• Current Photovoltaic Research
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• 제4권1호
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• pp.21-24
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• 2016

Chalcopyrite based (CIGS) thin films have considered to be a promising candidates for industrial applications. The growth of quality CIGS thin films without secondary phases is very important for further efficiency improvements. But, the identification of complex secondary phases present in the entire film is crucial issue due to the lack of powerful characterization tools. Even though X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and normal Raman spectroscopy provide the information about the secondary phases, they provide insufficient information because of their resolution problem and complexity in analyzation. Among the above tools, a normal Raman spectroscopy is better for analysis of secondary phases. However, Raman signal provide the information in 300 nm depth of film even the thickness of film is > $1{\mu}m$. For this reason, the information from Raman spectroscopy can't represent the properties of whole film. In this regard, the authors introduce a new way for identification of secondary phases in CIGS film using depth Raman analysis. The CIGS thin films were prepared using DC-sputtering followed by selenization process in 10 min time under $1{\times}10^{-3}torr$ pressure. As-prepared films were polished using a dimple grinder which expanded the $2{\mu}m$ thick films into about 1mm that is more than enough to resolve the depth distribution. Raman analysis indicated that the CIGS film showed different secondary phases such as, $CuIn_3Se_5$, $CuInSe_2$, InSe and CuSe, presented in different depths of the film whereas XPS gave complex information about the phases. Therefore, the present work emphasized that the Raman depth profile tool is more efficient for identification of secondary phases in CIGS thin film.

• Journal of Welding and Joining
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• 제27권3호
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• pp.73-79
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• 2009

This present paper investigated the mechanical properties and the microstructures of each penetration shapes classifying the conduction shape area and the keyhole shape area about electron beam welded 120(T)mm thick plated aluminum 5052 112H. As a result the penetration depth is increased linearly according to the output power, but the aspect ratio is decreased after the regular output power. In the conduction shape area, the Heat affected zone is observed relatively wider than the keyhole shape area. In the material front surface of the welded specimen, the width is decreased but the width in the material rear surface is increased. After the measuring the Micro Vikers Hardness, it showed almost similar hardness range in all parts, and after testing the tensile strength, the ultimate tensile strength is similar to the ultimate tensile strength of the base material in all the specimens, also the fracture point was generated in the base materials of all the samples. In the result of the impact test, impact absorbed energy of the Keyhole shape area is turned up very high, and also shown up the effect about four times of fracture toughness comparing the base material. In the last result of observing the fractographs, typical ductile fraction is shown in each weld metal, and in the basic material, the dimple fraction is shown. The weld metals are shown that there are no other developments of any new chemical compound during the fastness melting and solidification.

• Restorative Dentistry and Endodontics
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• 제32권2호
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• pp.130-137
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• 2007

본 연구의 목적은 니켈티타늄 전동파일의 피로파절에 있어서 표면 결함의 역할을 규명하고자 fatigue tester에서 반복적 인 fatigue force를 부여한 후 파절된 단면을 주사전자현미 경으로 관찰하여 파절 역학을 규명하는 것이다. 총 45개의 #30/.04 taper와 21 mm의 HEROShaper 니켈-티타늄 전동파일을 15개씩 3개의 군으로 분류하였다. 제 1군은 결함이 없는 새 HEROShaper파일, 제 2군은 제조과정에서 metal rollover나 machining marks와 같은 표면결함을 갖는 HEROShaper파일, 제 3군은 임상에서 4- 6개의 구치부 근관의 확대에 사용한 HEROShaper 파일을 사용하였다. 모든 파일들은 회전속도(300 rpm)와 pecking distance (3 mm)가 일정하게 맞춘 fatigue tester에서 파절될 때까지 시간을 측정한 후 통계분석을 통해 각 군간의 유의성을 분석하였고, 파절 단면의 farctographic analysis를 통해 파절역학을 규명하고자 하였다 실험결과 평균 파절시간에 있어서 group 1과 2, group 1과 3사이에는 통계학적으로 유의할 만한 차이가 있었으나 (p<0.05), group 2와 3사이에는 통계학적인 차이가 없었다. Fractographic analysis 결과 대부분의 파절면에서 microvoid와 dimple 소견을 갖는 ductile fracture양상이 관찰되었다. 또한 brittle fracture가 일어난 파절면에서는 파절선 전방에 수 많은 striation들이 관찰되었고 transgranular 및 intergranular cleavage 소견도 보였다. 표면결함이 있는 제 2, 3 군의 파절단면에서는 모든 시편에서 표면결함이 관찰되었다. 이와 같은 결과로 미루어 보아 표면결함이 반복 피로파절에서 미세균열의 기시점으로 중요한 역할을 하며 fractography분석법은 Ni-Ti 파일의 파절역학을 규명하는데 유용함을 알 수 있었다.