• Title/Summary/Keyword: metal ink

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Inorganic Printable Materials for Thin-Film Transistors: Conductor and Semiconductor

  • Jeong, Sun-Ho;Song, Hae-Chon;Lee, Byung-Seok;Lee, Ji-Yoon;Choi, Young-Min;Ryu, Beyong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.18.2-18.2
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    • 2010
  • For the past a few years, we have intensively researched the printable inorganic conductors and ZnO-based amorphous oxide semiconductors (AOSs) for thin-film transistors. For printable conductor materials, we have focused on the aqueous Ag and Cu ink which possess a variety of advantages, comparing with the conventional metal inks based on organic solvent system. The aqueous Ag ink was designed to achieve the long-term dispersion stability using a specific polymer which can act as a dispersant and capping agent, and the aqueous Cu ink was carefully formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. For printable ZnO-based AOSs, we have researched the noble way to resolve the critical problem, a high processing-temperature above $400^{\circ}C$, and recently discovered that Ga doping in ZnO-based AOSs promotes the formation of oxide lattice structures with oxygen vacancies at low annealing-temperatures, which is essential for acceptable thin-film transistor performance. The mobility dependence on annealing temperature and AOS composition was analyzed, and the chemical role of Ga are clarified, as are requirements for solution-processed, low-temperature annealed AOSs.

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The Type Printing of First Ch'ing Dynasty Term (청대 전기의 활자인쇄)

  • Cho Hyung-Jin
    • Journal of the Korean Society for Library and Information Science
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    • v.29
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    • pp.345-382
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    • 1995
  • The type printing of first Ch'ing dynasty term in China is worthy to be studied because the type printing during that period included metal type, wood type, and clay type as well as the development phase was similar to Chosun dynasty culturally and technologically. This paper studied typography during the first Ch'ing dynasty term, including Shunzhi(1662-1722), Yongaheng(1723-1735), Qianlong(1736-1795), Jiaqing(1796­1820) period. The main results of the study is as follows. 1. The main body of type printing was bookstore, lecture-hall, and individual as well as the royal court that is the central government. 2. The content of type edition covers classics, history, philosophy, and literary works. Specifically, even though Wuyingdienjuzhenban series is excluded, the content includs study of the classics, class of the history, class of the philosophy, literature works that include collection works and novel and government official bulletin. 3. The printing technique of bronze type was very popular In Beijing. Jiangsu, and Taiwan. It's scale and production technique was more elaborate than in Ming dynasty. 4. Wood type was very popular in Beijing, Jiangsu, Zhejiang, Anhui, Sichuan, and Fujian. In addition to wood type, chinese ware type was applied to book printing in Shandong. However, most of them were wood type and they were used after Qianlong period. 5. The production technique of type was skilled enough to present the fine view of a style of type. The typesetting technique was improved as much as woodblock printing. With regard to the making technology of Chinese ink, the light and darkness of chinese ink was not even sometimes. But, the technology was improved significantly when comparing with the failure experience of printing that chinese ink was not developed in early type invention. 6. In case that the book was printed in bookstore with the intention of profit and the number of book was large, the proofreading attitude was rough. However, overally, it was made correction carefully applying the various methods of proofreading. 7. The support of government made a great contribution in the area of all printing technology, including production, typesetting, and brushing of type.

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Preperation of CuInSe2 Nanoparticles by Solution Process Using Precyrsors

  • Choe, Ha-Na;Lee, Seon-Suk;Jeong, Taek-Mo;Kim, Chang-Gyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.376-376
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    • 2011
  • I-III-VI2 chalcopyrite compounds, particularly copper, indium, gallium selenide(Cu(InxGa1-x)Se2, CIGS), are effective light-absorbing materials in thin-film solar application. They are direct band-gap semiconductors with correspondingly high optical absorption coefficients. Also they are stable under long-term excitation. CIS (CIGS) solar cell reached conversion efficiencies as high as 19.5%. Several methods to prepare CIS (CIGS) absorber films have been reported, such as co-evaporation, sputtering, selenization, and electrodeposition. Until now, co-evaporation is the most successful technique for the preparation of CIS (CIGS) in terms of solar efficiency, but it seems difficult to scale up. CIS solar cells have been hindered by high costs associated with a fabrication process. Therefore, inorganic colloidal ink suitable for a scalable coating process could be a key step in the development of low-cost solar cells. Here, we will present the preparation of CIS photo absorption layer by a solution process using novel metal precursors. Chalcopyrite copper indium diselenide (CuInSe2) nanocrystals ranging from 5 to 20nm in diameter were synthesized by arrested precipitation in solution. For the fabrication of CIS photo absorption layer, the CuInSe2 colloidal ink was prepared by dispersing in organic solvent and used to drop-casting on molybdenum substrate. We have characterized the nanoparticless and CIS layer by XRD, SEM, TEM, and ICP.

