• KOREAN JOURNAL OF CROP SCIENCE
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• v.51 no.2
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• pp.154-162
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• 2006

Cheese analogs using lipoxygenase-defected soymilk and ${\alpha}$-chymotrypsin modified soy protein isolate (SPI) were prepared. Color, textural properties, sensory attributes and melting spreadability of cheese analogs were evaluated and compared with mozzarella cheese, and relationships between textural properties, sensory attributes and melting spreadability of cheese analogs were analyzed. Off-flavors were not mostly discriminated. Cheese analogs containing 10% SPI untreated and containing 6% and 8% SPI treated by ${\alpha}$-chymotrypsin in ${\Delta}E$ value of color were the most similar to mozzarella cheese. Quality characteristics and melting spreadability of cheese analogs were highly affected and improved by ${\alpha}$-chymotrypsin modification. Sensory attributes and melting spreadability of cheese analogs containing 6% SPI treated by ${\alpha}$-chymotrypsin were the most similar to mozzarella cheese, while in textural properties, cheese analogs containing 10% SPI were the most similar with mozzarella cheese. Hardness in sensory attributes was highly positively correlated with hardness (r>0.65), adhesiveness (r>0.56), chewiness (r>0.77) and gumminess (r>0.76) in textural properties, while it was highly negatively correlated with melting spreadability (r>-0.68).

• Journal of Welding and Joining
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• v.23 no.6
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• pp.93-98
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• 2005

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of the Korean Society of Food Science and Nutrition
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• v.32 no.8
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• pp.1253-1261
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• 2003

This study was carried out to investigate the influences of hydrocolloids on suppression of retrogradation in the Korean rice cake. Hydrocolloids were influenced to the textural characteristics of the Korean rice cake. In particular arabic gum and carrageenan had the effect of suppressing the retrogradation. Cohesiveness of the Korean rice cake added with hydrocolloids was shown to be high compared to control in organoleptic characteristics. Hydrocolloids exhibited slightly effective in retarding surface color change of the Korean rice cake. Onset temperature of gelatinization in thermal characteristics showed somewhat low in case of addition of arabic gum into the Korean rice cake and was followed by carrageenan, guar gum, gelatin and locust bean gum in onset temperature of gelatinization order. All samples added with hydrocolloids had low values in change of melting enthalphy and their range was 12.8 ∼ 17.7 J/g. The Korean rice cake added with arabic gum was lowest in melting enthalphy. The recrystallinity of the Korean rice cake added with arabic gum was greatly low compared to rice cake without hydrocolloids. Melting spreadability of the Korean rice cake added with arabic gum or carrageenan was superior in thermal characteristics. The value of exponent of Avrami was 0.97 ∼ 1.12 in study of Avrami equation. In conclusion carrageenan and arabic gum would have a suppressive effect of retrogradation in the Korean rice cake.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.123-128
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• 2018

Effect of activators in flux on the printability and wettability of a solder paste was evaluated in this study. The activators in this study were dicarboxylic acids, which were oxalic acid (n = 0), malonic acid (n = 1), succinic acid (n = 2), glutaric acid (n = 3), adipic acid (n = 4), and pimelic acid (n = 5). When the solder pastes were observed with a SMT scope, solder with glutaric acid showed clean and shiny surface when it was melted. Slump ratio of the solder pastes was low when the carbon numbers of the dicarboxylic acid were 1-3. Spreadability was high when the carbon number was over 2. Zero cross time of wetting balance test was under 1 sec when the carbon number was over 3. When activator was oxalic acid or malonic acid, zero cross time was over 1 sec and maximum wetting force was low. Fluxes with the oxalic acid and malonic acid showed decomposition at the temperature close to melting point. Among the dicarboxylic acids, glutaric acid provided excellent slump, spreadability, and wettability.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• The Korean Journal of Food And Nutrition
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• v.19 no.3
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• pp.279-287
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• 2006

