• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.600-602
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• 1995

Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• 한국표면공학회지
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• 제45권1호
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• pp.43-52
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• 2012

Recently, it has been developed for Eco-environment, Super light, Multi-functional nano materials. As needed mobile parts in Smart phone or TV, computer, information communication for high pass signal, multi-function, Magnetic thin film materials have been developed. As last, magnetic powder, sintered and sputtering parts were thick and low purity than electroplating layer, low pass signal and noise were resulted, vibrated TV screen. Because chemical complex temperature was high and ununiform surface layer, it has been very difficult for data pass in High Frequency (GHz) area. Large capacity data pass is used to GHz. Above GHz, signal pass velocity is dependent on Skin Effect of surface layer. If surface layer is thick or ununiform, attachment is poor, low pass signal and cross talk, noise are produced and leaked. It has been reported technical trend of Electrochemically plating and Surface treatment of Metal, Polymer, Ceramic etc. by dispersion/complex for Multi functional nano-magnetic material in this paper.

• 한국표면공학회지
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• 제32권6호
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• pp.686-694
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• 1999

Insoluble anodes of the Ta/Ir mixed metal oxide for electrodeposition of Ni-W alloy in ammoniacal citrate bath were prepared by thermal decomposition method. Ti plate was etched in boiling oxalic acid solution and coated with ethanol solution of $TaCl_{5}$ and $IrCl_4$ mixed in a fixed ratio, followed by drying and treating at various temperatures. The coating layer of these insoluble anode was characterized by SEM, EDX, XRD and DSC. The decomposition rate of citric acid in plating bath was determined by measuring the $CO_2$ gas evolved at the anodes with Gas Chromatography. Evolution of $CO_2$ gas from Ta/Ir oxide anodes decreased about 5% compared with that of Pt. The $CO_2$ gas evolution was increased with the amount of Ir-oxide in the coatings. The coatings which have more than 40% ratio of Ta content and heat-treated at the temperature higher than $400^{\circ}C$ showed better efficiency

• 한국표면공학회지
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• 제37권1호
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• pp.22-27
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• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• 한국표면공학회지
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• 제34권4호
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• pp.337-341
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• 2001

TiN coating of high speed end mill is recently generalized. The study of coating layer using ion plating is mainly about the coating method and the why of the longer life of coated tools. In CNC machning process, metal cutting isn't carry out until the tools including the end-mill and so on are fractured. Namely, it is difficult precision processing when the cutting force of the cutting tool is near the limit the fracture cutting force. So, the estimate of the life by wear and fracture is important. Therefore, this study is about the method to estimate the capacity of the coating layer in relation to the tendency of cutting force and the influence of the cutting capacity of coated end-mill by the condition N2, Ar, temperature. The cutting length is in inverse proportion to the cutting force ratio. So, the life of the TiN coated end mill can be predicated by the ratio of the increase of the cutting force.

• 한국표면공학회지
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• 제37권5호
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• pp.243-248
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• 2004

A palladium-nikel(Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support formed with nickel powder. Plasma surface treatment process is introduced as pre-treatment process instead of HCI activation. Pd coating layer was prepared by dc magnetron sputtering deposition after $H_2$ plasma surface treatment. Palladium-nickel alloy composite layer had a fairly uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature of 773 K and pressure of 2.2psi. The hydrogen permeance was 6 ml/minㆍ$\textrm{cm}^2$ㆍatm and the selectivity was 120 for hydrogen/nitrogen($H_2$/$N_2$) mixing gases at 773 K.

• 한국표면공학회지
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• 제17권1호
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• pp.1-6
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• 1984

The fluidized bed electrode reactor(FBER) with conducting particles has been made use of the removal of metals from dilute electroplating rinse water. The electrolysis was carried out under the conditions of diaphragm current density with 2~28A/$dm^2$ and bed expansion with 20~50%. Recirculating batch operations have been shown that the metal concentration dropped exponentially and may be taken down to 10 ppm. And then, the current efficiency at a concentration of 10 ppm copper was 37% under the conditions of 30% bed expansion and 6 A/$dm^2$, and at concentrated electrolyte (2000ppm copper) was over 80% in the range of 8~28A/$dm^2$ and 20~50% bed expansion. One of the technical possibilities of fluidized bed electrolysis is the separation of copper and nickel from a mixed solution of copper and nickel.

• Bulletin of the Korean Chemical Society
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• 제20권11호
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• pp.1313-1318
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• 1999

Lewis bases were employed to control the stoichiometry of ferrite film prepared by light enhanced plating (LEP) technique. When 2,2'-bipyridyl was used as a Lewis base, conversion electron Mosbauer spectroscopy (CEMS) and x-ray powder diffraction (XRD) experiments showed that the main component of the ferrite films was metal-deficient magnetite (Fe3(1-δ)O4). Nonstoichiometry and roughness of LEP films were increased by the addition of 2,2'-bipyridyl. Using ethylenediaminetetraacetate (EDTA) as a Lewis base, produced film that was a mixture of magnetite and Υ-FeO(OH). No low temperature transition (Verwey transition) of magnetite was detected in resistivity and ac-susceptibility measurements for the LEP films. Surface morphology of the LEP films was observed by atomic force microscopy (AFM). The size of dominant particles was about 0.2 μm.

• 한국표면공학회지
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• 제34권5호
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• pp.429-434
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• 2001

Ti-Cu-N nanocomposite films deposited by arc ion plating and magnetron sputter hybrid system with various copper contents. The microstructure and mechanical properties of Ti-Cu-N superhard nanocomposite films depend on the Cu concentration. In X-ray diffraction (XRD) analysis, intensity of TiN (111) and TiN (220) peak decreased and peak broadness increased with increasing the copper contents and Cu peak was not detected. The grain size of films decreased with increasing at%Cu and Transmission Electron Microscopy (TEM) analysis also showed that Ti-Cu-N film containing 1.5at%Cu was composed of very fine (<10nm) nanocrystalline grains. The maximum hardness of Ti-Cu-N (1.5at%Cu) film reached to 45GPa and friction coefficient was measured 0.3.