• 제목/요약/키워드: metal plating

검색결과 335건 처리시간 0.025초

NEW PROGRESS IN TiN-BASED PROTECTIVE COATINGS DEPOSITED BY ARC ION PLATING

  • Huang, R.F.;Wen, L.S.
    • 한국표면공학회지
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    • 제32권3호
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    • pp.265-275
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    • 1999
  • Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

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알루미늄 주조용 SKD61 금형강의 표면처리 방법에 따른 특성 평가 (Characteristic Evaluation According to the Surface Treatment Method of SKD61 Mold Steel for Aluminum Casting)

  • 최세원;김철우;김용호;유효상
    • 열처리공학회지
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    • 제34권6호
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    • pp.281-286
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    • 2021
  • Arc ion plating (AIP), laser cladding, and nitriding are methods that can prevent mold damage or repair and create cracks and breakages on the die surface. The dissolution and soldering behavior of coated SKD61 by using arc ion plating, laser cladding, and nitriding was investigated. The structure of the coating was investigated as a function of deposition conditions by X-ray diffraction and the crystallographic orientation was determined using the texture factor. The TiAlN film deposited with AIP showed excellent corrosion resistance in the molten aluminum alloy at 680℃. In this paper, we have detailed the corrosion and mass loss phenomena associated with these steel-cast metal interactions.

Low-cost Contact formation of High-Efficiency Crystalline Silicon Solar Cells by Plating

  • 김동섭;이은주;김정;이수홍
    • 신재생에너지
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    • 제1권1호
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    • pp.37-43
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    • 2005
  • High-efficiency silicon solar cells have potential applications on mobile electronics and electrical vehicles. The fabrication processes of the high efficiency cells necessitate com placated fabrication precesses and expensive materials. Ti/Pd/Ag metal contact has been used only for limited area In spite of good stability and low contact resistance because of Its expensive material cost and precesses. Screen printed contact formed by Ag paste causes a low fill factor and a high shading loss of commercial solar cells because of high contact resistance and a low aspect ratio. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting In an energy conversion efficiency of $20.2\%\;on\;0.50{\Omega}cm$ FZ wafer. Tapered contact structure has been applied to large area solar cells with $6.7\times6.7cm^2$ in order to reduce power losses by the front contact The tapered front metal contact Is easily formed by the electroplating technique producing $45cm^2$ solar cells with an efficiency of $21.4\%$ on $21.4\%\;on\;2{\Omega}cm$ FZ wafer.

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Removal of Chromium by Activated Carbon Fibers Plated with Copper Metal

  • Park, Soo-Jin;Jung, Woo-Young
    • Carbon letters
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    • 제2권1호
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    • pp.15-21
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    • 2001
  • In this work, activated carbon fibers (ACFs) were plated with copper metal using electroless plating method and the effects of surface properties and pore structures on chromium adsorption properties were investigated. Surface properties of ACFs have been characterized using pH and acid/base values. BET data with $N_2$ adsorption were used to obtain the structural parameters of ACFs. The electroless copper plating did significantly lead to a decrease in the surface acidity or to an increase in the surface basicity of ACFs. However, all of the samples possessed a well-developed micropore. The adsorption capacity of Cr(III) for the electroless Cu-plated ACFs was higher than that of the as-received, whereas the adsorption capacity of Cr(VI) for the former was lower than that of the latter. The adsorption rate constants ($K_1$, $K_2$, and $K_3$) were also evaluated from chromium adsorption isotherms. It was found that $K_1$ constant for Cr(III) adsorption depended largely on surface basicity. The increase of Cr(III) adsorption and the decrease of Cr(VI) adsorption were attributed to the formation of metal oxides on ACFs, resulting in increasing the surface basicity.

