• 제목/요약/키워드: metal compound

검색결과 530건 처리시간 0.026초

크린치와셔 F/B금형 설계 및 제작에 관한 연구 (A study on the design and manufacture of fine blanking die for the clinch washers)

  • 김세환;최계광
    • Design & Manufacturing
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    • 제6권2호
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    • pp.37-41
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    • 2012
  • Usually compound dies are used in clinch washer production. However, in this study, a fine blanking die is designed and manufactured, and clinch washers are produced by the die. Clinch washers are for electric exhaust gas recirculation (EEGR) and they recirculate some of exhaust gas to reduce harmful substances. Fine blanking automation production eliminates difficulties operators face on conventional press.

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Half-metallic and Magnetic Properties of (001) Surfaces of KCaN2 Compound in full-Heusler Structure

  • Bialek, Beata;Lee, Jae Il
    • Journal of Magnetics
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    • 제18권4호
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    • pp.375-379
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    • 2013
  • The electronic and the magnetic properties of (001) surface of $KCaN_2$ half-metallic compound with full-Heusler structure are studied with the use of a full-potential linearized augmented plane wave method. Two possible terminations of the surface are considered and only the one with N atoms in the topmost layer is found to retain the half-metallic properties of the bulk. The magnetic properties of N-terminated surface are enhanced compared with the properties of the bulk. The calculated magnetic moments on the N atoms in the $KCaN_2$ are 1.26 ${\mu}_B$ in the bulk and 1.90 ${\mu}_B$ at the surface. The subsurface metal atoms are also slightly polarized. In the surface terminated with metal atoms, not only the half-metallicity is destroyed, but also the magnetic properties of the system are weakened.

Spin Exchange Coupling in Dimethoxo-Bridged Dichromium(III) Complexes: A Density Functional Theory Study

  • Kang, Dae-Bok
    • Bulletin of the Korean Chemical Society
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    • 제29권5호
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    • pp.963-968
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    • 2008
  • For the [$Cr_2(H_2tmp)_2Cl_4$] compound, simplified models with two bridging methoxo ligands have been studied. The influence of the bridging Cr-O-Cr bond angles on the exchange coupling between metal atoms in the model compound has been analyzed by means of density functional calculations with the broken-symmetry approach. Coupling constant calculated for the full structure is in good agreement with the experimentally reported value, confirming the validity of the computational strategy used in this work to predict the exchange coupling in a family of related dinuclear Cr(III) compounds. The calculations indicate a good correlation between the calculated coupling constant and the sum of the squared energy gap of three pairs of metal $t_{2g}$ OMSOs with a limited variation of the Cr-O-Cr angle. The spin density distribution and the mechanism of magnetic coupling interactions are discussed.

인듐 솔더의 젖음특성 (The Wetting Property of Indium Solder)

  • 김대곤;이창배;정승부
    • Journal of Welding and Joining
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    • 제20권5호
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    • pp.106-112
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    • 2002
  • In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

최신의 고능률 브레이징 기술개발 동향 (Recent Study of Technical Development for High Efficient Brazing)

  • 유호천
    • Journal of Welding and Joining
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    • 제34권2호
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    • pp.36-45
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    • 2016
  • Recent developing tendency for technologies of high efficient brazing are studied by searching of NDSL, Science Direct, KIPRIS, PCT and so on. Active metal brazing, arc brazing, fluxless brazing, brazing with low melting point, reactive air brazing, laser brazing, laser droplet brazing are investigated. By optimal selecting of the above mentioned technologies, it needs to investigate an economical metallurgical design and the advanced brazing methods. To improve the embrittlement of intermetallic compound at brazing interface, it must be studied the inexpensive variant metals including nonmetals and the heat sources(MIG, TIG, Laser) by hybrid techniques.

