• Title/Summary/Keyword: metal stress

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CNT-Ni-Fabric Flexible Substrate with High Mechanical and Electrical Properties for Next-generation Wearable Devices (차세대 웨어러블 디바이스를 위한 높은 기계적/전기적 특성을 갖는 CNT-Ni-Fabric 유연기판)

  • Kim, Hyung Gu;Rho, Ho Kyun;Cha, Anna;Lee, Min Jung;Ha, Jun-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.2
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    • pp.39-44
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    • 2020
  • Recently, numerous researches are being conducted in flexible substrate to apply to wearable devices. Particularly, Conductive substrate researches that can implement the wearable devices on clothing are massive. In this study, we formed fiber substrate spraying CNT and Pd mixed solution on it and plated metal layer with electroless plating. Used SEM equipment and EDS analysis to analysis structure of the plated fiber substrate and discovered Ni layer was created. For check electrical properties, mapping was performed to check surface resistance and distribution of resistance of electroless plated fiber substrate with 4-point probe. It was confirmed that conductivity was improved as the duration of electroless plating was increased, and it was found that distribution of resistance by surface location was uniform. Changes in resistance due to mechanical stress were measured through tensile, bending, and twisting tests. As a result, it was confirmed that resistance change of flexible substrate gradually disappeared as plating time increased. Using UTM (Universal testing machine), it was analyzed mechanical properties of the electroless plated substrate with respect to changes in plating time were improved. In the case of conductive fiber substrate in which electroless plating was performed for 2 hours, tensile strength was increased by 16 MPa than fiber substrate. Based on these results, we found that Ni-CNT-Fabric flexible substrate is adequate for clothing-intergrated conductive substrate and we positively expect that this experiment shows flexible substrate can adapt to and develop not only a wearable device technology but also other fields needing flexibility such as battery, catalyst and solar cell.

The Effect of Application Levels of Slurry Composting and Bio-filtration Liquid Fertilizer on Soil Chemical Properties and Growth of Radish and Corn (총각무와 옥수수 재배시 SCB액비 시용수준이 토양화학성과 생육에 미치는 영향)

  • Kang, Seong-Soo;Kim, Min-Kyeong;Kwon, Soon-Ik;Kim, Myong-Suk;Yoon, Sung-Won;Ha, Sang-Gun;Kim, Yoo-Hak
    • Korean Journal of Soil Science and Fertilizer
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    • v.44 no.6
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    • pp.1306-1313
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    • 2011
  • A liquid fertilizer treated with slurry composting and biofiltration (SCB) process has been applied increasingly on agricultural field but the effects on the soil properties and crop production has not been throughly evaluated. This study was conducted to investigate the effect of the SCB application on soil chemical properties and the growth of radish and corn. SCB liquid fertilizer as a basal fertilization was treated with five levels based on $6kg\;10a^{-1}$ for radish and $10kg\;10a^{-1}$ for corn. The experimental design was the completely randomized block design with five levels and three replicates. Electrical conductivity (EC), $NO_3$-N, Exch. K and Exch. Na increased depending on the treatment levels of SCB. There were no changes in soil organic matter, Avail. $P_2O_5$, Exch. Ca and Exch. Mg. EC, $NO_3$-N and Exch. Na content decreased as precipitation increased. Especially, they decreased up to the initial condition before the treatment after the heavy rainy season in 2008. Although Exch. K decreased at the rainy season, they remained relatively higher content after the experiment on August, 2008. Fresh weight and the amount of N uptake of radish increased due to the levels of SCB, but corn did not present any significant increase. It is recommended that we need to decide the proper amount of SCB as well as the application method on the field to increase the productivity and decrease environmental stress. Additional experiments also need to clarify the effect of the trace element and heavy metal accumulations due to long term application of SCB.

Preparation of Silica Nanoparticles via Recycling of Silicon Sludge from Semiconductor Dicing Process and Electro-responsive Smart Fluid Application (반도체 다이싱 공정에서 발생하는 실리콘 슬러지를 재활용한 실리카 나노입자의 제조 및 전기감응형 유체로의 응용)

  • Yeon-Ryong Chu;Suk Jekal;Jiwon Kim;Ha-Yeong Kim;Chan-Gyo Kim;Minki Sa;Hyung Sub Sim;Chang-Min Yoon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.31 no.3
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    • pp.15-25
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    • 2023
  • In this study, silicon sludge from semiconductor dicing process is recycled to fabricate silica nanoparticles, which are applied as dispersing materials for electro-responsive (ER) smart fluid. In specific, metal impurities are removed from silicon sludge by acid washing to obtain the high-purity silicon powder. And then, silica nanoparticles are synthesized by facile hydrothermal method employing the silicon powder as reactant material. To control the size of silica nanoparticles, the reaction time of hydrothermal method is varied as 8, 15, 20, and 30 hours are applied to control the size of silica nanoparticles. Sizes of silica nanoparticles are increased proportionally to the reaction time owing to the increased numbers of hydrolysis and condensation reactions. As-synthesized silica nanoparticles are prepared as electro-responsive smart fluids by dispersing into silicon oil. Silica nanoparticles synthesized by 30 hours of hydrothermal reaction (SiO2-H30) exhibit the highest shear stress of 21.4 Pa under an applied electric field strength of 3.0kV mm-1. Such enhancement in ER performance of SiO2-H30 among various silica nanoparticles are attribute to the reinforcing effect originated from the mixed particle size, which allowing the formation of rigid chain-like structures. Accordingly, this study successfully propose a recycling method of silicon sludge to synthesize silica nanoparticles and their derived ER fluids, which may suggest new possibility to ESG management emphasizing the eco-friendliness.