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A Composite of Metal and Polymer Films: Thin Nickel Film Coated on a Polypropylene Film after Atmospheric Plasma Induced Surface Modification

  • Song, Ho-Shik;Choi, Jin-Moon;Kim, Tae-Wan
    • Transactions on Electrical and Electronic Materials
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    • 제12권3호
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    • pp.110-114
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    • 2011
  • Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

금속 Ni 분말을 용해하여 제조된 용액에서 Ni 농도 변화가 전기도금 된 Ni 필름 특성에 미치는 영향 (Influence of Change of Ni Concentration in Baths Fabricated by Dissolving Metal Ni Powders on Properties of Electrodeposited Ni Film)

  • 윤필근;박덕용
    • 한국표면공학회지
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    • 제52권2호
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    • pp.78-83
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    • 2019
  • Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

크롬 취급 사업장의 작업환경 및 근로자 폭로 실태에 관한 연구 (A Study of Working Environments and Workers Exposed to Chromium)

  • 유병철;손병철;전진호;손혜숙;한용수;이채언;정운
    • Journal of Preventive Medicine and Public Health
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    • 제27권3호
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    • pp.517-530
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    • 1994
  • For the purpose of providing the basic data for health management of workers who are exposed to chromium and for improving the quality of working environment, the authors evaluated blood and urinary level of chromium, the occupational history. AST, ALT, Hb, Hct, nasal specular examinaton on 287 workers who have been dealed chromium compounds in 56 manufacturing Industries of five types, that is, 38 metal plating services(plating),4 manufacture of other fabricated metal products (fabricated metal product), 5 manufacturing of dyestuff(dyestuff), 6 dressing and dyeing of leather(leather), 3 others(manufacture of pottery and ceramic househod wares, motor vehicles, electronic valves and tubes and other electronic components) and also measured the level of chromium in air from February to October 1993. The results were as follows ; 1. The utilized type of chromium compounds was the hexavalent state in plating fabricated metal product dyestuff, leather and the trivalent state in .other, and atmosperic chromium concentration as geometric mean was $0.0138mg/m^3(0.001{\sim}0.068mg/m^3)$ in plating, $0.0115mg/m^3(0.006{\sim}0.015mg/m^3)$ in fabricated matal product, $0.068mg/m^3(0.002{\sim}0.019mg/m^3)$ in dyestuff, $0.0083mg/m^3(0.002{\sim}0.028mg/m^3)$ in leather $0.0039mg/m^3(0.003{\sim}0.005mg/m^3)$ in other by the type of industry and it exceeded TLV-TWA ($0.05mg/m^3$) in five (13.6%) of plating services. 2. The geometric mean of chromium in blood was $1.54{\mu}g/dl(0.10{\sim}3.62{\mu}g/dl)$ in Plantng, $0.94{\mu}g/dl(0.27{\sim}2.82{\mu}g/dl)$ in fabricated metal product, $0.51{\mu}g/dl(0.10{\sim}3.25{\mu}g/dl)$ in dyestuff, $0.87{\mu}g/dl(0.15{\sim}8.00{\mu}g/dl)$ in leather, $0.55{\mu}g/dl(0.20{\sim}2.28{\mu}g/dl)$ in other by the type of industry(p<0.001). 3. The geometric mean of chromium in urine was $14.47{\mu}g/l(6.90{\sim}28.00{\mu}g/l)$ in planting, $4.63{\mu}g/l(0.24{\sim}43.00{\mu}g/l)$ in fabricated metal product, $5.93{\mu}g/l(1.00{\sim}33.00{\mu}g/l)$ in dyestuff, $11.09{\mu}g/l(0.80{\sim}48.00{\mu}g/l)$ in leather, $12.41{\mu}g/l(10.10{\sim}41.00{\mu}g/l)$ in other by the type of industry(p<0.001). 4. As the result of nasal specular examination, twenty four cases (8.4%) of nasal septal perforation among 287 total subjects was observed, and there were 17 (9.7%) cases in plating, 4 csaes (14.3%) in dressing and dyeing of leather. In the comparison of chromium concentration in blood and urine between the perforated group and non-perforated group, the perforated group showed a significantly higher value as $1.883{\pm}3.055{\mu}g/dl\;and\;0.793{\pm}0.815{\mu}g/dl$(P<0.001), $21.31{\pm}34.610{\mu}g/L\;and\;9.304{\pm}11.079{\mu}g/L$ (P<0.001). 5. The mean concentration of chromium in blood, urine and the mean level of AST, ALT, Hb and Hct in exposure group were higher than those of control group(p<0.001).