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Fabrication of the Micro Nozzle Arrays on a Stainless Steel Sheet Metal by Using Combined Micro Press and Surface Finishing Process (복합공정을 이용한 스테인레스 박판 마이크로 노즐 어레이 제작)

  • Park S.J.;Yoo Y.S.;Jang H.S.;Kim Y.T.;Kim S.Y.;Lee S.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1294-1298
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    • 2005
  • In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

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Effect of Cutting Fluid on the Metal-Cutting Mechanism (절삭유제가 금속절삭기구에 미치는 영향에 관한 연구)

  • Seo, Nam-Seob
    • Journal of the Korean Society for Precision Engineering
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    • v.2 no.2
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    • pp.69-75
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    • 1985
  • The object of this study is to discuss the effect of cutting fluid on the mechanism of chip formation in orthogonal cutting. Rehbinder effect has been known as a phenomenon, the reduction of mechanical strength, when the metal is exposed in a polar organic environment or the surface of metal is coated with some polar organic substances. About the cause of Rehbinder effect there have been many different ideas by Rehbinder, Merchant, Shaw, Sakakida and etc. In this report, the effects of surface active medium (magic ink) upon the mechanism of chip formation on the orthogonal cutting of copper and the mechanical properties of the work material are experimentally discussed with constant rake angle. Under the condition of polar organic environment the experimental results are as follows; 1) The chip thickness becomes thinner and slip line pitch on the free surface of chip becomes smaller than that of dried cutting area. 2) The order of alternation of cutting ratio was changed. 3) The friction angle on the tool face is not affected by the depth of cut. 4) The cutting force and shear strain on the shear plane decrease remarkably, therefore the work material must be embrittled under polar organic environment.

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Scientific Analysis on the Accessory Ornament of Woolen Tapestry Curtain in Seoul Museum of Craft Art

  • Choi, Jaewan;Lee, Jangjon;An, Boyeon
    • Journal of Conservation Science
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    • v.37 no.4
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    • pp.402-410
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    • 2021
  • Woolen tapestry curtains possessed by the Seoul Museum of Craft Art were used to hung on the wall or used for carpets in the winter season in the late Joseon dynasty. Since similar artifacts were only used for the curtain as functional aspects, woolen tapestry curtains were a rare case. In this study, scientific analysis on the accessory ornament of woolen tapestry curtains such as components of metal accessories and frame bar were conducted with the microscope, p-XRF, and SEM. Result of frame bar pigments, organic pigments such as ink stick were likely been used in woolen tapestry curtain 1. In woolen tapestry 2, lead red (Minium) was used in the frame bar. The result of metal parts, copper, and zinc were analyzed by p-XRF. This suggests that metal accessories were crafted using brass. Frame bar of woolen tapestry curtain 2 was made of soft pine (Pinus spp.) analyzed with the scanning electron microscope. Artifacts like woolen tapestry curtains are rare in Korea and scientific analysis databases were scarce, so it is important to construct components analysis data of woolen tapestry curtains. It is expected that additional scientific analysis and interpretation on the artifact's crafting technique can be merged with the analytical data gathered in this study to be utilized on the conservation and restoration of not only woolen curtains but curtain artifacts of the late Joseon dynasty in general.

