• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.1 s.38
• /
• pp.63-72
• /
• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Korean Journal of Metals and Materials
• /
• v.46 no.2
• /
• pp.80-87
• /
• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.2 s.43
• /
• pp.23-33
• /
• 2007

The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established. The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.23 no.12
• /
• pp.1045-1055
• /
• 2013

It is true that the dependency on import is currently high in case of the safety checkup system of domestic airplanes, and it is at the point of time that localization of HUMS for small airplanes is required. In this study, the design factors were selected for the lightweight of HUMS for small airplanes by using Pro-Engineer which is a design tool and Abaqus. 9 models were made through experiment plans with Taguchi method for this, and the each model for weight lightening was selected through vibration analysis and shock analysis while in operation with experiment profile values. After fabricating HUMS, it was verified that as a result of experiment with the same profile values as the analysis, there was similarity between the analyzed values and values of the experiment. As a result of performing weight lightening which is the purpose of the study, electronic performance for small airplanes is assured and a design plan reducing 15 % weight compared to the targeted weight was deduced. Besides, it could be verified that the light weight model satisfied the maximum allowable displacement value of PCB[printed circuit board] and accordingly satisfied electronic properties of HUMS. In this study, the reliability of a product was certified through the result of an experiment on ground. If the reliability of HUMS were verified through a test flight in the future, it is considered that it would make a big contribution to localization of aerospace electronic equipment.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.15 no.6
• /
• pp.3416-3422
• /
• 2014

A shock absorber rod is located in the center of the absorber piston and is responsible for the reciprocating movement portion. If it has surface defects, the damping performance of product will be adversely affected. A rod surface has gloss by heat treatment. Therefore, it is difficult to find a defect, such as dust, imprints, and blowholes. Because a total inspection is achieved by visual inspection by workers, it causes eyestrain and the quality of the product is not constant. In this paper, a machine vision system was developed to find a defect using a line-scan camera. The machine can detect surface defects than 0.3mm. To minimize the occurrence probability of defects on the inspection process, the developed auto inspection system had an automatic feeding system and incorporated a protection system. Through the development of this system, which relies on the operator's visual inspection of the surface of the shock absorber, the Rod inspection system constructed quality inspection standards and standardized tests to ensure improved reliability.

• Journal of Power System Engineering
• /
• v.20 no.4
• /
• pp.5-11
• /
• 2016

This study analyzed the damage to a slitting knife after cutting steel sheets. Damages to the structure were observed and wear tests were conducted. In addition, the degradation on the damaged and undamaged parts was compared with a micro Vickers hardness test. Weibull statistical analysis was carried out in order to evaluate the reliability of the micro Vickers hardness measured data. Spalling of the edge portion occurred by degradation during use over a long period. Rough parts in the specimens were caused by damage because the slitting knife was used for 1 year. The friction coefficient and wear loss at the damaged parts of the knife edge were slightly larger from shock due to repetitive cutting operation. The micro Vickers hardness followed a two-parameter Weibull probability distribution.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.24 no.1
• /
• pp.87-93
• /
• 2015

The dynamic responses of a telescope loaded on an STSAT-3 satellite were analyzed, and environmental tests were conducted to verify the reliability of the design. The space use telescope COMIS (compact imaging spectrometer) is a major payload of the STSAT-3 launched on November 21, 2013. Vibration responses such as the acceleration, displacement, and velocity with respect to random vibration and shock impulse inputs were obtained based on theoretical fundamentals in conjunction with finite element analysis. The main focus of this study was on developing technology for accurate and/or favorable modeling and analysis of the structure and fitting the results to that of experiments. Cutting-edge technology for manipulating the vibrations of a space use telescope is suggested.

• Proceedings of the KSME Conference
• /
• 2001.06a
• /
• pp.788-793
• /
• 2001

Finite element analysis was carried out to investigate the integrity and reliability of boiler module during sea transportation. The boiler module was supported by steel structure to relieve the instantaneous shock from oceanic wave and its primary parts were strengthened with several reinforcements. Finned tube walls which were used in the furnace wall were assumed as orthotropic plates having equivalent material properties. The bank tubes were also equivalently modeled in accordance with ASME B31.1 for the convenience of finite element modeling. The calculation results were compared with the yield stress of the material. In particular, the bank tube stress, which was evaluated by converting the calculated stresses in equivalent tubes into those in original tubes by using the ratio of diameter, was also examined with yield stress.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.2
• /
• pp.140-145
• /
• 2001

The tape carrier package(TCD) is one of the most important components in a liquid crystal display(LCD) module. It has a role to transmit electrical signals from a printed circular board(PCB) to a display panel. If TCP is damaged under mechanical shock, the signals can not be transmitted to the panel and as a result, some dead lines are generated on the panel. This kind of phenomenon is commonly called as 'line defects'. In this paper, new structural design concepts of TCP are proposed to guarantee its reliability by using Taguchi's approach and dynamic FE-analysis. The line defects problem of TCP module is solved by replacing the original TCP with the newly designed one.

• Current Optics and Photonics
• /
• v.5 no.2
• /
• pp.121-128
• /
• 2021

We propose a novel, tiny optical receiver engine utilizing an all-in-one package based on embedded optics technology. The package's best transmission S21 and reflection S22 opto-electric (OE) bandwidths are 49.8 GHz and 34.9 GHz, respectively, and the reflectance of the optical engine is below -31.7 dB for all channels. The engine satisfies the MIL-STD-883G standard for reliability tests, such as mechanical and thermal shock, and vibration resistance. The sensitivity after 10 km single-mode fiber (SMF) transmission is below -8 dBm. The optical receiver engine is cost-competitive and applicable for 400G coarse wavelength division multiplexing 4 (CWDM4) 10 km optical transceivers.