• 제목/요약/키워드: metallized

검색결과 42건 처리시간 0.025초

Metallized Electrospun Nanofiber webs with Bulckled Configuration for Highly Transparent and Stretchable Conductors

  • Jin, Yusung;Hwang, Sunju;Jeong, Soo-Hwan
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.363.1-363.1
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    • 2016
  • Transparent and stretchable conductors are expected to be an essential component in future stretchable optoelectronic devices. Until now, two main methods have been commonly employed to fabricate transparent and stretchable conductors by using metal nanomaterials: creating buckling configurations and creating network configurations. In this report, a novel strategy for obtaining transparent and stretchable conductors is presented, one that employs these two main approaches simultaneously. To the best of our knowledge, this proposed configuration of a buckled long nanofiber network in this study has not yet been reported. In order to provide the transparent conductors with dual mode stretchability originating from simultaneous buckled and network configurations, a buckled Au@polyvinylpyrrolidone (PVP) nanofiber network (hereafter referred to BANN for convenience) was fabricated by transferring Au-metallized electrospun PVP nanofibers onto a prestrained polydimethylsiloxane (PDMS) substrate. Our BANN shows considerably lower strain sensitivity of resistance than that of straight Au@PVP nanofiber network. Durability tests conducted by performing cyclic tensile strain reveal that the relative change in resistance of BANN (prestrain = 20%) is quite small after 1000 cycles. We also demonstrate that this BANN exhibits superior performance over widely used indium tin oxide conductors with regard to high optical transmittance and low sheet resistance.

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Silver Immobilization on Honeycomb-patterned Polyvinypyrrolidone thin Films via an Electroless Process

  • Kim, Bong-Seong;Kim, Won-Jung;Kim, Young-Do;Huh, Do-Sung
    • Bulletin of the Korean Chemical Society
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    • 제32권12호
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    • pp.4221-4226
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    • 2011
  • Honeycomb-patterned polyvinypyrrolidone (PVP) thin films coated with nanometer-sized silver particles were prepared using honeycomb-patterned polystyrene (PS) template films fabricated by casting a polystyrene solution under humid condition. Silver was first metallized on the patterned PS films via silver nitrate ($AgNO_3$) reduction using tetrathiafulvalene (TTF) and a small amount of PVP as the reductant and dispersing agent, respectively. The effects of $AgNO_3$, TTF, and PVP solution concentrations during the reduction process in acetonitrile were determined to obtain a uniform silver-coated honeycomb-patterned PS film. Second, the silver-metallized patterned porous PS films were filled with high PVP concentration solutions via the spincoating process. Silver-coated patterned PVP films were obtained by peeling off the PVP layer from the template PS film after drying. The results show that the honeycomb-patterned PVP films uniformly coated with silver particles are conveniently obtained using the silver-coated patterned PS template, although the direct fabrication of these films using water droplets under humid conditions was not feasible because of the water solubility of PVP.

알루미나(Al$_2$O$_3$) 세라믹 표면의 강메탈라이징법에 관한 연구 (A Study on the Copper Metallizing Method of $Al_2$O$_3$ Ceramic Surface)

  • 최영국;김정관
    • Journal of Welding and Joining
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    • 제13권3호
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    • pp.55-64
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    • 1995
  • Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

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Monoazo 金屬錯염의 合成 (Syntheses of Metallic Monoazo Complexes)

  • 한치선;박대철;남궁하일;강용익
    • 대한화학회지
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    • 제12권3호
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    • pp.99-105
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    • 1968
  • 몇가지 ortho-hydroxy monoazo 化合物들을 合成하여 이것들을 遷移元素로 金屬化시켰다. 三酸化크롬, 酢酸銅 및 酢酸코발드를 이 金屬錯鹽生成反應에 使用하였다. 이 硏究에서 다음과 같은 事實들을 알 수 있었다. (1) 이 金屬錯鹽生成反應에서의 溶媒는 다른 여러가지 有機溶媒보다는 물이 가장 좋고, (2) 金屬錯鹽生成反應 混合液의 가장 適當한 液性은 pH=4.5~5.5程度 이었으며, (3) 이들 monoazo 金屬錯鹽의 물에 대한 溶解性은 主로 그 錯鹽의 組成에 달렸으나 어느 程度는 分子內의 黃酸基의 存在에 의하여서도 影響을 받는다. 그리고 (4) 分子當 두개의 ortho-hydroxy基를 가진 金屬錯鹽이 더 强한 結合能을 가지고 있다.

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저온소결 세라믹기판용 Cordierite계 결정화유리의 합성 및 특성조사에 관한 연구;(IV) Sol-Gel법으로 코팅한 Cu분말을 이용한 Metallizing (Synthesis and Characterization of Cordierite Glass-Ceramics for Low Firing Temperature Substrate; (IV) Metallizing by Using Cu Powder Coated by Sol-Gel Method)

  • 김병호;문성훈;이근헌;임대순
    • 한국세라믹학회지
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    • 제31권4호
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    • pp.427-435
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    • 1994
  • Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.

