• 제목/요약/키워드: micro hole

검색결과 328건 처리시간 0.037초

미세 전해 구멍 가공에서의 가긍 조건에 따른 가공 간극 변화 특성 (Effect of Machining Conditions on machining gap in Micro Electrochemical Drilling)

  • 김보현;박병진;주종남
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.163-169
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    • 2005
  • Micro hole is ode of basic elements for micro device or micro parts. Micro electrochemical machining (ECM) can be applied to the machining of micro holes less than 50 ${\mu}m$ in diameter, which it is not easy to apply other techniques to. For the machining of passivating metals such as stainless steel, machining conditions should be chosen carefully to prevent a passive layer. The machining conditions also affect the machining resolution, In this paper, machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel.

유리의 미세 초음파 가공 시 입구 진원도 향상 및 출구 크랙방지 (Roundness Improvement and Exit Crack Prevention in Micro-USM of Soda-Lime Glass)

  • 홍지훈;김덕환;주종남;김보현
    • 대한기계학회논문집A
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    • 제31권10호
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    • pp.1039-1045
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    • 2007
  • Ultrasonic machining (USM) is suitable for machining hard, brittle and non-conductive materials such as silicon, glass and ceramics. Usually, when micro holes are machined on glass by USM, roundness of hole entrance is poor and cracks appear around the hole exit. In this paper the machining characteristics were studied for roundness improvement and exit crack prevention. From experiments, the tool bending and the shape of tool tip affect hole roundness. When the tool tip is hemispherical, good roundness of holes was obtained. The feedrate and the rotational speed of the tool affect the exit crack. With the machining conditions of 150 rpm in spindle speed and $0.5\;{\mu}m/s$ in feedrate, micro holes with less than $100\;{\mu}m$ in diameter were machined without an exit crack.

In Line Plastic-Optical-Fiber Temperature Sensor

  • Seo, Hyejin;Shin, Jong-Dug;Park, Jaehee
    • Current Optics and Photonics
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    • 제5권3호
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    • pp.238-242
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    • 2021
  • In this paper, we present an in line plastic-optical-fiber (POF) temperature sensor based on intensity modulation. The in line POF temperature sensor is composed of a POF, including an in-fiber micro hole filled with reversible thermochromic material, the transmittance of which depends on temperature. The reversible thermochromic material was cobalt chloride/polyvinyl butyral gel. A cobalt chloride solution of concentration 30.8 mM was formulated using 10% water/90% ethanol (v/v) solution, and gelled by dissolving polyvinyl butyral in this solution. Four types of in line POF sensors, with in line micro holes of four different diameters, were fabricated to measure temperature in the range of 25 to 75 ℃. The output optical power of all of these in line POF temperature sensors was inversely proportional to the temperature; the relation between output power and temperature was approximately linear, and the sensitivity was proportional to the diameter of the in-fiber micro hole. The experimental results indicate that an in line POF sensor can be used effectively for measuring moderate temperatures.

미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성 (Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process)

  • 신승용;임성한;주병윤;오수익
    • 소성∙가공
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    • 제13권1호
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

마이크로 구멍 가공 중의 열적 현상에 관한 연구 (A Study on the Thermal Behavior during Micro Hole Drilling)

  • 류승호;조동우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.79.1-84
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    • 1995
  • The thermal analysis method containing micro drilling characteristic is proposed for the first time. There are such problems in thermal analysis of micro hole drilling as the thermal modeling complexity of drilling process and the undesirable micro drilling characteristic. Especially, the undesirable micro drilling characteristic prevents our using conventional thermal modeling. To model the thermal behavior of the micro drilling process, the finite different method, where heat source vectors are distributed by the measured rhrust and torque, is proposed. This method agrees with thermal behavior of the real system. And, it enable to predict the temperature field near the drill during. The validity of this method is verified in comparing with experimental results.

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미세구멍의 미세방전 가공에서 가공율과 전극소모 특성 (Machining Rate and Electrode Wear Characteristics in Micro-EDM of Micro-Holes)

  • 김규만;김보현;주종남
    • 한국정밀공학회지
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    • 제16권10호
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    • pp.94-100
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    • 1999
  • Micro-EDM is widely used in machining of miro-parts such as micro-shafts and micro-holes. In order to select proper machining conditions and to reduce the machining time, it is necessary to understand machining characteristics under various machining conditions. Micro-hole machining tests were performed with round shape electrodes with different capacitances and voltages of the power source. The effects of the electrode rotational speed and diameter on the machining rate were also observed. From the experimental results, it was found that capacitance and voltage have significant effects on machining rate and the machined surface integrity. With higher capacitance and higher voltage, higher machining rate was observed together with poorer surface integrity. The electrode diameter was also found to have an effect on the machining rate and electrode wear.

