• Environmental Analysis Health and Toxicology
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• 제21권4호
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• pp.357-363
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• 2006

Chromium compounds are widely used in diverse industries including pigment manufacturing, painting, metal plating and leather tanning. With the wide uses of chromium, various adverse effects of the compounds on the environment and human health have been reported. Among them, hexavalent chromium [Cr (VI)], which is a carcinogenic heavy metal, has been widely studies. Epidemiological investigations have shown that respiratory cancers had been found in workers who had been occupationally exposed to Cr (VI). In this study, cell toxicity and induction of reactive oxygen species (ROS) by Cr (VI) (1, 2, 4, $8{\mu}M$) in cultured human bronchial epithelial cells were investigated. Exposure of the cells to Cr (VI) led to cell death, ROS increase, and cytosolic caspase-3 activation. The ROS increase was related with the decreased level of GSH. Chromatin condensation and fragmentation were occurred by Cr (VI) when evaluated by DAPI staining or agarose gel electrophoresis of the extracted DNA. Expression of ROS related genes including glutathione S-transferase, heme oxygenase-1, metallothionein were significantly induced in Cr (VI) treated cells. This result suggests the toxicity in cultured cells by Cr (VI) was expressed through the apoptotic process with ROS induction.

• Journal of Welding and Joining
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• 제35권3호
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.339-339
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• 2007

Metal coating on ceramic powder has long been attracting interest for various applications such as superconductor where the brittle nature of high temperature ceramic superconductor was complemented by silver coating and metalloceramics where mechanical property improvement was achieved via electroless plating. More recently it has become of great interest in embedded passive device applications since metal coating on ceramic particles may result in the enhancement of the dielectric properties of ceramic-polymer composite capacitors. In our study, nickel ion-containing solution was used for coating commercial capacitor-grade $BaTiO_3$ powder. After filtering process, the powder was dried and heat-treated in 5% forming gas at $900^{\circ}C$. XRD and TEM were utilized for the observation of crystallization behavior and morphology of the particles. It was found that the nickel coating characteristics were strongly dependent on the several parameters and processing variables, such as starting $BaTiO_3$ particle size, nickel source, solution chemistry, coating temperature and time. In this paper, the effects of these variables on the coating characteristics will be presented in some detail.

• 마이크로전자및패키징학회지
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• 제27권2호
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• pp.39-44
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• 2020

최근 웨어러블 장치에 적용하기 위한 유연성 기판에 대한 연구가 활발히 진행되고 있다. 특히, 유연성 기판 중 의복에 웨어러블 장치를 적용하기 위한 전도성 섬유기판에 대한 연구가 진행되고 있다. 본 연구에서는, 면섬유 기판 표면에 CNT와 Pd복합 용액을 스프레이 법을 이용하여 형성하였고, 무전해 도금법을 이용하여 금속층을 도금하였다. 도금된 섬유기판의 형상을 분석하기 위하여 SEM 장비를 이용하였고, CNT를 증착한 섬유기판의 표면에 Ni 레이어가 형성된 것을 확인하였다. EDS 분석을 통하여 섬유기판의 표면에 형성된 물질이 Ni임을 알 수 있었다. 전기적 특성을 확인하기 위하여 4-point probe로 무전해 도금을 진행한 섬유기판의 표면저항 및 저항 분포를 확인하기 위한 맵핑을 진행하였다. 무전해 도금의 진행 시간이 길어질수록 전도성이 향상되었음을 확인할 수 있었고, 표면 위치 별 저항의 분포가 균일함을 알 수 있었다. 인장력, 굽힘, 뒤틀림 시험을 통하여 기계적 스트레스로 인한 저항변화를 측정하였다. 그 결과 도금 시간이 길어질수록 유연성 기판의 저항변화가 점점 사라지는 것을 확인하였다. UTM(Universal testing machine)을 이용하여 도금시간 변화에 대한 무전해 도금 기판의 기계적 특성 향상 여부에 대하여 분석하였다. 인장강도는 무전해 도금을 2 시간 동안 진행한 전도성 섬유기판의 경우, 면섬유 기판보다 약 16 MPa 증가하였다. 이러한 결과들을 토대로 Ni-CNT-Fabric 유연기판은 의류 일체형 전도성 기판으로 이용되기에 충분함을 확인하였고, 이러한 연구 결과는 유연기판, 웨어러블 디바이스뿐만 아니라 유연성이 필요한 배터리, 촉매, 태양전지 등에 적용되어 발전에 기여할 수 있을 것으로 기대한다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.140-143
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• 2003