Determination of Heavy Metal Contents in Various Packaging Boards (지류 포장재 종류에 따른 중금속 함량 측정)

  • Kim, Jin-Woo;Seo, Joo-Hwan;Youn, Hye-Jung;Lee, Hak-Lae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.41 no.2
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    • pp.55-63
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    • 2009
  • This study was performed to evaluate the heavy metal contents in various packaging board. Domestic and foreign OCC (old corrugated containers) and old duplex boards were used as raw materials. Tests were made for the printed and unprinted parts of the sample. Heavy metal contents of old food packaging boards made from virgin pulp fibers were also evaluated. The contents of heavy metals including lead (Pb), cadmium (Cd), barium (Ba), arsenic (As), antimony (Sb), selenium (Se), and mercury (Hg) were determined using ICP-AES (Inductively Coupled Plasma - Atomic Emission Spectrometer), and CV-AAS (Cold vapor-atomic absorption spectrometer) after digesting the samples in a microwave oven. The contents of heavy metals contained in domestic packaging board were higher than those in overseas samples, and OCC showed higher contents of heavy metals than old duplex boards. Printed parts gave greater heavy metal contents than unprinted parts. Results indicate that recycling of paper and paperboard products increases the heavy metal contamination of the paper packaging products and this derives mostly from the heavy metals contained in printing inks. Recycling processes that decrease heavy metals in recycled fibers and new printing inks that contains less heavy metals should be developed to solve the problem associated with the heavy metals in packaging paper products.

Improving Conductivity of Metal Grids by Controlling Sintering Process (배선 함몰 전극의 배선 소결공정 최적화에 따른 전기적 특성 향상)

  • Ahn, Wonmin;Jung, Sunghoon;Kim, Do-Geun
    • Journal of the Korean institute of surface engineering
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    • v.48 no.4
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    • pp.158-162
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    • 2015
  • To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

Hydrogen and Ethanol Gas Sensing Properties of Mesoporous P-Type CuO

  • Choi, Yun-Hyuk;Han, Hyun-Soo;Shin, Sun;Shin, Seong-Sik;Hong, Kug-Sun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.222-222
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    • 2012
  • Metal oxide gas sensors based on semiconductor type have attracted a great deal of attention due to their low cost, flexible production and simple usability. However, most works have been focused on n-type oxides, while the characteristics of p-type oxide gas sensors have been barely studied. An investigation on p-type oxides is very important in that the use of them makes possible the novel sensors such as p-n diode and tandem devices. Monoclinic cupric oxide (CuO) is p-type semiconductor with narrow band gap (~1.2 eV). This is composed of abundant, nontoxic elements on earth, and thus low-cost, environment-friendly devices can be realized. However, gas sensing properties of neat CuO were rarely explored and the mechanism still remains unclear. In this work, the neat CuO layers with highly ordered mesoporous structures were prepared by a template-free, one-pot solution-based method using novel ink solutions, formulated with copper formate tetrahydrate, hexylamine and ethyl cellulose. The shear viscosity of the formulated solutions was 5.79 Pa s at a shear rate of 1 s-1. The solutions were coated on SiO2/Si substrates by spin-coating (ink) and calcined for 1 h at the temperature of $200{\sim}600^{\circ}C$ in air. The surface and cross-sectional morphologies of the formed CuO layers were observed by a focused ion beam scanning electron microscopy (FIB-SEM) and porosity was determined by image analysis using simple computer-programming. XRD analysis showed phase evolutions of the layers, depending on the calcination temperature, and thermal decompositions of the neat precursor and the formulated ink were investigated by TGA and DSC. As a result, the formation of the porous structures was attributed to the vaporization of ethyl cellulose contained in the solutions. Mesoporous CuO, formed with the ink solution, consisted of grains and pores with nano-meter size. All of them were strongly dependent on calcination temperature. Sensing properties toward H2 and C2H5OH gases were examined as a function of operating temperature. High and fast responses toward H2 and C2H5OH gases were discussed in terms of crystallinity, nonstoichiometry and morphological factors such as porosity, grain size and surface-to-volume ratio. To our knowledge, the responses toward H2 and C2H5OH gases of these CuO gas sensors are comparable to previously reported values.

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For High Aspect Ratio of Conductive Line by Using Alignment System in Micro Patterning of Inkjet Industry (화상정렬 시스템을 이용한 잉크젯 반복인쇄기술)

  • Park, Jae-Chan;Park, Sung-Jun;Seo, Shang-Hoon;Joung, Jae-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.154-154
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    • 2006
  • Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.

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