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微小圓孔材의 疲勞크랙擧動 과 페라이트 結晶粒度 (Behavior of Fatigue Crack around Micro-Hole and Ferrite Grain Size)

  • 송삼홍;오환섭
    • 대한기계학회논문집
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    • 제9권4호
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    • pp.421-429
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    • 1985
  • 본 연구에서는 결함에서 발생전파하는 피로크랙거동과 결정입대소와의 관계를 검토하기 위하여, 페라이트 결정입을 열처리에 의하여 변화시킨 재료에, 우선 .PHI.0.3mm 의 미소원공을 가공한 시험편을 준비하고, 피로한도거동, 피로크랙발생거동, 피로크랙 전파거동, 응력레벨의 고저에 따른 피로크랙의 발생, 전파거동등과 페라이트 결정입의 대소와의 관계등을 금속현미경 관찰을 토대로 상세히 고찰하였다.

후면기공을 갖는 마이크로스피커와 덕트형 스피커시스템사이의 연관성 해석 (Analysis of the Relation Between Micro-Speaker with the Back Holes and the Ducted Speaker-System)

  • 이에스더;오세진
    • 한국음향학회지
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    • 제26권3호
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    • pp.115-122
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    • 2007
  • 본 연구에서는 마이크로스피커의 구조와 특성을 유닛과 덕트형 인클로저로 구성되어 있는 일종의 덕트형 스피커시스템처럼 취급할 수 있음을 처음으로 보여주었다. 후면기공의 면적이 증가할수록 스티프니스는 감소하고 컴플라이언스는 증가하였다. 그 결과로써, 후면기공의 면적이 증가할수록 공명진동수가 컴플라이언스의 제곱근에 비례하여 증가하였다. 후면기공의 면적이 감소함에 의하여 중저음 영역에서의 기준음압레벨이 지수함수적으로 감소하였다.

Micro-EDM 채널가공에서 초음파 가진의 영향 (Effect of Ultrasonic Vibration on Micro-EDM Channel)

  • 임희성;홍민성
    • 한국생산제조학회지
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    • 제25권6호
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    • pp.421-425
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    • 2016
  • Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

표면 Texture 및 나노 Particle 공정에 의한 III-V 태양전지의 효율 변화

  • 신현욱;오시덕;이세원;최정우;신재철;김효진
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.320-320
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    • 2012
  • III-V 화합물 태양전지는 실리콘, CdTe, CIGS, 염료, 및 유기 등 다른 태양전지에 비해 1sun 상 30% 이상의 고효율을 갖고 있고 앞으로도 계속 증가할 수 있는 가능성을 갖고 있다. 그 이유는 직접천이형 밴드갭, 높은 이동도 등의 고성능 물질특성과 더불어 3족과 5족의 비율을 조절함으로써 같은 결정구조를 갖고 에너지 밴드갭이 다른 물질들을 만들기에 용의하여, 태양전지 스펙트럼의 넓은 영역을 흡수할 수 있는 장점이 있기 때문이다. 그러나, 셀자체의 물질이 실리콘에 비하여 고가이므로, 고성능이 요구되는 우주 인공위성등에 적용이 되었지만, 2000년대 이후로 집광에 적용가능한 태양전지의 연구를 거듭하여 2005년부터는 값싼 프레넬 렌즈를 이용하여 1sun에 비해 500배 해당하는 빛을 셀에 집광하여 보다 효율을 증가시킴으로써 지상발전용에도 적용가능한 셀을 형성하게 되었다. 더불어 태양전지의 효율을 증가시키기 위한 개선된 구조적 변화의 시도도 많이 이루어지고 있다. 최근 보고에 의하면 실리콘 태양전지의 표면에 texture 또는 나노 구조를 주어 높은 흡수율과 낮은 반사율을 갖게 함으로써 효율을 증가시키는 사례가 많아지고, III-V 화합물 태양전지도 texturing에 의해 증가된 효율을 발표한바 있다. 본 연구에서는 태양전지의 효율을 증가시키기 위하여 III-V 화합물 태양전지 표면에 micro-hole array texture 구조를 형성한 후 나노 particle을 이용한 나노 texture 구조를 형성하였다. Photo-lithography와 chemical wet etching으로 micro-hole array texture 구조를 형성하였으며 micro-hole의 직경은 $5{\sim}20{\mu}m$, hole과 hole의 간격은 $3{\sim}15{\mu}m$로 다양하게 변화를 주었다. 형성된 micro-hole array texture 구조위에 수십 nm 크기의 particle을 만들어 chemical wet etching으로 나노 texture 구조를 형성하였다. 태양전지 표면에 texture 구조가 있는 경우와 없는 경우에 각각 효율을 측정, 비교 분석하였다.

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