STUDY OF MAGNETISM IN THE LAYERED TRANSITION METAL COMPOUND ${(C_{n}H_{2n+1}NH_{3})}_{2}CuCl_{4}\;(n=10,\;14)$

  • Lee, C.H.;Lee, K.W.;Lee, Cheol-Eui;Kang, J.K.
    • 한국자기학회지
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    • 제5권5호
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    • pp.358-361
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    • 1995
  • We have investigated the quasi-two-dimensional magnetism for the layered transition metal compound (C/sub n/H/sub 2n+1/NH/sub 3/)/sub 2/CuCl/sub 4/ (n=10, 14) in the high temperature regions by means of EPR (Electron Paramagnetic Resonance) and SQUID measurements. As a result, the magnetic transitions were reflected in the EPR linewidths and the magnetic suceptibilities in a sensitive manner. Fluctuations of the magnetic susceptibility and a similar variation of the .DELTA. g =(g/sub .parallel. -/g/sub .perp. /)g/sub .parallel. / value were also observed around the structural phase transition temperatures.

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Irregular Failures at Metal/polymer Interfaces

  • Lee, Ho-Young
    • 한국표면공학회지
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    • 제36권4호
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    • pp.347-355
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    • 2003
  • Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

이온질화 에 있어서 첨가탄소량 이 경도 및 마모특성 에 주는 영향 (The Added Carbon Content Effect on the Hardness And Wear Characteristics in Ion-Nitriding)

  • 김희송
    • 대한기계학회논문집
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    • 제7권1호
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    • pp.19-27
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    • 1983
  • This paper deals with hardness and wear characteristics of ion-nitrided metal, and with ion-nitride processing which is concerned with the effects of added carbon content in gas atmosphere. A small optimal amount of carbon content in gas atmosphere increase compound layer thickness, as well as to increase diffusion layer thickness and hardness, and reduces wear rate when the applied wear load is small. It is found in the analysis that under small applied wear load, the critical depth where voids and cracks may be created and propagated is located at the compound layer, so that the abrasive wear where hardness is an important factor, is created and the existence of compound layer reduces the amount of wear. When the load becomes large, the critical depth is located below nucleation and propagation, is created and the existence of compound layer increase wear rate.

The Role of Oxygen for Expressing Superconductivity in La-Ca-Cu-O Compounds

  • 정동운
    • Bulletin of the Korean Chemical Society
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    • 제20권3호
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    • pp.281-284
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    • 1999
  • Two La1.82Ca1.18Cu2O6+δ (2126) compounds exhibited different properties depending upon how they were synthesized. The compound prepared under high oxygen pressure showed superconductivity. But the compound prepared under low oxygen pressure did not exhibit superconductivity, and showed a metal-insulator transition. Our study on these compounds shows that a small amount of additional oxygen intercalated into the superconducting phase plays an important role for superconductivity. The Fermi surface of non-superconducting 2126 compound possesses nesting phenomena, which is the reason for the M-1 transition. On the other hand, the superconducting 2126 compound does not show Fermi surface nesting. This is because the additional oxygen removes some electrons from Cu d-orbitals, thereby bradking the Fermi surface nesting.

Angle-sensitive Pixels Based on Subwavelength Compound Gratings

  • Meng, Yunlong;Hu, Xuemei;Yang, Cheng;Shen, Xinyu;Cao, Xueyun;Lin, Lankun;Yan, Feng;Yue, Tao
    • Current Optics and Photonics
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    • 제6권4호
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    • pp.359-366
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    • 2022
  • In this paper, we present a new design for angle-sensitive pixels (ASPs). The proposed ASPs take advantage of subwavelength compound gratings to capture the light angle, which enables pixel size to reach the wavelength scale of 0.7 ㎛ × 0.7 ㎛. The subwavelength compound gratings are implemented by the wires of the readout circuit inherent to the standard complementary metal-oxide-semiconductor manufacturing process, thus avoiding additional off-chip optics or post-processing. This technique allows the use of two pixels for horizontal or vertical angle detection, and can determine the light's angle in the range from -45° to +45°. The proposed sensor enables surface-profile reconstruction of microscale samples using a lensless imaging system.