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조미김 포장을 위한 PET/PVA-BA/OPP 다층필름 제조 및 특성분석 (Preparation and Characterization of PET/PVA-BA/OPP Multi-layer Films for Seasoned-laver Packaging)

  • 임미진;김도완;서종철
    • 한국포장학회지
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    • 제23권1호
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    • pp.9-15
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    • 2017
  • 수증기 및 산소에 대한 차단성이 개선된 PVA-BA 코팅 조성액의 포장소재로의 적용가능성을 확인하기 위하여 콤마 코팅과 라미네이션 공정을 이용하여 PET/PVA-BA/OPP 다층필름을 제조하였다. PCT 전 후의 PET/PVA-BA/OPP 다층필름의 기체, 수증기 차단특성 및 인장강도를 확인하였고 이를 PA/PA/EVOH/PP 다층필름의 물성과 비교하였다. PVA내 BA 함량이 증가함에 따라 물성이 증가하는 것을 확인할 수 있었지만, PCT 후 PET/PVA-BA/OPP 다층필름의 산소, 수증기 차단특성 및 인장강도는 감소하는 경향을 보였다. 이는 PVA-BA층 내 증가한 가교밀도와 관련이 있는 것으로 판단된다. 또한, 조미김을 이용한 저장특성분석에서, PET/PVA-BA/OPP다층필름은 PP/Al-metallized PP 다층필름에 비해 조미김의 지방산화를 야기시키는 요인을 효과적으로 억제하는 것으로 판단된다. 하지만, PP/Al-metallized PP 다층필름에 비해 PET/PVA-BA/OPP 다층필름의 상대적으로 높은 수분투과특성 때문에 Aw에 큰 장점을 확인하지 못하였다. 따라서, 물성 극대화 및 포장소재로 적용을 위해서는 PET/PVA-BA/OPP 다층필름 내 수분 차단성 향상에 대한 추가적인 연구가 필요하다는 것을 확인하였다.

MULTI-RUN EFFECTS ON THE SOLID FUEL RAMJET COMBUSTION

  • Tae-Ho Lee
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 1995년도 제5회 학술강연회논문집
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    • pp.3-8
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    • 1995
  • An experimental investigation was conducted in order to figure out the multiple fire effects on the combustion efficiency and fuel properties of the solid fuel ramjet. Pure HTPB and metallized $B_4$C/HTPB fuel were studied. Fuel property effects were analyzed by using differential scanning calorimetry, The thermal or mechanical properties of the fuel grain were not affected and the combustion efficiency was a little increased.

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전도성 금속 피복재의 전기전도도에 의한 전자파 차폐효과 분석 (Analysis of Electromagnetic Wave Shielding Effectiveness from Electrical Conductivity of Metallized Conductive Sheets)

  • 김영식;최익권;김성수
    • 한국재료학회지
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    • 제9권9호
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    • pp.913-918
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    • 1999
  • 전자파 차폐특성 측정방법의 일환으로 매질의 전기전도도로부터 차폐효과를 정성적 수준에서 예측하는 연구를 수행하였다. 사용된 시편은 전도성 금속 (Cu, Ni)이 피복된 망사형 차폐재로 두께는 0.1 mm 정도이고, 전기전도도는 6.4$\times$10~2.4$\times$10(sup)5 mhos/m 범위 값을 가졌다. 물질상수와 시편의 두께로 표시되는 반사손실 및 흡수손실의 이론식을 도출하고 상기 시편에 대해 차폐효과를 계산하였다. 전도성 피복재의 경우 주된 차폐기구는 반사손실임을 밝힐 수 있었으며, 전기전도도가 증가함에 따라 차폐효과는 현저히 증가함을 알 수 있었다. 이들 이론치를 임피던스 실측치로부터 계산된 반사손실과 비교한 결과 10 dB 이내의 오차를 보임으로써 제안한 분석방법의 타당성을 입증하였다.

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필름 Capacitor의 전기적Damage에 관한 연구 (electrical Damage of Metallized Film Capacitors)

  • 서광석
    • 대한전기학회논문지
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    • 제40권6호
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    • pp.574-581
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    • 1991
  • Damage in film capacitors has been investigated, using FTIR and ESCA, aiming to elucidate the nature of electrode removal and the possibility of base films to be damaged. Also, tests were conducted to investigate the effect of a long-term thermal aging at elevated temperatures. Unsuccessful clearing or grape-clustering processes can induce a long-term degradation which involves the chemical and morphological changes. Major changes are the oxidation and the decrease in surface crystallinity possibly arising from the corona discharge. An immediate deterioration of BOPP film may occur when the air entrapped between the film layers induces an extensive autocatalytic oxidative degradation. This type of immediate damage may result in a premature failure at an early stage of qualification test. As far as the nature of electrode removal is concerned, a permanent removal of electrode materials was observed in the main erosion area.

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