This study was carried out to investigate the influences of modified starches on suppression of retrogradation in Korean rice cake for their optimization, Garaeduk. Based upon studying Avrami equation, the Avrami exponent n value of all the experiment samples was found to be 1.03 ${\sim}$ 1.37 in the influence of modified starches on retrogradation of the rice cake. This means that the retrogradation of the Korean rice cake occurred instantly after the crystallization of starch particles in the Korean rice cake formulated by modified starches. The highest Avrami exponent n value was indicated in the control sample. The rate constant k of retrogradation in the Korean rice cake formulated by modified starches showed comparatively low and appeared to be the lowest in the Korean rice cake formulated by SHPP. This tendency was shown well in the time constant(1/k) of retrogradation velocity. According to the DSC analysis, the onset temperature of gelatinization in thermal characteristics showed somewhat high in case of addition of modified starch into the Korean rice cake on storage time and the SHPP was slowly gone up. In peak temperature of gelatinization in thermal characteristics of the DSC analysis, SSOS and ASA were increased a little in comparison with the control. The control was comparatively high increase. Melting enthalphy of all samples added with modified starches (SSOS: 21.1${\rightarrow}$23.7${\rightarrow}$24.1, ASA: 21.1${\rightarrow}$24.8${\rightarrow}$25.4) appeared to be lower than that of the Korean rice cake without modified starches(21.2${\rightarrow}$26.1${\rightarrow}$27.1). The Korean rice cake added with SHPP was shown to be the lowest in the increasing rate of melting enthalpy(20.9${\rightarrow}$21.4${\rightarrow}$22.1). Heat spreadability of all the samples in Martin melting diameter was revealed to be good in order of control, ASA, SSOS, SHPP and especially the Korean rice cake added with SHPP was shown to be the best in heat spreadability. In color, sensory examination and textural characteristic of the Korean rice cake added with modified starches, the L$^*$value was not changed practically with the storage time and seemed to be stable. The a$^*$ value of the samples was followed by control(2.21${\rightarrow}$5.34: 141.6%), ASA (2.01${\rightarrow}$4.22: 110.0%), SSOS (2.78${\rightarrow}$4.87: 75.2%) and SHPP (2.12${\rightarrow}$3.40: 60.4%) in order of color change. Also the b$^*$ value of the samples was followed by control(4.32${\rightarrow}$6.35: 47.0%), ASA (4.66${\rightarrow}$5.73: 23.0%), SSOS (4.90${\rightarrow}$5.89: 20.2%) and SHPP (4.89${\rightarrow}$5.12: 4.7%) and there was the least (or no) color change with the SHPP. Textural characteristics of samples was shown to be the highest in case of modified starch addition and especially SHPP appeared to be the best in texture.

• The Korean Journal of Food And Nutrition
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• v.17 no.3
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• pp.246-253
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• 2004

This study was carried out to examine softening stability, exponent of Avrami equation, color change, sensory characteristcs during storage when hydrocolloid was added to the sea tangle paste treated with acetic acid and heat treatment. Rate constant of solidification showed the least value of 0.05 in Avrami equation. In addition hardness of the softened sea tangle paste was not changed after two days of storage in case of carrageenan. Rate of hardness in the softened sea tangle paste formulated with carrageenan exhibited the lowest value of 0.28 kg/mm/day. Heat melting spreadability of the softened sea tangle paste showed the highest value in case of carrageenan and its fluid behavior was rheopectic. Viscosity change in the sea tangle paste formulated with carrageenan was the least during storage and its significant difference at the level of p < 0.05 was exhibited. Change of L, a and b value of softened sea tangle formulated with carrageenan during storage was significantly different at level of p<0.05. Color preference, odor, cohesiveness, softerness, process compatibility and overall acceptance of softened sea tangle were revealed to be in best when carrageenan was added. When hydrocolloid was added to the softened sea tangle paste, it showed the positive result in quality and storage stability of softened sea tangle paste. It was extremely effective on softening stability when carrageenan was added to the softened sea tangle paste.

• Korean Journal of Food Science and Technology
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• v.35 no.5
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• pp.905-913
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• 2003

The physicochemical properties of rice flour roasted at various temperatures and times were analyzed, and the quality characteristics of tarakjuk made from these roasted rice flours were investigated. As roasting temperature and time increased, rice flour showed decreasing moisture, protein content, and glucose the major reducing sugar of rice flour. Total amino acid content did not show any significant changes, but the amount of free amino acids and individual amino acids, such as lysine, tryptophane, and tyrosine, decreased. A decrease in L value and increases in a and b values from both roasted rice flour and tarakjuk was observed. Reduced crystallinity and gelatinization temperatures of roasted rice flour were investigated with X-ray diffractogram and DSC, respectively. The thermal transitions between $100.6{\sim}127.6^{\circ}C$ of tarakjuk by DSC are considered to be due to the melting of amylose-lipid complex. As the roasting temperature and time of rice flours increased, tarakjuk showed lower viscosity and higher spreadability. Sensory characteristics, such as nutty flavor, color intensity, and gritty texture increased significantly. Tarakjuk made from rice flour roasted at $185^{\circ}C$ for 25min showed the highest score on overall preference. From the above results, roasted rice flour produced more preferable tarakjuk than nonroasted flour in terms of sensory quality.