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폐도금액내 유가금속(Ag) 회수 공정에 대한 전과정 환경성 분석 (Life Cycle Environmental Analysis of Valuable Metal (Ag) Recovery Process in Plating Waste Water)

  • 김다연;이성유;황용우;권택관
    • 자원리싸이클링
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    • 제32권2호
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    • pp.12-18
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    • 2023
  • 우리나라는 2018년 기준 전기전자 분야에서 은 수요는 249백만 톤으로 조사되었으며, 태양광 모듈용으로는 81백만 톤으로 조사되었다. 현재 태양광 모듈 설치의 급증으로 해당 분야의 은 사용량 또한 증가하고 있는 추세이다. 그러나 우리나라의 금속자원 및 부존량은 소비량 대비 부족한 실정이며, 금속자원 중 은광의 국내 자급률은 2021년 기준 약 2.2%로 매우 낮은 상황으로 조사되어 이를 개선하기 위해 금속산업에서 발생하는 폐도금액내 함유되어 있는 유가금속 자원회수기술을 통한 재활용이 필요하다고 판단된다. 따라서, 본 연구에서는 전과정평가를 통해 폐도금액 내 유가금속 회수공정 개선에 따른 영향평가 결과를 비교 분석하고자 하였다. 그 결과, 개선을 통해 GWP 및 ADP는 각각 약 49% 및 67% 저감되는 것으로 나타났다. 그 중, 전기 및 상수의 GWP는 각각 98% 및 93% 저감되는 것으로 나타나 에너지 소비 최소화에 크게 기여하는 것으로 나타났다. 따라서, 재자원화 기술의 발전이 화학물질 및 에너지의 사용 절감할 수 있으며, 이를 통해 도시광산산업에서 자원생산성을 향상시킬 수 있을 것으로 판단된다.

한국전통가구의 금속 손잡이 영문표기 연구 - 한국 및 서구를 중심으로 - (A Study on Terminology of Metal Handles in Traditional Korean Furniture - Focusing on Korean and Western Furniture -)

  • 문선옥
    • 한국가구학회지
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    • 제23권4호
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    • pp.449-459
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    • 2012
  • The article aims to making a comparison between traditional Korean and Western furniture metal handles to give the detail information of the handle terms by analyzing the related literature including internet and interviews. In terms of that, the Korean and Western metal handles are compared in the types, components, materials, methods, and terms affecting the development made by the craftsmen before the Industrial Revolution about the mid or late 18th century. As a result, first, ring and drop pull handles were mostly and wooden knobs were a little used to open the furniture doors and drawers. The Korean drop pulls, Deulswae, came out after the ring pulls, Gori, while the Western drops called loop or bail handles as well, came out before the ring pulls. Second, the components were composed by ring, Gori, loop or bail, Deulswae, Post, Baemok, washer, Baemokbatchim, and backplate, Deulswaebatchim. Most of the Western handles were fastened by the bolt and nut, while the post of two strips, Baemok, fastened the Korean metal handles. Third, the metal handles were created of brass and iron mostly, gilded gold and silver. Forth, the method were largely used by casting, engraving, forging, plating, and hammering in the Korean handles, and by casting, molding, engraving, and stamped in the Western handles. Finally, the terms such as "knobs, pulls, drops, ring and drop pulls, loop or bail handles, posts, washers, backplate, casting, molding, engraving, forging, plating, and stamped" were clarified by the two comparison in Korean and English.

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LTCC 보호층 형성에 따른 박막 전극패턴에 관한 연구 (Effect of Protective layer on LTCC Substrate for Thin Metal Film Patterns)

  • 김용석;유원희;장병규;박정환;유제광;오용수
    • 한국재료학회지
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    • 제19권7호
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    • pp.349-355
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    • 2009
  • Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.