• Title/Summary/Keyword: micro conductive line

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Micro Patterning of Nano Metal Ink for Printed Circuit Board Using Inkjet Printing Technology (잉크젯 프린팅 기술을 이용한 나노 금속잉크의 인쇄회로기판용 미세배선 형성)

  • Park, Sung-Jun;Seo, Shang-Hoon;Joung, Jae-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.5
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    • pp.89-96
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    • 2007
  • Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • Jeong, Jae-U;Kim, Yong-Sik;Yun, Gwan-Su
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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Micro Patterning of Conductive Line by Micro Droplet Ejection of Nano Metal Ink (나노 금속잉크의 미세 액적 토출을 이용한 마이크로 패터닝)

  • Seo S.H.;Park S.J.;Jung H.C.;Joung J.W.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.689-693
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    • 2005
  • Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

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Commercialization & Process Optimization of Protective Film on Nano Silver Transparent Conductive Substrate by Means of Large Scale Roll-to-Roll Coating and Experimental Design (나노실버 투명전도소재 보호필름의 개발 및 공정 최적화와 실험 계획법을 이용한 검증)

  • Park, Kwang-Min;Lee, Ji-Hoon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.12
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    • pp.813-820
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    • 2015
  • We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

Effect of Micro Surface Structure on Printed Electronics (미세표면구조가 전자인쇄에 미치는 영향)

  • Kim, Seung-Hwan;Kang, Hyun-Wook;Lee, Kyung-Heon;Sung, Hyung-Jin
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.9
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    • pp.20-25
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    • 2010
  • The effect of micro surface structure on printing for printed electronics has been studied experimentally. The photolithography MEMS fabricationwass used to make a SU-8 molder which has micro structures on the surface, and the PDMS micro structure was fabricated by the PDMS molding method. In the aspect of printed electronics, we used silver paste conductive ink. We measured the surface energy variation on pillar microstructure. The microstructure was used to real printing experiment by a screen printing. We printed 1cm micro lines which have $30{\sim}250{\mu}m$ width, and checked the conductivity to sort out opened line pattern. Printability was defined by success probability of printed patterns and we found that the present microstructures improve the printability significantly.

A Study of Substrate Surface Treatment and Metal Pattern Formation using Inkjet Printing Technology (잉크젯 프린팅 기술을 이용한 기판 표면처리와 금속 패턴 형성에 관한 연구)

  • Jo, Yong-Min;Park, Sung-Jun
    • Journal of ILASS-Korea
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    • v.17 no.1
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    • pp.20-26
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    • 2012
  • Inkjet printing is one of the direct writing technologies and is able to form a pattern onto substrate by dispensing droplets in desired position. Also, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. To form a metal pattern, it must be harmonized with conductive nano ink, printing process, sintering, and surface treatment. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense $20-40{\mu}m$ diameter droplets and silver nano ink which consists of 50 nm silver particles. In addition, hydrophobic treatment of surface, overlap printing techniques, and sintering conditions with changing temperature and times to achieve higher conductivity.

For High Aspect Ratio of Conductive Line by Using Alignment System in Micro Patterning of Inkjet Industry (화상정렬 시스템을 이용한 잉크젯 반복인쇄기술)

  • Park, Jae-Chan;Park, Sung-Jun;Seo, Shang-Hoon;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.154-154
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    • 2006
  • Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.

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Effect of Conductive Particles on Electrical Conductivity using EHD Ink Jet Printing Technology (EHD Ink Jet Printing 기술을 이용한 Conductive Particle의 전기전도도에 미치는 영향)

  • Ahn, Ju-Hun;Lee, Yong-Chan;Choi, Dae-San;Lee, Chang-Yull
    • Journal of Aerospace System Engineering
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    • v.12 no.6
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    • pp.1-8
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    • 2018
  • ACF, which is used for the transparent electrode film is manufactured by the thermocompression method with conductive particles. However, the method has disadvantages since there are many wasted materials and the process is complex. To overcome the demerits of the conventional method, EHD printing technology with conductive particles ink is proposed. The line thickness of patterning is influenced by the characteristics of the inks and the printing conditions. Therefore, it is salient to find the most conducive conditions for the micro patterning. In this paper, the ink with conductive particles was manufactured, and the patterning results were obtained by varying the nozzle thickness and the flow rate. The electrical conductivity according to the ejection of the particles ink is obtained.