The drawbead is an important part in sheet metal forming for automotive part and its effect is affected by various process parameters. Therefore in this study, drawbead friction test was performed at various process parameters - panels (cold rolled and galvanized sheet steel), lubricants (having three different viscosities), bead materials(steel, iron) and surface treatment of bead (Cr plating). Circular shape bead has been used for the test. The results show that friction and drawing characteristics were mainly influenced by the nature of zinc coating, viscosity of lubricants, surface treatment of a bead and hardness of coated layer.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.718-721
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• 2007

The ionic-polymer-metal-composite actuators have the best merit for bio-mimetic locomotion because of their large bending performance. Especially, they have the advantage for mimicking a fish-like motion because IPMCs are useful to be actuated in water. So we have developed IPMC actuators with multiple electrodes for realization of biomimetic motion. This actuator is fabricated by combining electroless plating and electroplating techniques capable of patterning precisely and controlling a thickness of Pt electrode layer. The FRF analysis was conducted by a mechanical shaker and direct electrical excitation which is based on sweep sine wave function. From this result, the proper young‘s modulus of Platinum was investigated and applied on expecting the vibration characteristics of patterned IPMC actuator. The calculated maximum displacement of the patterned IPMC was 2.32mm under an applied 4mN/mm. The natural frequency was increased however displacement was decreased in according to increase a thickness of Pt.

• 한국막학회:학술대회논문집
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• 한국막학회 1993년도 추계 총회 및 학술발표회
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• pp.65-67
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• 1993

도금공업은 공업기반기술의 하나로서 기계 및 소재산업의 최종 마무리 공정으로 중요시 되고 있으나 운전중 기술의 특성에 의하여 중금속이 함유된 도금폐수를 방출하게 되어 인체 및 생태계에 매우 유해한 산업중의 하나이다. 기존의 도금폐수처리 방븝으로 침전 응집법이 있으나 이는 사용되는 약품의 양이 많고, 슬러지를 배출하여 2차 공해를 유발하므로 완전한 처리 방법이라 할 수 없다. 본 연구에서는 이러한 국내 도금폐수의 현황을 조사한바 도금폐수중 배출양이 가장 많은 아연계폐수를 대상으로 RO Membrane를 사용하여 실험하였다. RO Membrane으로 실험하였을때 아연이온은 Retentate로 분리 농축되고 Permeate는 재생수로 순환 사용할 수 있는 도금폐수의 무배출 처리공정(Zero-Discharge System) 개발을 존 연구의 목적으로 하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.281-281
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• 2013

본 연구에서는 고출력 금속 인쇄회로기판(Metal PCB) 개발을 위해 절연층으로 양극산화막을 형성하고 이 절연층 위에 Screen Printing 법을 이용하여 Ag paste를 패턴 인쇄한 알루미늄 기판을 사용하였다. 이 기판 위에 무전해 방식으로 구리 박막을 성장시켜, 무전해 도금 조건이 구리 박막 성장에 미치는 영향에 대해 연구하였다. 무전해 도금 시, pH 농도와 plating 온도를 변화시켜 이 변화에 따른 무전해 구리도금 박막의 물리적/전기적 특성을 비교 분석하여 무전해 도금에 의해 형성된 구리 박막과 기판과의 상관 관계도 비교 검토하였다. XRD (X-ray Diffraction), 광학현미경, FE-SEM (Field Emission Scanning Electron Microscope)등을 이용하여 성장된 구리 박막 및 기판의 결정성, 표면 및 단면 형상 등을 측정하였고, XPS (X-ray Photoelectron Spectroscopy)를 이용하여 무전해 도금에 의한 Cu의 화학구조 및 불순물 상태를 조사하였다.

• 한국전기전자재료학회논문지
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• 제17권12호
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• Journal of Welding and Joining
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• 제12권4호
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.