• Journal of the korean Society of Automotive Engineers
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• v.13 no.1
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• pp.57-65
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• 1991

It is experimented under rotary bending stress that the spacing of two micro hole flaws is adjacent and that it is distant. In order to observe the behavior of fatigue crack propagation, two kinds of specimens are tested under constant stress and periodic overstressing. Although the crack occurs faster when two micro-hole flaws are adjacent than when they are distant, but there is no difference of the number of fracture cycles between two. The crack propagates slower under low-high block stress than under high-constant stress, and it propagates faster under high-low block stress than under low-constant stress. The influence of two-step block stress is serious right after the stress varies.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.152-159
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• 2000

In piercing operation for small hole in very thin plate, micro burrs are formed. The micro burr is very difficult to remove because the thin plate is to be deformed during deburring and deteriorate accuracy. As a first step to remove the micro burrs effectively, the burr must be measured accurately as much as possible. For most micro burrs are so small as less than 10$\mu\textrm{m}$, it is very difficult to measure. Several methods are reviewed to measure the micro burr formed in piercing operation from very thin plate with thickness less than 0.1mm. Also the effective deburring methods are reviewed. Barreling ultrasonic and chemical deburring methods are performed and the results are compared.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.170-175
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• 1998

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.245-252
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• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric md hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $Al_2O_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• Journal of the Korean Society for Railway
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• v.5 no.2
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• pp.118-124
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• 2002

The failure probability of wheel beyond 10$\^$7/ cycles is achieved by the strengths-stress interference model for the evaluation of fatigue strength and reliability in the wheel, From plane bending fatigue test results, the fatigue life (N$\_$f/) for the smooth and 200㎛ holed specimens can be represented as $\sigma$$\_$a/ = 1326N$\_$f/$\^$-0.10/ and $\sigma$$\_$a/ = 2894N$\_$f/$\^$-0.18/. Respectively, fatigue strength of the wheel at beyond 10$\^$7/cycles was about 332 MPa. And, the fatigue strength for the specimen with a micro hole (d=200㎛) which simulated an inclusion on the wheel surface was about 235 MPa. Thus, a micro hole (d=200㎛) caused about 30% reduction of fatigue strength of the specimen. The failure probabilities for the smooth and micro-holed specimens, derived from the strength-stress interference model, are 0.0148% and 13.05%, respectively. The current finding suggests that at least 200 ㎛ sized inclusion, which might be produced during manufacturing process, will cause a critical effect on integrity of the railway vehicle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.786-790
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• 2016

Hole explosion behaviors were observed during drilling fine holes with laser beam on the LTCC green bar of $320{\mu}m$ thick after lamination of green sheets prepared by tape casting of thick film process. The incidence of these hole explosions was inversely proportional to hole sizes. The incidence of hole explosion was 20 % number of hole with the size of $60{\mu}m$ exploded for the UV radiation, while the explosion did not appear for hole sizes over $100{\mu}m$. To prevent hole explosion behavior during laser-drilling of fine holes, carbon black powder was added as an additive in the LTCC composition, which has superior thermal durability. As a consequence, hole explosion rate was suppressed to 0.8 % for the hole size of $50{\mu}m$ green sheet with the carbon black amount of 10 weight % and the laser power of 3 watt. Added carbon is thought to reduce the heat-affected region during laser drilling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.119-120
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• 2008

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.