest loss of the fabricated DAML was obtained 2.2 dB/cm at 110 GHz. To obtain the low loss characteristic, couplers were designed and fabricated by using DAMLs. The fabricated ring hybrid coupler has the coupling of 3.58 dB and the thru of 3.31 dB at 60 GHz. We can also obtain the coupling of 3.42 dB, the thru of 3.82 dB from fabricated branch line coupler at 60 GHz.

• Journal of Welding and Joining
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• v.24 no.1
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• pp.26-32
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• 2006

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.2
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• pp.121-127
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• 2008

This paper presents design and fabrication of optimized geometry structure of electrostatic inkjet head. In order to verify effect of geometry shape, we simulate electric field intensity according to the head structure. The electric field strength increases linearly with increasing height of the micro nozzle. As the nozzle diameter decreases, the electric field along the periphery of the meniscus can be more concentrated. We design and fabricate the electrostatic inkjet heads, hole type and pole type, with optimized structure. It was fabricated using thick-thermal oxidation and silicon micromachining technique such as the deep reactive ion etching (DRIE) and chemical wet etching process. It is verified experimentally that the use of the MEMS inkjet head allows a stable and sustainable micro-dripping mode of droplet ejection. A stable micro dripping mode of ejection is observed under the voltages 2.5 kV and droplet diameter is $10\;{\mu}m$.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.